986 resultados para Contact mechanics
Resumo:
A moving-coil designed micro-mechanics tester, named as MicroUTM (universal testing machine), is in-house developed in this paper for micro-mechanics tests. The main component is a moving coil suspended in a uniform magnetic field through a set of springs. When a current passes through the coil, the electromagnetic force is proportional to the magnitude of the current, so the load can easily be measured by the current. The displacement is measured using a capacitive sensor. The load is calibrated using a Sartorius BP211D analytical balance, with a resolution/range of 0.01 mg/80 g or 0.1 mg/210 g. The displacement is calibrated using a HEIDENHAIN CT-6002 length gauge with an accuracy of +/- 0.1 mu m. The calibration results show that the load range is +/- 1 N and the displacement range is +/- 300 mu m. The noise levels of the load and displacement are 50 mu N and 150 nm, respectively. The nonlinearity of the load is only 0.2%. Several in-plane load tests of the MEMS micro-cantilever are performed using this tester. Experimental results, with excellent repeatability, demonstrate the reliability of the load measurement as well as the flexible function of this tester.
Resumo:
When the atomic force microscopy (AFM) in tapping mode is in intermittent contact with a soft substrate, the contact time can be a significant portion of a cycle, resulting in invalidity of the impact oscillator model, where the contact time is assumed to be infinitely small. Furthermore, we demonstrate that the AFM intermittent contact with soft substrate can induce the motion of higher modes in the AFM dynamic response. Traditional ways of modeling AFM (one degree of freedom (DOF) system or single mode analysis) are shown to have serious mistakes when applied to this kind of problem. A more reasonable displacement criterion on contact is proposed, where the contact time is a function of the mechanical properties of AFM and substrate, driving frequencies/amplitude, initial conditions, etc. Multi-modal analysis is presented and mode coupling is also shown. (c) 2006 Published by Elsevier Ltd.
Resumo:
The viscoelastic deformation of Ce-based bulk metallic glasses (BMGs) with low glass transition temperature is investigated at room temperature. Contact stiffness and elastic modulus of Ce-based BMGs cannot be derived using the conventional Oliver-Pharr method [W. C. Oliver and G. M. Pharr, J. Mater. Res. 7, 1564 (1992)]. The present work shows that the time dependent displacement of unloading segments can be described well by a generalized Kelvin model. Thus, a modified Oliver-Pharr method is proposed to evaluate the contact stiffness and elastic modulus, which does, in fact, reproduce the values obtained via uniaxial compression tests. (c) 2007 American Institute of Physics.
Resumo:
A relationship between the cumulative length of microcracks and the amplitude and duration of tensile impulse in spallation was established based on the application of statistical microdamage mechanics, which included a statistical formulation and dynamic laws of microdamage under loading. Since the degrees of spallation, called incipient, intermediate and complete spallation, can be characterized by the cumulative length of microcracks, a physical interpretation of an empirical criterion to spallation was presented.
Resumo:
This paper summarizes the recent development of dynamic fracture in China. The review covers analytical and numerical results on elastodynamic crack fields in 3D and layered media; experimental and theoretical research on dynamic mechanical properties of rocks and advanced materials; transient effects on ideally plastic crack-tip fields when the inertia forces are not negligible.
Resumo:
The thermal conductivity of periodic composite media with spherical or cylindrical inclusions embedded in a homogeneous matrix is discussed. Using Green functions, we show that the Rayleigh identity can be generalized to deal with thermal properties ot these systems. A new calculating method for effective conductivity of composite media is proposed. Useful formulae for effective thermal conductivity are derived, and meanings of contact resistance in engineering problems are explained.