Thermal-mechanical interface crack behaviour of a surface mount solder joint

The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder.

Two new subspecies of birds from the slopes of Mount Pirri, eastern Panama

The two subspecies described below were part of the rich collection made by E. A. Goldman in Eastern Panama, during the season of 1912, while engaged in the Smithsonian Biological Survey of Panama. Other new birds from this collection were described in a recent paper...(Document contains 4 pages)

Oliver Wendell Holmes Jr. y su obra: Una fusión sistemático-existencial

607 p.

Mount Pinatubo's effects on Philippine fisheries

An examination is made of the effects of the eruption of Mount Pinatubo on Luzon Island, northwestern Philippines in June 1991 on the Country's fisheries, considering in particular the coral reef environment, inland fisheries and aquaculture.

SOCIAL-DEVELOPMENT OF INFANTS OF MACACA-THIBETANA AT MOUNT-EMEI, CHINA

The development of infant Macaca thibetana was studied at Mount Emei, China, and compared to that of other macaque species. It was found that there are many common features in the process of infant socialization in species of the genus Macaca: mothers play an important and active role, other group members influence the infants' development to a greater or lesser extent and play is a major activity in the life of infants. Some differences were found to exist, however, between macaque species. These included differences in maternal care behaviour such as 'len', leaving time and weaning time. Paternal behaviours were also found to vary within and among species. Tibetan macaque males care for infants extensively, and they may use infants as an agonistic buffer. The natural and social environment may also influence differences between macaque species in infant development.

NATURAL FOODS AND THEIR ECOLOGICAL IMPLICATIONS FOR MACACA-THIBETANA AT MOUNT EMEI, CHINA

Natural food plants of partly provisioned groups of Macaca thibetana included about 196 species belonging to 135 genera and 72 families. The macaques consumed mainly bamboo shoots and fruits for about 2 months in autumn, whereas they relied on active or passive provisions from visitors, a variety of structural parts of plants and a small amount of invertebrates in late spring and summer and ate mainly mature leaves and bark for the rest of the year. About half of the species eaten came from the dense herb and shrub layers. This forest-dwelling species shows a distinctive feeding and foraging pattern in comparison with other macaques, explaining why M. thibetana has the largest body weight of all macaques.

DRAMATIC CONSEQUENCES OF FOOD HANDOUTS TO MACACA-THIBETANA AT MOUNT-EMEI, CHINA

Food handouts to Macaca thibetana at Mt. Emei have had dramatic consequences for both man and monkey as tourism has increased over the last decade. Food handouts and human submissive behaviour facilitate beg-robbing by the monkeys. which can be regarded as a mixed conditioning chain. Because of their lack of understanding of primate behaviour and resulting inappropriate responses, many visitors have lost possessions and have been severely frightened or even injured; in fact there have been 1 0 deaths as an indirect result over that past 8 years. The appropriate human response proved to be the display of dominance to maintain a distance from a beg-robbing monkey. Road-ranging macaques have also been injured or killed by visitors to obtain meat or bones or merely for amusement. Attempts should be made to eliminate the negative effects of food handouts by increasing visitors' awareness of behavioural and ecological aspects and through aversive conditioning of the macaques.

Mount Vernon Student Association

A collection of materials concerning the Mount Vernon Student Association during 1967-1969 maintained by the School of Theology Library and Archives.

A simulation-based design method to transfer surface mount RF system to flip-chip die implementation

The flip-chip technology is a high chip density solution to meet the demand for very large scale integration design. For wireless sensor node or some similar RF applications, due to the growing requirements for the wearable and implantable implementations, flip-chip appears to be a leading technology to realize the integration and miniaturization. In this paper, flip-chip is considered as part of the whole system to affect the RF performance. A simulation based design is presented to transfer the surface mount PCB board to the flip-chip die package for the RF applications. Models are built by Q3D Extractor to extract the equivalent circuit based on the parasitic parameters of the interconnections, for both bare die and wire-bonding technologies. All the parameters and the PCB layout and stack-up are then modeled in the essential parts' design of the flip-chip RF circuit. By implementing simulation and optimization, a flip-chip package is re-designed by the parameters given by simulation sweep. Experimental results fit the simulation well for the comparison between pre-optimization and post-optimization of the bare die package's return loss performance. This design method could generally be used to transfer any surface mount PCB to flip-chip package for the RF systems or to predict the RF specifications of a RF system using the flip-chip technology.

Hidden land and changing landscape: Narratives about Mount Khangchendzonga among the Lepcha and the Lhopo

This article explores contemporary ‘hidden land’ narrative constructs of Máyel Lyáng and Beyul Dremojong in Sikkim, India, as conceived by the Lepcha and the Lhopo, two ‘scheduled tribes’. Lepcha and Lhopo narratives about these hidden lands in Mount Khangchendzonga inform us about their contemporary and historical, indigenous and Buddhist contexts and the interactions between these contexts. Lhopo perspectives on the hidden Beyul Dremojong echo classical Tibetan Buddhist ‘revealed treasure’ guidebooks and exist within the complex and reciprocal relationship between the Lhopo and the land they inhabit; development initiatives are understood to have caused illness and death in the Lhopo community of Tashiding, often referred to as the geographical ‘center’ of Beyul Dremojong. Contemporary Lepcha comprehensions of Máyel Lyáng, described in oral narratives within an ethnic community whose cosmology is intimately connected with Mount Khangchendzonga, today show some influence of Lhopo interpretations of Beyul Dremojong and the treasure texts; they also reflect Lepcha fears about cultural dispersion. Present-day narratives about both hidden lands reference notable political events in modern Sikkimese history (encounters with the British; the Chinese occupation of Tibet).

Lifetime prediction for power electronics module substrate mount-down solder interconnect

A numerical modeling method for the prediction of the lifetime of solder joints of relatively large solder area under cyclic thermal-mechanical loading conditions has been developed. The method is based on the Miner's linear damage accumulation rule and the properties of the accumulated plastic strain in front of the crack in large area solder joint. The nonlinear distribution of the damage indicator in the solder joints have been taken into account. The method has been used to calculate the lifetime of the solder interconnect in a power module under mixed cyclic loading conditions found in railway traction control applications. The results show that the solder thickness is a parameter that has a strong influence on the damage and therefore the lifetime of the solder joint while the substrate width and the thickness of the baseplate are much less important for the lifetime