Rheological, thermal, and morphological properties of ABS-PA1010 blends

Noncompatibilized and compatibilized ABS-nylon1010 blends were prepared by melt mixing. Polystyrene and glycidyl methacrylate (SG) copolymer was used as a compatibilizer to enhance the interfacial adhesion and to control the morphology. This SG copolymer contains reactive glycidyl groups that are able to react with PA1010 end groups (-NH2 or -COOH) under melt conditions to form SG-g-Nylon copolymer. Effects of the compatibilizer SG on the rheological, thermal, and morphological properties were investigated by capillary rheometer, DSC, and SEM techniques. The compatibilized ABS-PA1010 blend has higher viscosity, lower crystallinity, and smaller phase domain compared to the corresponding noncompatibilized blend. (C) 1999 John Wiley & Sons, Inc.

Effects of the compatibilizer PP-g-GMA on morphology and mechanical properties of PP/PC blends

Effects of the compatibilizer polypropylene grafted with glycidyl methacrylate(PP-g-GMA) on the morphology, thermal, rheological and mechanical properties of polypropylene and polycarbonate blends (PP/PC) were studied. It was found that the addition of PP-g-GMA significantly changed their morphology. The mean size of domains reduced from 20 mu m to less than 5 mu m. The dispersed domain size is also strongly dependent upon the content of PP-g-GMA. The interfacial tension of PP/PC/PP-g-GMA (50/30/20) is only about one-tenth of PP/PC (70/30). The crystallization temperature of PP in PP/PC/PP-g-GMA is 5-8 degrees C higher than that of PP in PP/PC blends. Characterization studies based on mechanical properties, differential scanning calorimetry, rheology and morphological evidence obtained by using scanning electron microscopy support the hypothesis that an in-situ copolymer PP-g-PC was formed during the blending process. (C) 1997 Elsevier Science Ltd.

Thermal, mechanical and ionic conductive behaviour of gamma-radiation induced PEO/PVDF(SIN)-LiClO4 polymer electrolyte system

An effort has been made to modify the mechanical behaviour of our previously reported gel-type gamma-radiation crosslinked polyethylene oxide (PEO)-LiClO4 polymer electrolyte. A highly polar and gamma-radiation crosslinkable crystalline polymer, polyvinylidene fluoride (PVDF), was selected to blend with PEO and then subjected to gamma-irradiation in order to make an simultaneous interpenetrating network (SIN), which was used as a polymer host to impart stiffness to the plasticized system. Experimental results have shown that the presence of PVDF in the system, through gamma-radiation induced SIN formation, could not only give a rather high mechanical modulus of 10(7) Pa at ambient temperature, but also maintain the room temperature ionic conductivity at a high level (greater than 10(-4) S/cm). DSC, DMA and conductivity measurement techniques were used to examine the effects of blending, gamma-irradiation and plasticization on the variations of glass transition and melting endotherm, on the appearance of high elastic plateau and on the temperature dependence of ionic conductivity: In addition, it was found that, in contrast with the unplasticized system, the ionic conductivity mechanism of this gel-type electrolyte seems to conform to the Arrhenius model, suggesting that, as a result of the high degree of plasticization, the polymer chains act mainly as the skeleton of the networks or polymer cages to immobilize the liquid electrolyte solution, whereas the ionic species migrate as if they were in a liquid medium. (C) 1997 Elsevier Science Ltd.

Structure and thermal properties of vinylidene chloride/acrylics copolymers

A series of vinylidene chloride (VDC) copolymers with methyl acrylate (MA) or butyl acrylate (BA) as comonomer (not more than 10%) was prepared by free-radical suspension copolymerization. The effects of comonomer structure, copolymer composition, and reaction condition (such as polymerization temperature on crystallinity) and thermal properties (such as melting temperature and decomposition temperature) were investigated. All VDC/acrylics copolymers studied here are semicrystalline and have more than one crystalline structure. The melting temperature of MA/VDC copolymers is decreased progressively with increase in MA content. The decomposition temperature of MA/VDC copolymers is slight increased gradually with increase in MA content. MA/VDC copolymers have lower melting temperature compared with BA/VDC copolymers with same VDC composition. The melting temperature of VDC copolymers increases with increase in polymerization temperature and decomposition temperature of those is almost independent of polymerization temperature. (C) 1996 John Wiley & Sons, Inc.

