全地形移动机器人轮-地几何接触角估计

研究全地形移动机器人在不平坦地形中轮-地几何接触角的实时估计问题.本文以带有被动柔顺机构的六轮全地形移动机器人为对象,抛弃轮-地接触点位于车轮支撑臂延长线上这一假设,通过定义轮-地几何接触角δ来反映轮-地接触点在轮缘上位置的变化和地形不平坦给机器人运动带来的影响,将机器人看成是一个串-并联多刚体系统,基于速度闭链理论建立考虑地形不平坦和车轮滑移的机器人运动学模型,并针对轮-地几何接触角δ难以直接测量的问题,提出一种基于模型的卡尔曼滤波实时估计方法.利用卡尔曼滤波对机器人内部传感器的测量值进行噪声处理,基于机器人整体运动学模型对各个轮-地几何接触角进行实时估计,物理实验数据的处理结果验证了本文方法的有效性,从而为机器人运动学的精确计算和高质量的导航控制奠定了基础.

全地形移动机器人建模与控制研究综述

本文主要针对复杂地形给移动机器人机动性和安全性所带来的相关问题,从机器人建模、轮—地接触模型、车轮滑移、牵引力控制及稳定性控制等方面,对全地形移动机器人建模与控制的相关研究进行了全面综述,并分析了国内外研究现状,特别是近年来所取得的最新成果.最后,指出了目前存在的问题及将来可能的发展趋势.

一种基于反作用力的仿人机器人ZMP建模与测量

“零力矩点”是判定仿人机器人动态稳定运动的重要指标。本文根据零力矩点的概念,利用机器人车体的几何及动力学关系,建立基于反作用力的正交轮式移动仿人机器人的零力矩点模型;提出了基于电流传感器、电机编码器等传感器的零力矩点的实时测量方法,并给出了该方法的结构框图。由于轮式移动仿人机器人与地面呈点式接触,难于安装力传感器,所以这种方法尤其适用于轮式移动仿人机器人。

Contact Sensors for Dexterous Robotic Hands

This thesis examines a tactile sensor and a thermal sensor for use with the Utah-MIT dexterous four fingered hand. Sensory feedback is critical or full utilization of its advanced manipulatory capabilities. The hand itself provides tendon tensions and joint angles information. However, planned control algorithms require more information than these sources can provide. The tactile sensor utilizes capacitive transduction with a novel design based entirely on silicone elastomers. It provides an 8 x 8 array of force cells with 1.9 mm center-to-center spacing. A pressure resolution of 8 significant bits is available over a 0 to 200 grams per square mm range. The thermal sensor measures a material's heat conductivity by radiating heat into an object and measuring the resulting temperature variations. This sensor has a 4 x 4 array of temperature cells with 3.5 mm center-to-center spacing. Experiments show that the thermal sensor can discriminate among material by detecting differences in their thermal conduction properties. Both sensors meet the stringent mounting requirements posed by the Utah-MIT hand. Combining them together to form a sensor with both tactile and thermal capabilities will ultimately be possible. The computational requirements for controlling a sensor equipped dexterous hand are severe. Conventional single processor computers do not provide adequate performance. To overcome these difficulties, a computational architecture based on interconnecting high performance microcomputers and a set of software primitives tailored for sensor driven control has been proposed. The system has been implemented and tested on the Utah-MIT hand. The hand, equipped with tactile and thermal sensors and controlled by its computational architecture, is one of the most advanced robotic manipulatory devices available worldwide. Other ongoing projects will exploit these tools and allow the hand to perform tasks that exceed the capabilities of current generation robots.

Extracting Location from Contact Traces

Localization is essential feature for many mobile wireless applications. Data collected from applications such as environmental monitoring, package tracking or position tracking has no meaning without knowing the location of this data. Other applications have location information as a building block for example, geographic routing protocols, data dissemination protocols and location-based services such as sensing coverage. Many of the techniques have the trade-off among many features such as deployment of special hardware, level of accuracy and computation power. In this paper, we present an algorithm that extracts location constraints from the connectivity information. Our solution, which does not require any special hardware and a small number of landmark nodes, uses two types of location constraints. The spatial constraints derive the estimated locations observing which nodes are within communication range of each other. The temporal constraints refine the areas, computed by the spatial constraints, using properties of time and space extracted from a contact trace. The intuition of the temporal constraints is to limit the possible locations that a node can be using its previous and future locations. To quantify this intuitive improvement in refine the nodes estimated areas adding temporal information, we performed simulations using synthetic and real contact traces. The results show this improvement and also the difficulties of using real traces.

Effect of solder volume on joint shape with variable chip-to-board contact pad ratio

The objective of this paper is to investigate the effect of the pad size ratio between the chip and board end of a solder joint on the shape of that solder joint in combination with the solder volume available. The shape of the solder joint is correlated to its reliability and thus of importance. For low density chip bond pad applications Flip Chip (FC) manufacturing costs can be kept down by using larger size board pads suitable for solder application. By using “Surface Evolver” software package the solder joint shapes associated with different size/shape solder preforms and chip/board pad ratios are predicted. In this case a so called Flip-Chip Over Hole (FCOH) assembly format has been used. Assembly trials involved the deposition of lead-free 99.3Sn0.7Cu solder on the board side, followed by reflow, an underfill process and back die encapsulation. During the assembly work pad off-sets occurred that have been taken into account for the Surface Evolver solder joint shape prediction and accurately matched the real assembly. Overall, good correlation was found between the simulated solder joint shape and the actual fabricated solder joint shapes. Solder preforms were found to exhibit better control over the solder volume. Reflow simulation of commercially available solder preform volumes suggests that for a fixed stand-off height and chip-board pad ratio, the solder volume value and the surface tension determines the shape of the joint.

