Bacterial Wilt: a threatening disease of tomato cultivated under warm temperatures.

2015

Discrimination between low atomic number materials from their characteristic scattering of X-ray radiation

C.R. Bull and R. Zwiggelaar, 'Discrimination between low atomic number materials from their characteristic scattering of X-ray radiation', Journal of Agricultural Engineering Research 68 (2), 77-87 (1997)

Characteristic Functions for Ergodic Tuples

Gohm, Rolf; Dey, S., 'Characteristic function for ergodic tuples', Integral Equations and Operator Theory 58(1) pp.43-63 RAE2008

Reevaluation of mid-Pliocene North Atlantic sea surface temperatures

Multiproxy temperature estimation requires careful attention to biological, chemical, physical, temporal, and calibration differences of each proxy and paleothermometry method. We evaluated mid-Pliocene sea surface temperature (SST) estimates from multiple proxies at Deep Sea Drilling Project Holes 552A, 609B, 607, and 606, transecting the North Atlantic Drift. SST estimates derived from faunal assemblages, foraminifer Mg/Ca, and alkenone unsaturation indices showed strong agreement at Holes 552A, 607, and 606 once differences in calibration, depth, and seasonality were addressed. Abundant extinct species and/or an unrecognized productivity signal in the faunal assemblage at Hole 609B resulted in exaggerated faunal-based SST estimates but did not affect alkenone-derived or Mg/Ca-derived estimates. Multiproxy mid-Pliocene North Atlantic SST estimates corroborate previous studies documenting high-latitude mid-Pliocene warmth and refine previous faunal-based estimates affected by environmental factors other than temperature. Multiproxy investigations will aid SST estimation in high-latitude areas sensitive to climate change and currently underrepresented in SST reconstructions. Copyright 2008 by the American Geophysical Union.

Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process

As the trend toward further miniaturisation of pocket and handheld consumer electronic products continues apace, the requirements for even smaller solder joints will continue. With further reductions in the size of solder joints, the reliability of solder joints will become more and more critical to the long-term performance of electronic products. Solder joints play an important role in electronics packaging, serving both as electrical interconnections between the components and the board, and as mechanical support for components. With world-wide legislation for the removal/reduction of lead and other hazardous materials from electrical and electronic products, the electronics manufacturing industry has been faced with an urgent search for new lead-free solder alloy systems and other solder alternatives. In order to achieve high volume, low cost production, the stencil printing process and subsequent wafer bumping of solder paste has become indispensable. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on printing performance. The printing of ICAs and lead-free solder pastes through the very small stencil apertures required for flip chip applications was expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit pads. Paste release from the stencil apertures is dependent on the interaction between the solder paste, surface pad and aperture wall; including its shape. At these very narrow aperture sizes the paste rheology becomes crucial for consistent paste withdrawal because for smaller paste volumes surface tension effects become dominant over viscous flow. Successful aperture filling and release will greatly depend on the rheology of the paste material. Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. The wall- slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. The wall slip effect can play an important role in ensuring successful paste release after the printing process. The aim of this study was to investigate the influence of the paste microstructure on slip formation for the paste materials (lead-free solder paste and isotropic conductive adhesives). The effect of surface roughness on the paste viscosity was investigated. It was also found that altering the surface roughness of the parallel plate measuring geometry did not significantly eliminate wall slip as was expected. But results indicate that the use of a relatively rough surface helps to increase paste adhesion to the plates, inducing structural breakdown of the paste. Most importantly, the study also demonstrated on how the wall slip formation in the paste material could be utilised for understanding of the paste microstructure and its flow behaviour

Physiological Adaptation Of Mytilus-Edulis To Cyclic Temperatures

Mytilus edulis adapted to cyclic temperatures by reducing the amplitude of response of oxygen consumption and filtration rate over a period of approximately two weeks, and thereby increasing their independence of temperature within the range of the fluctuating regime. When acclimated to cyclic temperature regimes within the range from 6 to 20°C, the metabolic and feeding rates, measured at different temperatures in the cycle, were not significantly different from the adapted response to equivalent constant temperatures. Physiological adaptation ofMytilus edulis to different thermal environments was reflected in their metabolic and feeding rate-temperature curves. Animals subjected to marked diel fluctuations in environmental temperature showed an appropriate region of temperature-independence, whereas animals from a population not experiencing large diel temperature fluctuations showed no region of temperature-independence. In a fluctuating thermal environment which extended above the normal environmental maxima, respiratory adaptation occurred at higher temperatures than was possible in a constant thermal environment. The feeding rate was also maintained at higher temperatures in a cyclic regime than was possible under constant thermal conditions. This represented a shortterm extension of the zone of activity in a fluctuating thermal environment. The net result of these physiological responses to high cyclic and constant temperatures has been assessed in terms of ‘scope for growth’. Animals acclimated to cyclic temperatures between 21 and 29°C had a higher scope for growth at 29°C and were less severely stressed than those maintained at the constant temperature of 29°C.