Sulfonation of polyetheretherketone and its effects on permeation behavior to nitrogen and water vapor

The novel polyetheretherketone (PEK-C) prepared from phenolphthalein in our institute is an amorphous, rigid, tough material with good mechanical properties over a wide temperature range. To improve its water vapor permeability for the application of gas drying, PEK-C was sulfonated with concentrated sulfuric acid and transferred in sodium, cupric, and ferric salt forms. Sulfonation degree can be regulated by controlling the temperature and reaction time. Characterization of sulfonated PEK-C in sodium form was made by infrared spectroscopy. Some properties of the sulfonated PEK-C, such as solubility, glass transition temperature, thermal stability, mechanical properties, and transport properties to nitrogen and water vapor, are also discussed. (C) 1996 John Wiley & Sons, Inc.

THE THERMAL-STABILITY OF POLYETHYLENE BLENDS DURING HEAT-PROCESSING AND SHORT-TERM PHOTOOXIDATION

The melt flow behaviour of LDPE/HDPE blends with various compositions have been determined by melt flow index (MFI) measurement. The effects of stabilizers, photo-sensitizers, multiple extrusions and short-term photooxidation have been studied. The results show that there is no marked thermal stability difference between homopolymers and blends without multiple extrusions, no matter whether stabilizers or photo-sensitizers are added. Multiple extrusions or photo-sensitizers reduce their thermal stability, shown by the decrease in MFI. The decrease in MFI of photooxidized samples does not imply serious structural change and shows that the active species formed during photooxidation induce a crosslinking reaction in the melt indexer. Multiple extrusions increase the number of active species formed in LDPE or blends and lead to an obvious decrease in MFI. It is suggested that LDPE and LDPE-rich blends after short-term photooxidation can be characterized by MFI measurement. In contrast, HDPE cannot be characterized by this method due to its linear structure.

RESEARCH ON THE THERMAL-DECOMPOSITION OF THE BIOINORGANIC COMPLEX OF EUROPIUM AND L-GLUTAMINE BY MOSSBAUER-SPECTROSCOPY

Mossbauer spectroscopy has been used to investigate the thermal decomposition of the bioinorganic complex of europium and L-glutamine. The Mossbauer parameters can demonstrate that the water molecules in the complex and the chlorine anion in the hydrogen chloride molecule, dissociated from the complex below 200-degrees-C, are not linked directly to the europium atom. The thermal decomposition process of the complex is discussed and a possible coordination model for the europium L-glutamine complex is also proposed on the basis of the thermogravimetric and derivative thermogravimetric curves, and from some evidence obtained from the Mossbauer effects of some decomposition products of the complex.

CHARACTERIZATION, MORPHOLOGY AND THERMAL-PROPERTIES OF ETHYLENE PROPYLENE BLOCK COPOLYMERS

Characterization, morphology and thermal properties of commercial ethylene-propylene block copolymers have been studied by C-13 nuclear magnetic resonance (n.m.r.) spectroscopy, differential scanning calorimetry (d.s.c.), dynamic mechanical analysis (d.m.a.) and scanning electron microscopy (SEM). The results obtained show that there exists some ethylene-propylene random copolymer in the block copolymers extractable by n-heptane. The possibility of forming PP-b-PE diblock copolymer is questionable on the basis of the effects of residual propene and the chain-transfer reaction in the sequential copolymerization. A difference in the thermal properties between commercial ethylene-propylene block copolymers and PP/PE blends was noticed, which cannot be used to identify PP-b-PE diblock copolymer. The multiphase structure has been confirmed by d.m.a. and SEM, with ethylene-propylene random copolymer and polyethylene forming the domains in the matrix of polypropylene.

Super insulated aerogel windows: Impact on daylighting and thermal performance.

Window design plays an important role in achieving energy efficient buildings and in providing thermal comfort of building occupants. This paper investigates a newly developed aerogel window and the potential improvement on the comfort factors of an office in relation to daylighting. Improved comfort levels can impact on health and wellbeing of building occupants leading to knock on effects on absenteeism and productivity. A simulation tool was presently created that will easily enable comparison of different façade design and their impact on heat and light transmission and therefore enable optimisation. One of the most important aspects of the present work was comparing the performance of the newly developed aerogel window against the more traditional Argon-filled, coated double-glazing. Whereas the aerogel window provided an extremely low heat-loss index of 0.3 W/m2K, the latter usually offered a centre-glazing U-value of 1.4 W/m2K. On a like-with-like basis the daylight transmission of the aerogel window was significantly lower than double-glazing. However, in view of low thermal loss larger areas of the former can be deployed. This article presents the influence of three key parameters that may lead to an optimum design: daylight, thermal loss and solar gain.

