Voltage programmable dual-band bandpass/bandstop filter response in a single micro-electro-mechanical device

This paper reports on a switchable multi-band filter response achieved within a single micro-electro-mechanical device. A prototype device fabricated in a SOI process demonstrates a voltage programmable and tunable, dual-band, band-pass/band-stop response. Both analytical and finite element models are introduced in this paper to elucidate the operating principle of the filter and to guide filter design. Voltage programmability of the filter characteristic is demonstrated with the ability to independently tune the centre frequency and bandwidth for each band. A representative measurement shows that the minimum 3 dB-bandwidth (BW) is 155 Hz, 140Hz, and 20 dB-BW is 216 Hz, 203Hz for the upper-band and lower-band center frequencies located at 131.5 kHz and 130.7 kHz, respectively. © 2011 IEEE.

Flexible pneumatic micro-actuators: Analysis and production

Compliant pneumatic micro-actuators are interesting for applications requiring large strokes and forces in delicate environments. These include for instance minimally invasive surgery and assembly of microcomponents. This paper presents a theoretical and experimental analysis of a balloon-type compliant micro-actuator. Finite element modeling is used to describe the complex behavior of these actuators, which is validated through prototype experiments. Prototypes with dimensions ranging from 11mm × 2mm × 0.24mm to 4mm × 1mm × 0.12mm are fabricated by a newly developed production process based on micromilling and micromolding. The larger actuators are capable of delivering out-of-plane strokes of up to 7mm. Further, they have been integrated in a platform with two rotational and one translational degree of freedom. © 2011 Published by Elsevier Ltd.

Micro structures, tensile properties and corrosion behavior of die-cast Mg-4Al-based alloys containing La and/or Ce

In order to study the properties of Mg-Al-RE (AE) series alloys, the Mg-4Al-4RE-0.4Mn (RE= La, Ce/La mischmetal or Ce) alloys were developed. Their microstructures, tensile properties and corrosion behavior have been investigated. The results show that the phase compositions of Mg-4Al-4La-0.4Mn alloy consist of alpha-Mg and Al11La3 phases. While two binary Al-RE (RE = Ce/La) phases, Al11RE3 and Al2RE, are formed in Mg-4Al-4Ce/La-0.4Mn alloy, and Al11Ce3 and Al2Ce are formed in Mg-4Al-4Ce-0.4Mn alloy.

Analysis of micro-failure behaviors in hybrid fiber model composites

Micro-failure modes and statistical fragment lengths in the hybrid fiber and non-hybrid reference composites in the uniaxial tension were investigated. Similiar to the reference experiments, fibers in hybrid strong interface/medium interface fiber composites display a decrease in aspect ratio and an increase in interfacial shear stress (IFSS) with the increase of inter-fiber spacing. While for the fibers with weak interfaces in the hybrid strong interface/weak interface fiber composites, the aspect ratio increases and IFSS decreases with enlargement of inter-fiber spacing, which is contrary to other systems. Finite element numerical analysis was used to interpret the special phenomena.

Winkler springs (p-y curves) for liquefied soil from element tests.

In practice, piles are most often modelled as "Beams on Non-Linear Winkler Foundation" (also known as “p-y spring” approach) where the soil is idealised as p-y springs. These p-y springs are obtained through semi-empirical approach using element test results of the soil. For liquefied soil, a reduction factor (often termed as p-multiplier approach) is applied on a standard p-y curve for the non-liquefied condition to obtain the p-y curve liquefied soil condition. This paper presents a methodology to obtain p-y curves for liquefied soil based on element testing of liquefied soil considering physically plausible mechanisms. Validation of the proposed p-y curves is carried out through the back analysis of physical model tests.

Optimization and finite element analysis for reliable electronic packaging

This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

Macro-Micro Modelling Analysis for High Density Packaged Flip Chips

A wide range of flip chip technologies with solder or adhesives have become dominant solutions for high density packaging applications due to the excellent electrical performance, high I/O density and good thermal performance. This paper discusses the use of modeling technique to predict the reliability of high density packaged flip chips in the humid environment. Reliability assessment is discussed for flip chip package at ultra-fine pitch with anisotropic conductive film (ACF). The purpose of this modeling work is to understand the role that moisture plays in the failure of ACF flip chips. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. Modeling results are consistent with the findings in the experimental work

Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly

Purpose – This paper discusses the use of modelling techniques to predict the reliability of an anisotropic conductive film (ACF) flip chip in a humid environment. The purpose of this modelling work is to understand the role that moisture plays in the failure of ACF flip chips. Design/methodology/approach – A 3D macro-micro finite element modelling technique was used to determine the moisture diffusion and moisture-induced stresses inside the ACF flip chip. Findings – The results show that the ACF layer in the flip chip can be expected to be fully saturated with moisture after 3?h at 121°C, 100%RH, 2?atm test conditions. The swelling effect of the adhesive due to this moisture absorption causes predominately tensile stress at the interface between the adhesive and the metallization, which could cause a decrease in the contact area, and therefore an increase in the contact resistance. Originality/value – This paper introduces a macro-micro modelling technique which enables more detailed 3D modelling analysis of an ACF flip chip than previously.

