Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

This work describes the work of an investigation of the effects of solder reflow process on the reliability of anisotropic conductive film (ACF) interconnection for flip-chip on flex (FCOF) applications. Experiments as well as computer modeling methods have been used. The results show that the contact resistance of ACF interconnections increases after the reflow and the magnitude of the increase is strongly correlated to the peak reflow temperature. In fact, nearly 40 percent of the joints are open when the peak reflow temperature is 260°C, while there is no opening when the peak temperature is 210°C. It is believed that the coefficient of thermal expansion (CTE) mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a three-dimensional (3-D) finite element (FE) model of an ACF joint has been analyzed in order to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process. The stress level at the interface between the particle and its surrounding materials is significant and it is the highest at the interface between the particle and the adhesive matrix.

Computational modelling for reliable flip-chip packaging at sub-100 micron pitch using isotropic conductive adhesives

This paper presents the assembly process using next generation electroformed stencils and Isotropic Conductive Adhesives (ICAs) as interconnection material. The utilisation of ICAs in flip-chip assembly process is investigated as an alternative to the lead and lead-free solder alloys and aims to ensure a low temperature (T < 100 °C) assembly process. The paper emphasizes and discusses in details the assembly of a flip-chip package based on copper columns bumped die and substrate with stencil printed ICA deposits at sub-100 μm pitch. A computational modelling approach is undertaken to provide comprehensive results on reliability trends of ICA joints subject to thermal cycling of the flip-chip assembly based on easy to use damage criteria and damage evaluation. Important design parameters in the package are selected and investigated using numerical modelling techniques to provide knowledge and understanding of their impact on the thermo-mechanical behaviour of the flip-chip ICA joints. Sensitivity analysis of the damage in the adhesive material is also carried out. Optimal design rules for enhanced performance and improved thermo-mechanical reliability of ICA assembled flip-chip packages are finally formulated.

Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices

With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around computational fluid dynamics, finite element analysis and optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.

Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives

Slippage due to wall depletion effect is well-known in rheological investigation. The aim of this study was to investigate the influence of the paste microstructure on slip formation for the paste materials (lead-free solder paste and isotropic conductive adhesives). The effect of different flowgeometries, gap heights and surface roughness on the paste viscosity was investigated. The utilisation of different measuring geometries has not clearly showed the presence of wall-slip in the paste samples. The existence of wall-slip was found to be pronounced when gap heights were varied using the parallel plate geometry. It was also found that altering the surface roughness of the parallel plate measuring geometry did not significantly eliminate wall-slip as expected. But results indicate that the use of a relatively rough surface helps to increase paste adhesion to the plates and to a certain extent inducing structural breakdown in the paste. Most importantly, the study also demonstrated on how the wall-slip formation in the paste material could be utilised for understanding of the paste microstructure and its flow behaviour.

Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives

Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. The wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry.These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. The wall slip effect can play an important role in ensure successfulpaste release after the printing process. Wall-slip plays animportant role in characterising the flow behaviour of solderpastes and isotropic conductive adhesives. The study investigates the wall-slip formation in solder paste andisotropic conductive adhesives using flow visualisation technique. The slip distance was measured for parallel plate with different surface roughness in order to quantify the wallslip formations in these paste materials. An ink marker line was drawn between the parallel plate and the free surface of the sample. The parallel was rotated slowly at a constant shear rate of 0.05 sec-1 and the displacement of the ink marker was observed using a video microscope and image capturing software was utilised to capture the displacement of ink marker. From this study, it was found that the wall-slip effect was evident in all the paste materials. In addition, the different surface roughness of the parallel plates did not prevent the formation of wall-slip. This study has revealed that the wallslip effect could used to understand the flow behaviour of the paste in the stencil printing process.

Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly

Solder pastes and isotropic conductive adhesives (ICAs) are widely used as a principal bonding medium in the electronic industry. This study investigates the rheological behaviour of the pastes (solder paste and isotropic conductive adhesives) used for flip-chip assembly. Oscillatory stress sweep test are performed to evaluate solid characteristic and cohesiveness of the lead-free solder pastes and isotropic conductive adhesive paste materials. The results show that the G' (storage modulus) is higher than G '' (loss modulus) for the pastes material indicating a solid like behaviour. It result shows that the linear visco-elastic region for the pastes lies in a very small stress range, below 10 Pa. in addition, the stress at which the value of storage modulus is equal to that of loss modulus can be used as an indicator of the paste cohesiveness. The measured cross-over stress at G'=G '' shows that the solder paste has higher stress at G'=G '' compared to conductive adhesives. Creep-recovery test method is used to study the slump behaviour in the paste materials. The conductive adhesive paste shows a good recovery when compared to the solder pastes. (C) 2008 Elsevier B.V. All rights reserved.

Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly

The printing of pastes (solder pastes and isotropic conductive adhesives) through very small stencil apertures required for flip-chip pitch sizes is expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit board pads. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on printing performance.