Effect of peak inert-mode temperature on elemental carbon measured using thermal-optical analysis

Thermal-optical analysis is a conventional method for classifying carbonaceous aerosols as organic carbon (OC) and elemental carbon (EC). This article examines the effects of three different temperature protocols on the measured EC. For analyses of parallel punches from the same ambient sample, the protocol with the highest peak helium-mode temperature (870°C) gives the smallest amount of EC, while the protocol with the lowest peak helium-mode temperature (550°C) gives the largest amount of EC. These differences are observed when either sample transmission or reflectance is used to define the OC/EC split. An important issue is the effect of the peak helium-mode temperature on the relative rate at which different types of carbon with different optical properties evolve from the filter. Analyses of solvent-extracted samples are used to demonstrate that high temperatures (870°C) lead to premature EC evolution in the helium-mode. For samples collected in Pittsburgh, this causes the measured EC to be biased low because the attenuation coefficient of pyrolyzed carbon is consistently higher than that of EC. While this problem can be avoided by lowering the peak helium-mode temperature, analyses of wood smoke dominated ambient samples and levoglucosan-spiked filters indicate that too low helium-mode peak temperatures (550°C) allow non-light absorbing carbon to slip into the oxidizing mode of the analysis. If this carbon evolves after the OC/EC split, it biases the EC measurements high. Given the complexity of ambient aerosols, there is unlikely to be a single peak helium-mode temperature at which both of these biases can be avoided. Copyright © American Association for Aerosol Research.

Modeling non-harmonic behavior of materials from experimental inelastic neutron scattering and thermal expansion measurements

Based on thermodynamic principles, we derive expressions quantifying the non-harmonic vibrational behavior of materials, which are rigorous yet easily evaluated from experimentally available data for the thermal expansion coefficient and the phonon density of states. These experimentally- derived quantities are valuable to benchmark first-principles theoretical predictions of harmonic and non-harmonic thermal behaviors using perturbation theory, ab initio molecular-dynamics, or Monte-Carlo simulations. We illustrate this analysis by computing the harmonic, dilational, and anharmonic contributions to the entropy, internal energy, and free energy of elemental aluminum and the ordered compound FeSi over a wide range of temperature. Results agree well with previous data in the literature and provide an efficient approach to estimate anharmonic effects in materials.

Moisture Effects on the Reliability of Anisotropic Conductive Films

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports an investigation into the moisture effects on the reliability of ACF interconnections in the flip-chip-on-flex (FCOF) applications. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. The purposes of this modeling work was to understand the role that moisture plays in the failure of ACF flip chips, and to look into the influence of physical properties and geometric characteristics, such as the coefficient of the moisture expansion (CME), Young's modulus of the adhesive matrix and the bump height on the reliability of the ACF interconnections in a humid environment. Simulation results suggest that moisture-induced swelling of the adhesive matrix is the major cause of the ACF joint opening. Modeling results are consistent with the findings in the experimental work.

Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

This work describes the work of an investigation of the effects of solder reflow process on the reliability of anisotropic conductive film (ACF) interconnection for flip-chip on flex (FCOF) applications. Experiments as well as computer modeling methods have been used. The results show that the contact resistance of ACF interconnections increases after the reflow and the magnitude of the increase is strongly correlated to the peak reflow temperature. In fact, nearly 40 percent of the joints are open when the peak reflow temperature is 260°C, while there is no opening when the peak temperature is 210°C. It is believed that the coefficient of thermal expansion (CTE) mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a three-dimensional (3-D) finite element (FE) model of an ACF joint has been analyzed in order to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process. The stress level at the interface between the particle and its surrounding materials is significant and it is the highest at the interface between the particle and the adhesive matrix.

Thermal-mechanical analysis of flexible substrates during lead-free solder reflow

This paper presents modeling results about the performance of flexible substrates when subjected to higher lead-free reflow temperatures. Both adhesiveless and adhesive types of polyimide substrates were studied. Finite element (FE) models of flex substrates were built, two copper tracks located in the centre of the substrate was considered. The thermal induced shear stress in the flex substrate during the lead-free reflow process was studied and the effect of the design changes including the track thickness, flex thickness, and copper width were studied. For both types of flexes, the one of most important variables for minimizing damage to the substrate is the height of the copper tracks. The height of flex and the width of copper track show less impact. Beside of the geometry effects, the increase in reflow peak temperature can also result in a significant increase in the interfacial stress between the copper track and flex. Higher stresses were identified within the adhesive flex due to the big CTE mismatch between the copper and adhesive/dielectric

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method