Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Isothermal decomposition kinetics in the Cu-9%Al-4%Ag alloy

The influence of 4 wt.%Ag addition on the isothermal decomposition kinetics of the beta' phase in the Cu-9wt.%Al alloy was studied by microhardness measurements, optical and scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, and X-ray diffractometry. The results showed that the presence of Ag decreases the beta' --> (alpha + gamma(1)) decomposition reaction rate in the Cu-9%Al-4%Ag alloy, an effect that may be associated to the gamma(1) phase which catalyses the Ag precipitation, making it faster than the decomposition reaction, and thus, stabilizing the martensitic phase. (C) 2003 Elsevier B.V. All rights reserved.

Estudo da influência de adições de prata na resistividade elétrica da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de precipitação da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Determinação das energias de ativação para nucleação de precipitados e difusão da prata na liga cu-2%al com adições de prata

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Comparação do ajuste dos modelos de morgan-mercer-flodin e de johnson-mehl-avrami na reação de precipitação na liga cu-3%al-5%ag

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

beta Phase transformations in the Cu-11mass%Al alloy with Ag additions

In the Cu-Al system, due to the sluggishness of the beta a dagger" (alpha + gamma(1)) eutectoid reaction, the beta phase can be retained metastably. During quenching, metastable beta alloys undergo a martensitic transformation to a beta' phase at Al low content. The ordering reaction beta a dagger" beta(1) precedes the martensitic transformation. The influence of Ag additions on the reactions containing the beta phase in the Cu-11mass%Al alloy was studied using differential scanning calorimetry and in situ X-ray diffractometry. The results indicated that, on cooling, two reactions are occurring in the same temperature range, the beta -> (alpha + gamma(1)) decomposition reaction and the beta -> beta(1) reaction, with different reaction mechanisms (diffusive for the former and ordering for the latter) and, consequently, with different reaction rates. For lower cooling rates, the dominant is the decomposition reaction and for higher cooling rates the ordering reaction prevails. on heating, the (alpha + gamma(1)) -> beta reverse eutectoid reaction occurs with a resulting beta phase saturated with alpha. The increase of Ag concentration retards the beta -> (alpha + gamma(1)) decomposition reaction and the beta -> beta(1) ordering reaction, which occurs in the same temperature range, becomes the predominant process.

Pearlitic reaction in Cu-10wt%Al alloy with Ag additions

The pearlitic reaction in Cu-10wt%Al alloy with additions of 4, 6, 8, and 10wt%Ag was studied using scanning electron microscopy, energy dispersive X-ray microanalysis, in situ X-ray diffractometry, and microhardness measurements. The results indicated that the presence of Ag changes the pearlitic phase microstructure and its mechanical properties, because of the influence of Ag in the pearlitic phase growth mechanism. (C) 2008 International Centre for Diffraction Data.

Reação de precipitação de Ag na liga Cu-8%Al-6%Ag

A reação de precipitação de prata na liga Cu-8%Al-6%Ag foi estudada usando medidas de variação da microdureza com a temperatura e o tempo de envelhecimento, difratometria de raios X (DRX), calorimetria exploratória diferencial (DSC), microscopia eletrônica de varredura (MEV). Os resultados obtidos indicaram que o mecanismo da reação de precipitação da prata é um processo controlado pela difusão da prata e a velocidade desta reação atinge um máximo em torno de 500°C.

A NEW CU-BASED SMA WITH EXTREMELY HIGH MARTENSITIC-TRANSFORMATION TEMPERATURES

A new series of high temperature copper based shape memory alloys has recently been patented. These alloys contain 8-20 wt% Al, 1-20 wt% Ag, 0-2 wt% of a minor element (preferably Co), balance copper. The martensitic start transformation temperatures of these alloys are above 200 degrees C and, in some cases, they have good high temperature stability and may be useful in commercial applications where higher operating temperatures than those obtained from Cu-Zn-Al and Cu-Al-Ni shape memory alloys are required.

Electrochemical Behavior of Cu-9% Al-5% Ni-2% Mn Alloy in Chloride Media

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Kinetics of martensitic phase decomposition in the Cu-10wt.%Al alloy with Ag additions

The study of the kinetics of martensitic phase decomposition in the Cu-10wt.%Al alloy with Ag additions showed that the presence of Ag retarded the eutectoid decomposition reaction and enhanced martensite stabilization. This stabilization effect was attributed to Ag atoms redistribution as structure defects, increase in the numbers of Cu-Al pairs due to Ag-Al interaction and the Al atoms redistribution around one Cu atom at the sub-lattice of the martensitic crystal. © 2008 Trans Tech Publications.

Estudo da influência de adições de prata na cinética de precipitação e no comportamento eletroquímico da liga Cu-6%Al

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Estudo da cinética de precipitação de Ag na liga Cu-7% Al-4% Ag

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)