Numerical investigation of thermocapillary migration of the drop for large Marangoni numbers

An axisymmetric model is adopted to simulate the problem of unsteady drop thermocapillary motion for large Marangoni numbers. Front tracking methods are used in the investigation. It is found that the non-dimensional drop migration velocity will decrease with increasing Marangoni number. This agrees well with the experimental results obtained from the 4th Shen-Zhou space ship. In the meanwhile, this is also the first time for numerical simulations to verify the experimental phenomenon under large Marangoni numbers.

Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.