Comparison of tack of pressure-sensitive adhesives (PSAs) at different temperatures

Pressure-sensitive adhesives (PSAs) have applications in the fields of packaging, joining, wound care, and personal care. Depending on the application of the PSA, different performance tests are carried out when new products are developed or the quality of the existing products is checked. Tack is the property of an adhesive that enables it to form instant bond on the surface under light pressure. The tack of a PSA strongly depends on the way the bond is created. Parameters such as the bonded area, contact time and the nature of tack materials all affect the tack force measured. In the development of any PSA, it is desirable to correlate the performance related properties such as tack and peel strength to the rheological behaviour. Finding these correlations would make it possible to evaluate the performance of a PSA using its rheological characteristics. In this investigation we have studied the influence of rheological behaviour of three different PSAs on their tackiness. The three different PSAs used in this study are a low molecular weight rosin ester, high molecular weight rosin ester, and dicyclopentadiene. Various rheological properties such as viscosity, phase angle, and elastic and viscous moduli are measured versus the frequency and temperature. Also the tack properties at various removal speeds and temperatures are evaluated. Analysis of the results indicates different performances of the three PSAs which could be related to their rheological properties, especially the phase angle, at different frequencies and temperatures. The PSA with high molecular weight rosin ester is more sensitive to temperature changes and showed drastic changes in tackiness from high temperature to low temperature. On the other hand, rosin ester with low molecular weight is less sensitive to temperature changes. © 2010 VSP.

A facile method for synthesizing PVA/Au, PVA/Ag and PVA/AuAg nanocomposites

In this paper, we presented a facile way of preparing PVA/Au, PVA/Ag and PVA/AuAg nanocomposites through in situ synthesis of metal nanoparticles in PVA hydrogel network using a room temperature atmospheric pressure microplasma. This is the first time microplasma technology is used for the fabrication of hydrogel based nanocomposites. The materials synthesized have been characterized for their microstructure and antibacterial properties. The nanoparticles synthesized within the PVA hydrogel network are found to be better dispersed than those synthesized in water, and their size and shape are more uniform. The new approach has opened a new avenue towards multi-scale synthesis of green and multi-functional nanocomposites, which may find wide range of potential applications in biomedical field.

Effect of Chromium Doping on the Diffraction Efficiency of Methylene Blue Sensitized PVA/Acrylamide Films

The effect of chromium doping on methylene blue sensitized Poly (vinyl alcohol)/Acrylamide was carried out by varying the ratios of Ammonium dichromate and methylene blue. In the case of films without ammonium dichromate, the diffraction efficiency was found to decrease on storage. On chromium doping the storage life was improved. Interestingly, a self-enhancement in efficiency was observed for a particular ratio of methylene blue and ammonium dichromate.

Rubber Solution Adhesives for Wood-to-Wood Bonding

Rubber solutions were prepared and used for bonding wood pieces. The effect of the variation of chlorinated natural rubber (CNR) and phenolformaldehyde (PF) resin in the adhesive solutions on lap shear strength was determined. Natural rubber and neoprene-based adhesive solutions were compared for their lap shear strength. The storage stability of the adhesive prepared was determined. The change in lap shear strength before and after being placed in cold water, hot water, acid, and alkali was tested. The bonding character of these adhesives was compared with different commercially available solution adhesives. The room-temperature aging resistance of wood joints was also determined. In all the studies, the adhesive prepared in the laboratory was found to be superior compared to the commercial adhesives.

Studies on adhesives for bonding rubber to rubber and rubber to textiles

The primary objective of this investigation has been to develop more efficient and low cost adhesives for bonding various elastomer combinations particularly NR to NR, NR/PB to NR/PB, CR to CR,NR to CR and NR to NBR.A significant achievement of the investigation was the development of solventless and environment friendly solid adhesives for NR to NR and NR/PB to NR/PB particularly for precured retreading. Conventionally used adhesives in this area are mostly NR based adhesive strips in the presence of a dough. The study has shown that an ultra accelerator could be added to the dough just before applying it on the tire which can significantly bring down the retreading time resulting in prolonged tire service and lower energy consumption. Further latex reclaim has been used for the preparation of the solid strip which can reduce the cost considerably.Another significant finding was that by making proper selection of the RF resin, the efficiency and shelflife of the RFL adhesive used for nylon and rayon tire cord dipping can be improved. In the conventionally used RFL adhesive, the resin once prepared has to be added to the latex within 30 minutes and the RFL has to be used after 4 hours maturation time maximum shelf life of the RFL dip solution being 72 hours. In this study a formaldehyde deficient resin was used and hence more flexibility was available for mixing with latex and maturing. It also has a much longer shelf life. In the method suggested in this study, formaldehyde donors were added only in the rubber compound to make up the formaldehyde deficiency in the RFL. The results of this investigation show that the pull through load by employing this method and the conventional method are comparable. This study has also shown that the amount of RF resin with RFL adhesive can be partially replaced by other modifying agents for cost reduction.Cashew nut shell liquid (CNSL) resin can be employed for improving the bonding of dipped nylon and rayon cord with NR.Since CNSL resin cannot be added in the dip solution since it is not soluble in water, it was added in the rubber compound. The amount of wood rosin in the rubber compound can be reduced by using CNSL resin.Another interesting result of the investigation was the use of CR based adhesive modified with chlorinated natural rubber for CR to CR bonding. Addition of chlorinated natural rubber was found to improve sea water resistance of CR based adhesive. In the bonding of a polar rubber like nitrile rubber or polychloroprene rubber to a non polar rubber like natural rubber, an adhesive based on polychloroprene rubber was found to be effective.