Exploiting virtual prototyping for reliability assessment

Products manufactured by the electronics sector are having a major impact in telecommunications, transportation space applications, biomedical applications, consumer products, intelligent hand held devices, and of course,the computer. Demands from end-users in terms of greater product functionality, adoption of environmentally friendly materials, and further miniaturization continually pose several challenges to electronics companies. In the context of electronic product design and manufacture, virtual prototying software tools are allowing companies to dramatically reduce the number of phsysical prototypes and design iterations required in product development and hence reduce costs and time to market. This paper details of the trends in these technolgies and provides an example of their use for flip-chip assembly technology.

Modelling and prototyping the conceptual design of 3D CMM micro-probe

This paper details the prototyping of a novel three axial micro probe based on utilisation of piezoelectric sensors and actuators for true three dimensional metrology and measurements at micro- and nanometre scale. Computational mechanics is used first to model and simulate the performance of the conceptual design of the micro-probe. Piezoelectric analysis is conducted to understand performance of three different materials - silicon, glassy carbon, and nickel - and the effect of load parameters (amplitude, frequency, phase angle) on the magnitude of vibrations. Simulations are also used to compare several design options for layout of the lead zirconium titanate (PZT) sensors and to identify the most feasible from fabrication point of view design. The material options for the realisation of the device have been also tested. Direct laser machining was selected as the primary means of production. It is found that a Yb MOPA based fiber laser was capable of providing the necessary precision on glassy carbon (GC), although machining trials on Si and Ni were less successful due to residual thermal effects.To provide the active and sensing elements on the flexures of the probe, PZT thick films are developed and deposited at low temperatures (Lt720 degC) allowing a high quality functional ceramic to be directly integrated with selected materials. Characterisation of the materials has shown that the film has a homogenous and small pore microstructure.

Slicing issues in CAD translation to STL in rapid prototyping

The rapid prototyping (RP) process is being used widely with great potential for rapid manufacturing of functional parts. The RP process involves translation of the CAD file to STL format followed by slicing of the model into multiple horizontal layers, each of which is reproduced physically in making the prototype. The thickness of the resulting slices has a profound effect on the surface finish and build time of the prototype. The purpose of this paper is to show the effects of slice thickness on the surface finish, layering error, and build time of a prototype, as well as to show how an efficient STL file can be developed. Three objects were modeled and STL files were generated. One STL file for each object was sliced using different slice thicknesses, and the build times were obtained. Screenshots were used to show the slicing effect on layering error and surface finish and to demonstrate the means to a more efficient STL file. From the results, it is clear that the surface finish and build time are important factors that are affected by slice thickness

Virtual Engineering Centre - Examples of Virtual Prototyping and Multidisciplinary Design Optimization

The requirement for the use of Virtual Engineering, encompassing the construction of Virtual Prototypes using Multidisciplinary Design Optimisation, for the development of future aerospace platforms and systems is discussed. Some of the activities at the Virtual Engineering Centre, a University of Liverpool initiative, are described and a number of case studies involving a range of applications of Virtual Engineering illustrated.

FPGA Prototyping of Emerging Manycore Architectures for Parallel Programming Research using Formic Boards

Performance evaluation of parallel software and architectural exploration of innovative hardware support face a common challenge with emerging manycore platforms: they are limited by the slow running time and the low accuracy of software simulators. Manycore FPGA prototypes are difficult to build, but they offer great rewards. Software running on such prototypes runs orders of magnitude faster than current simulators. Moreover, researchers gain significant architectural insight during the modeling process. We use the Formic FPGA prototyping board [1], which specifically targets scalable and cost-efficient multi-board prototyping, to build and test a 64-board model of a 512-core, MicroBlaze-based, non-coherent hardware prototype with a full network-on-chip in a 3D-mesh topology. We expand the hardware architecture to include the ARM Versatile Express platforms and build a 520-core heterogeneous prototype of 8 Cortex-A9 cores and 512 MicroBlaze cores. We then develop an MPI library for the prototype and evaluate it extensively using several bare-metal and MPI benchmarks. We find that our processor prototype is highly scalable, models faithfully single-chip multicore architectures, and is a very efficient platform for parallel programming research, being 50,000 times faster than software simulation.