927 resultados para thermal-mechanical coupling


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A shear flexible 4-noded finite element formulation, having five mechanical degrees of freedom per node, is presented for modeling the dynamic as well as the static thermal response of laminated composites containing distributed piezoelectric layers. This element has been developed to have one electrical degree of freedom per piezoelectric layer. The mass, stiffness and thermo-electro-mechanical coupling effects on the actuator and sensor layers have been considered. Numerical studies have been conducted to investigate both the sensory and active responses on piezoelectric composite beam and plate structures. It is. concluded that both the thermal and pyroelectric effects are important and need to be considered in the precision distributed control of intelligent structures.

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Biodegradable composites comprising of modified starch and modified nanoclay have been prepared. Starch has been modified by esterification and subsequently crosslinked. The thermal, mechanical, and biodegradation characteristics of the composites have been investigated. The compressive properties of the composites with the addition of nanoclay were twice that of crosslinked starch phthalate without addition of nanoclay. Predictive theories were used to analyze the obtained experimental results. SEM studies on fracture morphology indicated quasi-brittle fracture. Flexural properties showed considerable improvement due to nanoclay addition. The water uptake increased up to 6% nanoclay, beyond which the uptake decreased. Biodegradation studies showed an initial time lag prior to the onset of degradation.

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A simple and practical method for the study of polymer thermal and mechanical properties using a fiber Bragg grating (FBG) sensor is presented for the first time, in which the FBG is embedded in a typical epoxy polymer. By measuring the sensitivity change of the FBG sensor, changes of the thermal-mechanical properties of the polymer with temperature and pressure can be measured. The experimental results show that this technique is capable of providing continuous in-line monitoring such properties with high sensitivity during transformation between the glassy state and the rubbery state of a polymer within the temperature and pressure range of 20 to 180 C and 0 to 15 MPa. (c) 2007 Society of Photo-Optical Instrumentation Engineers.

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A simple and practical method for the study of polymer thermal and mechanical properties using a fiber Bragg grating (FBG) sensor is presented for the first time, in which the FBG is embedded in a typical epoxy polymer. By measuring the sensitivity change of the FBG sensor, changes of the thermal-mechanical properties of the polymer with temperature and pressure can be measured. The experimental results show that this technique is capable of providing continuous in-line monitoring such properties with high sensitivity during transformation between the glassy state and the rubbery state of a polymer within the temperature and pressure range of 20 to 180 C and 0 to 15 MPa. (c) 2007 Society of Photo-Optical Instrumentation Engineers.

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This thesis presents a methodology for measuring thermal properties in situ, with a special focus on obtaining properties of layered stack-ups commonly used in armored vehicle components. The technique involves attaching a thermal source to the surface of a component, measuring the heat flux transferred between the source and the component, and measuring the surface temperature response. The material properties of the component can subsequently be determined from measurement of the transient heat flux and temperature response at the surface alone. Experiments involving multilayered specimens show that the surface temperature response to a sinusoidal heat flux forcing function is also sinusoidal. A frequency domain analysis shows that sinusoidal thermal excitation produces a gain and phase shift behavior typical of linear systems. Additionally, this analysis shows that the material properties of sub-surface layers affect the frequency response function at the surface of a particular stack-up. The methodology involves coupling a thermal simulation tool with an optimization algorithm to determine the material properties from temperature and heat flux measurement data. Use of a sinusoidal forcing function not only provides a mechanism to perform the frequency domain analysis described above, but sinusoids also have the practical benefit of reducing the need for instrumentation of the backside of the component. Heat losses can be minimized by alternately injecting and extracting heat on the front surface, as long as sufficiently high frequencies are used.

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In the present study, amino-silane modified layered organosilicates were used to reinforce cyclic olefin copolymer to enhance the thermal, mechanical and moisture impermeable barrier properties. The optimum clay loading (4%) in the nanocomposite increases the thermal stability of the film while further loading decreases film stability. Water absorption behavior at 62 degrees C was carried out and compared with the behavior at room temperature and 48 degrees C. The stiffness of the matrix increases with clay content and the recorded strain to failure for the composite films was lower than the neat film. Dynamic mechanical analysis show higher storage modulus and low loss modulus for 2.5-4 wt% clay loading. Calcium degradation test and device encapsulation also show the evidence of optimum clay loading of 4 wt% for improved low water vapor transmission rates compared to other nanocomposite films. (C) 2014 Elsevier Ltd. All rights reserved.

