998 resultados para periprosthetic fracture


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This paper deals with the correction of mode II strain energy release rate, G(II), of composite laminates measured with the end-notched flexure (ENF) specimen. A derivation is given of the expressions for compliance and strain energy release rate, in whic

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The use of interlaminar fracture tests to measure the delamination resistance of unidirectional composite laminates is now widespread. However, because of the frequent occurrence of fiber bridging and multiple cracking during the tests, it leads to artificially high values of delamination resistance, which will not represent the behavior of the laminates. Initiation fracture from the crack starter, on the other hand, does not involve bridging, and should be more representative of the delamination resistance of the composite laminates. Since there is some uncertainty involved in determining the initiation value of delamination resistance in mode I tests in the literature, a power law of the form G(IC) = A.DELTA alpha(b) (where G(IC) is mode I interlaminar fracture toughness and DELTA alpha is delamination growth) is presented in this paper to determine initiation value of mode I interlaminar fracture toughness. It is found that initiation values of the mode I interlaminar fracture toughness, G(IC)(ini), can be defined as the G(IC) value at which 1 mm of delamination from the crack starter has occurred. Examples of initiation values determined by this method are given for both carbon fiber reinforced thermoplastic and thermosetting polymers.

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End-linked hydroxyl-terminated polybutadiene containing unattached linear polybutadiene was used to study the effect of reptating species on the fracture mechanics of rubber networks. The concentration of reptating species in the networks ranged from 0 to 100%. The fracture mechanics of the networks was described using the critical strain energy release rate in mode III testing, i.e. the tearing energy. The tearing energy was measured at room temperature using a 'trouser' specimen at a strain rate spanning five logarithmic decades. When the strain rate was as low as 10(-4) s-1, the tearing energy of the networks increased with reduction in reptating species. In this case the reptating species did not contribute to the tearing energy of the networks due to relaxation. Hence, the tearing energy increased with the number of crosslinked chains per unit volume in the networks. At a strain rate ranging from 10(-3) to 10(-1) s-1, the tearing energy of the networks was governed by local viscosity. The tearing energies of the networks containing various amounts of reptating species were superimposed to give a master curve based on the Williams-Landel-Ferry equation.

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The toughening effect of the separate phases of ethylene/propylene block copolymers and their blends was studied by scanning electron microscopy (SEM). The results obtained show that the interfacial adhesion between separate phases and the isotactic polypropene (iPP) matrix in ethylene/propylene block copolymers is strong at room temperature, but poor at low temperature; specimens exhibit tearing of separate phases during fracture at room temperature, but interfacial fracture between separate phases and the iPP matrix at low temperature. From the characteristics of fractographs of ethylene/propylene block copolymers and their blends, it could be concluded that the separate phases improve the toughness of specimens in several ways: they promote the plastic deformation of the iPP, and they can be deformed and fractured themselves during the fracture process. However, it was shown that the plastic deformation processes, such as multiple-crazing, shear yielding, etc. of the matrix are the dominant mechanisms of energy absorption in highly toughened ethylene/propylene block copolymers and their blends. The deformation and fracture of separate phases are only of secondary importance.

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Large-scale molecular dynamics simulations have been performed on canonical ensembles to model the adhesion and indentation characteristics of 3-D metallic nano-scale junctions in tip-substrate geometries, and the crack propagation in 2-D metallic lattices. It is shown that irreversible flows in nano-volumes of materials control the behaviour of the 3-D nano-contacts, and that local diffusional flow constitutes the atomistic mechanism underlying these plastic flows. These simulations show that the force of adhesion in metallic nano-contacts is reduced when adsorbate monolayers are present at the metal—metal junctions. Our results are in agreement with the conclusions of very accurate point-contact experiments carried out in this field. Our fracture simulations reveal that at low temperatures cleavage fractures can occur in both an elemental metal and an alloy. At elevated temperatures, the nucleation of dislocations is shown to cause a brittle-to-ductile transition. Limiting crack propagation velocities are computed for different strain rates and a dynamic instability is shown to control the crack movement beyond this limiting velocity, in line with the recent experimental results.

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The trend towards miniaturization of electronic products leads to the need for very small sized solder joints. Therefore, there is a higher reliability risk that too large a fraction of solder joints will transform into Intermetallic Compounds (IMCs) at the solder interface. In this paper, fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints was carried out using finite element numerical computer modelling method. It is assumed that only one crack is present in the IMC layer. Linear Elastic Fracture Mechanics (LEFM) approach is used for parametric study of the Stress Intensity Factors (SIF, KI and KII), at the predefined crack in the IMC layer of solder butt joint tensile sample. Contrary to intuition, it is revealed that a thicker IMC layer in fact increases the reliability of solder joint for a cracked IMC. Value of KI and KII are found to decrease with the location of the crack further away from the solder interfaces while other parameters are constant. Solder thickness and strain rate were also found to have a significant influence on the SIF values. It has been found that soft solder matrix generates non-uniform plastic deformation across the solder-IMC interface near the crack tip that is responsible to obtain higher KI and KII.

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In this study, a simplified Acoustic Emission (AE) equipment, in essence an AE signal conditioner and a USB (Universal Serial Bus) data acquisition system, is used to study what happens in paper structures during mechanical loading. By the use of such equipment, some parameters that can be extracted are e.g. the stress and strain at onset of AE, the stress and strain at the onset of rapid AE defined as some numerical factor (larger then one) times the initial emission rate, the emission rate at the first stage of loading and the stress and strain at final failure i.e. when the specimen loses its load carrying ability.In this study however, the interest is focused on one particular parameter i.e. the elastic strain energy density W c at onset of AE. This is a parameter with a clear physical meaning and in this study, the correlation between this parameter and a fracture toughness measure, is investigated.The conclusion is that when nine different paper materials (with a large span regarding properties) are considered, there is a correlation (however not linear) between these two parameters.

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The objectives of this study were to determine the fracture toughness of adhesive interfaces between dentine and clinically relevant, thin layers of dental luting cements. Cements tested included a conventional glass-ionomer, F (Fuji I), a resin-modified glass-ionomer, FP (Fuji Plus) and a compomer cement, D (DyractCem). Ten miniature short-bar chevron notch specimens were manufactured for each cement, each comprising a 40 µm thick chevron of lute, between two 1.5 mm thick blocks of bovine dentine, encased in resin composite. The interfacial KIC results (MN/m3/2) were median (range): F; 0.152 (0.14-0.16), FP; 0.306 (0.27-0.37), D; 0.351 (0.31-0.37). Non-parametric statistical analysis showed that the fracture toughness of F was significantly lower (p