Relationship between the dissolution behaviours and current efficiencies of La, Ce, Pr and Nd in their chloride molten salts

The dissolution behaviours of La and Nd in their chloride molten salts were studied by means of the see-through cell, electrochemical weak polarization and quantum chemistry (extended Huckel molecular orbital). The reasons for the low current efficiencies of rare earth metals and the difference between La and Nd in their own chloride electrolytes on the basis of the solubility, rate of dissolution, and existing state of the metals dissolved as well as the structure of the melts, are discussed.

The synergy between deformation and anodic dissolution of an austenitic stainless steel in acidic chloride solution

In corrosion medium, metals can deform under tensile stress and form a new active surface with the anodic dissolution of the metals being accelerated. At the same time, the anodic dissolution may accelerate the deformation of the metals. The synergy can lead to crack nucleation and development and shorten the service life of the component. Austenitic stainless steel in acidic chloride solution was in active dissolution condition when stress corrosion cracking (SCC) occurred. It is reasonable to assume that the anodic dissolution play an important role, so it's necessary to study the synergy between anodic dissolution and deformation of austenitic stainless steels. The synergy between deformation and anodic dissolution of AISI 321 austenitic stainless steel in an acidic chloride solution was studied in this paper. The corrosion rate of the steel increased remarkably due to the deformation-accelerated anodic and cathodic processes. The creep rate was increased while the yield strength was reduced by anodic dissolution. The analysis by thermal activation theory of deformation showed a linear relationship between the logarithm of creep rate and the logarithm of anodic cur-rent. Besides, the reciprocal of yield strength was also linearly dependent on the logarithm of anodic current. The theoretical deductions were in good agreement with experimental results.

Dissolution kinetics of octadecanethiolate monolayers electro-adsorbed on Au(1 1 1)

Monolayers of octadecanethiolate on Au(1 1 1) surface were formed under electrochemical control. The influence of the formation time on the reductive desorption process was studied by cyclic voltammetry and chronoamperometry. When the formation time is increased, the reductive desorption peak observed on the voltammograms is significantly shifted in the negative direction, while the cathodic charge is only slightly affected. This behaviour is attributed to a higher degree of organisation of the monolayers for longer formation times, highlighting the role of defect sites in promoting the dissolution. A good agreement was found between our experimental chronoamperograms and theoretical models describing the dissolution process by a shrinkage mechanism. It is demonstrated that a reorganisation process takes place, consisting in the merging of small condensed domains into larger ones. This annealing phenomenon is time and potential dependent, the largest condensed domains being obtained for the longest formation times and least negative potentials. © 2008 Elsevier B.V. All rights reserved.

Efects of mineral suspension and dissolution on strength and compressibility of soft carbonate rocks

© 2014 Elsevier B.V.Calcarenites are highly porous soft rocks formed of mainly carbonate grains bonded together by calcite bridges. The above characteristics make them prone to water-induced weathering, frequently featuring large caverns and inland natural underground cavities. This study is aimed to determine the main physical processes at the base of the short- and long-term weakening experienced by these rocks when interacting with water. We present the results of microscale experimental investigations performed on calcarenites from four different sites in Southern Italy. SEM, thin sections, X-ray CT observations and related analyses are used for both the interpretation-definition of the structure changes, and the identification-quantification of the degradation mechanisms. Two distinct types of bonding have been identified within the rock: temporary bonding (TB) and persistent bonding (PB). The diverse mechanisms linked to these two types of bonding explain both the observed fast decrease in rock strength when water fills the pores (short-term effect of water), identified with a short-term debonding (STD), and a long-term weakening of the material, when the latter is persistently kept in water-saturated conditions (long-term effect of water), identified with a long-term debonding (LTD). To highlight the micro-hydro-chemo-mechanical processes of formation and annihilation of the TB bonds and their role in the evolution of the mechanical strength of the material, mechanical tests on samples prepared by drying partially saturated calcarenite powder, or a mix of glass ballotini and calcarenite powder were conducted. The long-term debonding processes have also been investigated, using acid solutions in order to accelerate the reaction rates. This paper attempts to identify and quantify differences between the two types of bonds and the relative micro-scale debonding processes leading to the macro-scale material weakening mechanisms.

Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization

The dissolution of thin film under-bump-metallization (UBM) by molten solder has been one of the most serious processing problems in electronic packaging technology. Due to a higher melting temperature and a greater Sn content, a molten lead-free solder such as eutectic SnAg has a faster dissolution rate of thin film UBM than the eutectic SnPb. The work presented in this paper focuses on the role of 0.5 wt % Cu in the base Sn–3.5%Ag solder to reduce the dissolution of the Cu bond pad in ball grid array applications. We found that after 0.5 wt % Cu addition, the rate of dissolution of Cu in the molten Sn–3.5%Ag solder slows down dramatically. Systematic experimental work was carried out to understand the dissolution behavior of Cu by the molten Sn–3.5%Ag and Sn–3.5%Ag–0.5%Cu solders at 230–250 °C, for different time periods ranging from 1 to 10 min. From the curves of consumed Cu thickness, it was concluded that 0.5 wt % Cu addition actually reduces the concentration gradient at the Cu metallization/molten solder interface which reduces the driving force of dissolution. During the dissolution, excess Cu was found to precipitate out due to heterogeneous nucleation and growth of Cu6Sn5 at the solder melt/oxide interface. In turn, more Cu can be dissolved again. This process continues with time and leads to more dissolution of Cu from the bond pad than the amount expected from the solubility limit, but it occurs at a slower rate for the molten Sn–3.5%Ag–0.5%Cu solder. © 2003 American Institute of Physics.

Visual Observation of Redistribution and Dissolution of Palladium During the Suzuki–Miyaura Reaction

Now you see it, now you don't: A specially designed reactor that heats only a small area of Pd foil during a Suzuki-Miyaura coupling permits observation of the surface changes during the reaction. Dissolution of Pd occurs only in the heated zone, and only in the presence of aryl iodide, whereas deposition of Pd occurs preferentially on the unheated zones adjacent to the reactive zone. SEM and XPS are employed to probe the surface before and after reaction.