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The paper comprehensively analyzes the distortions of a circular wedge prism with 400 mm diameter in a scanner by method of optical-mechanical-thermal integrating analysis. The structure and intensity of the prism assembly is verified and checked, and the surface deformations of the prism under gravity load, as well as the thermo-elastic distortions of the prism, are analyzed in detail and evaluated, which is finally contrasted with the measured values of Zygo Mark interferometer. The results show: the maximal distortion of the prism assembly is 10 nm magnitude and the maximal stress is 0.441 Mpa, which has much tolerance to the precision requirement of structure and the admissible stress of material; the influence of heat effect on the surface deformations of prism is proved to be far greater than the influence of gravity load, so some strict temperature-controlled measures are to be considered when the scanner is used. (c) 2006 Elsevier GmbH. All rights reserved.

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(100 - x)TeO2 - xNb(2)O(5) (x=5-20) mobic tellurite glasses doped with 0.5 mol.% Er2O3 were synthesized, and their thermal, mechanical, and spectroscopic properties were measured and compared to the properties of the typical 75TeO(2)-20ZnO-5Na(2)O (TZN) tellurite glass. The refractive index (n(d)), density (p), and glass transition temperature (T-g) of bulk glasses increase with the Nb2O5 content. The Vickers microhardness (H-v) of bulk glass in niobic tellurite glasses also increases with the Nb2O5 content. The values (2.5-3.2 GPa) of H, in the niobic tellurite glasses are 47-88% larger than that (1.7 GPa) in TZN glass. The effect of Nb2O5 content on absorption spectra, the Judd-Ofelt parameters Omega(t) (t = 2, 4, 6), fluorescence spectra and the lifetimes of Er3+ :I-13/2 level were also investigated, and the stimulated emission crosssection was calculated from McCumber theory. With increasing Nb2O5 content in the glass composition, the Omega(t) (t = 2, 4, 6) parameters, fluorescence full width at half maximum (FWHM) Of I-13/2 of Er3+ increase, while the I-4(13/2) lifetimes of Er3+ decreases. Compared with TZN glass, the gain bandwidth properties of Er3+-doped TeO2-Nb2O5 glass is much larger than in tellurite glass based TeO2-ZnO-Na2O system, bismush-based glass, germanate, and silicate glasses, which indicates that TeO2-Nb2O5 glasses are better choice as a practical available host material for broadband Er3+-doped amplifier. (c) 2005 Elsevier B.V. All rights reserved.

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Carbon nanotubes (CNTs) have good mechanical properties and unique structural, electronic, thermal, and optical characteristics. In this work, we present the results of our investigations of a resonator device based on embedded vertical CNT arrays. The device's design is based on the mechanical resonance of the tubes. CoventorWare FEA tools have been used to simulate the mechanical resonance frequencies of the vertical nanotubes arrays integrated on a silicon substrate. ©2008 IEEE.

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An aromatic polyimide was synthesized via a one-step polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA) and 4,4'-oxydianiline (ODA) in p-chlorophenol. The polyimide (BPDA-ODA) solution dopes were spun into fibers by means of dry-jet wet spinning. The as-spun fibers were drawn and treated in heating tubes for improving the mechanical properties. The thermal treatment on the fibers resulted in a relatively high tensile strength and modulus. Thermal mechanical analysis (TMA) was employed to study the linear coefficient of thermal expansion (CTE). Thermal gravimetry analysis (TGA) spectra showed that the BPDA-ODA fibers possessed an excellent property of thermo-oxidative degradation resistance. The sonic modulus E-s of the polyimide fibers was measured.

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PC/ABS(M) blends, encompassing the whole composition range between pure PC and ABS(M), were prepared by melt-mixing in a Brabender-like apparatus. Thermal, mechanical and impact tests were performed on compression moulded specimens. Inward Tg shifts were

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This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

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Micro-electronic displays are sensitive devices and its performance is easily affected by external environmental factors. To enable the display to perform in extreme conditions, the device must be structurally strengthened, the effects of this packaging process was investigated. A thermo-mechanical finite element analysis was used to discover potential problems in the packaging process and to improve the overall design of the device. The main concern from the analysis predicted that displacement of the borosilicate glass and the Y stress of the adhesive are important. Using this information a design which reduced the variation of displacement and kept the stress to a minimum was suggested

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Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results.

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Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)