Thermo-mechanical analysis of the packaging process for micro-electronic displays

Micro-electronic displays are sensitive devices and its performance is easily affected by external environmental factors. To enable the display to perform in extreme conditions, the device must be structurally strengthened, the effects of this packaging process was investigated. A thermo-mechanical finite element analysis was used to discover potential problems in the packaging process and to improve the overall design of the device. The main concern from the analysis predicted that displacement of the borosilicate glass and the Y stress of the adhesive are important. Using this information a design which reduced the variation of displacement and kept the stress to a minimum was suggested

Computer modeling of a micro-manufactured one-turn inductor

The results of a finite element computer modelling analysis of a micro-manufactured one-turn magnetic inductor using the software package ANSYS 10.0 are presented. The inductor is designed for a DC-DC converter used in microelectronic devices. It consists of a copper conductor with a rectangular cross-section plated with an insulation layer and a layer of magnetic core. The analysis has focused on the effects of the frequency and the air gaps on the on the inductance values and the Joule losses in the core and conductor. It has been found that an inductor with small multiple air gaps has lower losses than an inductor with a single larger gap

Thermal fatigue analysis of solar panel structure for micro-satellite applications

Thermal fatigue analysis based on 2D finite difference and 3D finite element methods is carried out to study the performance of solar panel structure during micro-satellite life time. Solar panel primary structure consists of honeycomb structure and composite laminates. The 2D finite difference (I-DEAS) model yields predictions of the temperature profile during one orbit. Then, 3D finite element analysis (ANSYS) is applied to predict thermal fatigue damage of solar panel structure. Meshing the whole structure with 2D multi-layer shell elements with sandwich option is not efficient, as it misses thermal response of the honeycomb structure. So we applied a mixed approach between 3D solid and 2D shell elements to model the solar panel structure without the sandwich option.

Micro-Satellite Structure Fracture Investigation techniques

Mounting accuracy of satellite payload and
ADCS (attitude determination and control subsystem) seats
is one of the requirements to achieve the satellite mission
with satisfactory performance. Deviation of the position of
the mounting seat for Multi-Band-Earth-Imager (MBEI) is
caused by cracks in the plate of the basis unit and bracket
for attachment of MBEI. These cracks were detected during
inspection of the satellite strength mock-up after vibration
testing for air transportation phase. Most probable reason of
the cracking is fatigue damage as strength mock-up
structure was subjected to prolonged vibration loading
during various loading cases. Total vibration duration
during testing is about 56 hours. In order to study the
cracking reasons, finite element modeling of the structural
parts of the basis unit including MBEI bracket and
instrument MBEI is subjected to harmonic response to
simulate vibration loading for the case of air transportation.
Numerical results are compared with the experimental ones,
and mechanical design of the basis-plate unit is modified

Thermal Deformation Analysis of Micro satellite Structure

Mounting accuracy of satellite payload and ADCS (attitude determination and control subsystem) seats is one of the requirements to achieve the satellite mission with acceptable performance. Components of mounting inaccuracy are technological inaccuracies, residual plastic deformations after loading (during transportation and orbital insertion), elastic deformations, and thermal deformations during orbital operation. This paper focuses on estimation of thermal deformations of satellite structure. Thermal analysis is executed by applying finite-difference method (IDEAS) and temperature profile for satellite components case is evaluated. Then, Perform thermal finite-element analysis applying the finite-difference model results as boundary conditions; and calculate the resultant thermal strain. Next, applying the resultant thermal strain, perform finite-element structure analysis to evaluate structure deformations at the payload and ADCS equipments seats.

A multi-fibre multi-layer representative volume element (M2RVE) for prediction of matrix and interfacial damage in composite laminates

Multiscale micro-mechanics theory is extensively used for the prediction of the material response and damage analysis of unidirectional lamina using a representative volume element (RVE). Th is paper presents a RVE-based approach to characterize the materi al response of a multi-fibre cross-ply laminate considering the effect of matrix damage and fibre-matrix interfacial strength. The framework of the homogenization theory for periodic media has been used for the analysis of a 'multi-fibre multi-layer representative volume element' (M2 RVE) representing cross-ply laminate. The non-homogeneous stress-strain fields within the M2RVE are related to the average stresses and strains by using Gauss theorem and the Hill-Mandal strain energy equivalence principle. The interfacial bonding strength affects the in-plane shear stress-strain response significantl y. The material response predicted by M2 RVE is in good agreement with the experimental results available in the literature. The maximum difference between the shear stress predicted using M2 RVE and the experimental results is ~15% for the bonding strength of 30MPa at the strain value of 1.1%

Effect of the crown design and interface lute parameters on the stress-state of a machined crown-tooth system: A finite element analysis

The effect of preparation design and the physical properties of the interface lute on the restored machined ceramic crown-tooth complex are poorly understood. The aim of this work was to determine, by means of three-dimensional finite element analysis (3D FEA) the effect of the tooth preparation design and the elastic modulus of the cement on the stress state of the cemented machined ceramic crown-tooth complex. The three-dimensional structure of human premolar teeth, restored with adhesively cemented machined ceramic crowns, was digitized with a micro-CT scanner. An accurate, high resolution, digital replica model of a restored tooth was created. Two preparation designs, with different occlusal morphologies, were modeled with cements of 3 different elastic moduli. Interactive medical image processing software (mimics and professional CAD modeling software) was used to create sophisticated digital models that included the supporting structures; periodontal ligament and alveolar bone. The generated models were imported into an FEA software program (hypermesh version 10.0, Altair Engineering Inc.) with all degrees of freedom constrained at the outer surface of the supporting cortical bone of the crown-tooth complex. Five different elastic moduli values were given to the adhesive cement interface 1.8 GPa, 4 GPa, 8 GPa, 18.3 GPa and 40 GPa; the four lower values are representative of currently used cementing lutes and 40 GPa is set as an extreme high value. The stress distribution under simulated applied loads was determined. The preparation design demonstrated an effect on the stress state of the restored tooth system. The cement elastic modulus affected the stress state in the cement and dentin structures but not in the crown, the pulp, the periodontal ligament or the cancellous and cortical bone. The results of this study suggest that both the choice of the preparation design and the cement elastic modulus can affect the stress state within the restored crown-tooth complex.