Pairing QuantiFERON gold in-tube with opt-out HIV testing in a tuberculosis contact investigation in the Southeastern United States.

Knowing one's HIV status is particularly important in the setting of recent tuberculosis (TB) exposure. Blood tests for assessment of tuberculosis infection, such as the QuantiFERON Gold in-tube test (QFT; Cellestis Limited, Carnegie, Victoria, Australia), offer the possibility of simultaneous screening for TB and HIV with a single blood draw. We performed a cross-sectional analysis of all contacts to a highly infectious TB case in a large meatpacking factory. Twenty-two percent were foreign-born and 73% were black. Contacts were tested with both tuberculin skin testing (TST) and QFT. HIV testing was offered on an opt-out basis. Persons with TST >or=10 mm, positive QFT, and/or positive HIV test were offered latent TB treatment. Three hundred twenty-six contacts were screened: TST results were available for 266 people and an additional 24 reported a prior positive TST for a total of 290 persons with any TST result (89.0%). Adequate QFT specimens were obtained for 312 (95.7%) of persons. Thirty-two persons had QFT results but did not return for TST reading. Twenty-two percent met the criteria for latent TB infection. Eighty-eight percent accepted HIV testing. Two (0.7%) were HIV seropositive; both individuals were already aware of their HIV status, but one had stopped care a year previously. None of the HIV-seropositive persons had latent TB, but all were offered latent TB treatment per standard guidelines. This demonstrates that opt-out HIV testing combined with QFT in a large TB contact investigation was feasible and useful. HIV testing was also widely accepted. Pairing QFT with opt-out HIV testing should be strongly considered when possible.

A location-based communication platform: integrating file sharing with interpersonal contact

Gemstone Team FLIP (File Lending in Proximity)

Cell-to-cell contact-independent regulatory T cells in human tuberculosis

info:eu-repo/semantics/nonPublished

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

The work presented in this paper focuses on the effect of reflow process on the contact resistance and reliability of anisotropic conductive film (ACF) interconnection. The contact resistance of ACF interconnection increases after reflow process due to the decrease in contact area of the conducting particles between the mating I/O pads. However, the relationship between the contact resistance and bonding parameters of the ACF interconnection with reflow treatment follows the similar trend to that of the as-bonded (i.e. without reflow) ACF interconnection. The contact resistance increases as the peak temperature of reflow profile increases. Nearly 40% of the joints were found to be open after reflow with 260 °C peak temperature. During the reflow process, the entrapped (between the chip and substrate) adhesive matrix tries to expand much more than the tiny conductive particles because of the higher coefficient of thermal expansion, the induced thermal stress will try to lift the bump from the pad and decrease the contact area of the conductive path and eventually, leading to a complete loss of electrical contact. In addition, the environmental effect on contact resistance such as high temperature/humidity aging test was also investigated. Compared with the ACF interconnections with Ni/Au bump, higher thermal stress in the Z-direction is accumulated in the ACF interconnections with Au bump during the reflow process owing to the higher bump height, thus greater loss of contact area between the particles and I/O pads leads to an increase of contact resistance and poorer reliability after reflow.

'Re-using an existing wheel' developing data architecture for cooperating autonomous and semi-autonomous, agent-based web services

This short position paper considers issues in developing Data Architecture for the Internet of Things (IoT) through the medium of an exemplar project, Domain Expertise Capture in Authoring and Development ­Environments (DECADE). A brief discussion sets the background for IoT, and the development of the ­distinction between things and computers. The paper makes a strong argument to avoid reinvention of the wheel, and to reuse approaches to distributed heterogeneous data architectures and the lessons learned from that work, and apply them to this situation. DECADE requires an autonomous recording system, ­local data storage, semi-autonomous verification model, sign-off mechanism, qualitative and ­quantitative ­analysis ­carried out when and where required through web-service architecture, based on ontology and analytic agents, with a self-maintaining ontology model. To develop this, we describe a web-service ­architecture, ­combining a distributed data warehouse, web services for analysis agents, ontology agents and a ­verification engine, with a centrally verified outcome database maintained by certifying body for qualification/­professional status.

The Role of Tool/Sheet Contact in Plug-Assisted Thermoforming.

Plug-assisted thermoforming produces a wide range of polymer products through a combination of deformation by air pressure and contact with tool surfaces. In this paper the role of tool/sheet contact in determining the process output is investigated. A combination of thermoforming, friction and heat transfer tests were carried out on common tool and sheet materials. The results show that the typical friction coefficients for the material combinations are within the range 0.1 to 0.3, but the values rise sharply on approaching thermoforming temperatures. Thermal imaging tests demonstrate that all of the plug materials significantly cool the heated sheet on contact, even over very short periods of time. The temperature of the plug is very important. At low plug temperatures heat transfer effects predominate, whereas at high plug temperatures friction effects predominate. A plug temperature of approximately 100oC balances these effects and creates the most effective material distribution.