Processamento de placas de circuito impresso de equipamentos eletroeletrônicos de pequeno porte

A hydrometallurgical process applicable to printed circuit boards of small electrical and electronic devices was developed. This involved three leaching steps (60 ºC, 2 h): 6 mol L-1 NaOH, 6 mol L-1 HCl and aqua regia. NaOH removed the resin and flame retardant that covered the circuit boards. HCl dissolved the most electropositive metals and a small amount of copper (~0.3 wt%). Aqua regia dissolved the noble metals. Silver precipitated as AgCl. Gold and platinum were quantitatively extracted with pure methyl-isobutylketone and Alamine 336 (10 % vol. in kerosene), respectively. Slow evaporation of the raffinate crystallized CuCl2.4H2O (89% yield).

Algorithmic Solutions for Combinatorial Problems in Resource Management of Manufacturing Environments

This thesis studies the use of heuristic algorithms in a number of combinatorial problems that occur in various resource constrained environments. Such problems occur, for example, in manufacturing, where a restricted number of resources (tools, machines, feeder slots) are needed to perform some operations. Many of these problems turn out to be computationally intractable, and heuristic algorithms are used to provide efficient, yet sub-optimal solutions. The main goal of the present study is to build upon existing methods to create new heuristics that provide improved solutions for some of these problems. All of these problems occur in practice, and one of the motivations of our study was the request for improvements from industrial sources. We approach three different resource constrained problems. The first is the tool switching and loading problem, and occurs especially in the assembly of printed circuit boards. This problem has to be solved when an efficient, yet small primary storage is used to access resources (tools) from a less efficient (but unlimited) secondary storage area. We study various forms of the problem and provide improved heuristics for its solution. Second, the nozzle assignment problem is concerned with selecting a suitable set of vacuum nozzles for the arms of a robotic assembly machine. It turns out that this is a specialized formulation of the MINMAX resource allocation formulation of the apportionment problem and it can be solved efficiently and optimally. We construct an exact algorithm specialized for the nozzle selection and provide a proof of its optimality. Third, the problem of feeder assignment and component tape construction occurs when electronic components are inserted and certain component types cause tape movement delays that can significantly impact the efficiency of printed circuit board assembly. Here, careful selection of component slots in the feeder improves the tape movement speed. We provide a formal proof that this problem is of the same complexity as the turnpike problem (a well studied geometric optimization problem), and provide a heuristic algorithm for this problem.

Protopiirilevyjen halpavalmistus - tilannekatsaus 2014

Työssä selvitetään protopiirilevyjen halpavalmistuksen teknisiä rajoitteita ja kustannuksia. Tutkimuksessa kerätään tietoja piirilevyvalmistajien verkkosivuilta ja vertaillaan eri valmistajien hintoja ja piirilevyjen valmistukseen liittyviä teknisiä rajoitteita. Selvitetään myös piirilevyjen valmistuksen markkinatilannetta.

Model-Based Troubleshooting of Digital Systems

This thesis describes a methodology, a representation, and an implemented program for troubleshooting digital circuit boards at roughly the level of expertise one might expect in a human novice. Existing methods for model-based troubleshooting have not scaled up to deal with complex circuits, in part because traditional circuit models do not explicitly represent aspects of the device that troubleshooters would consider important. For complex devices the model of the target device should be constructed with the goal of troubleshooting explicitly in mind. Given that methodology, the principal contributions of the thesis are ways of representing complex circuits to help make troubleshooting feasible. Temporally coarse behavior descriptions are a particularly powerful simplification. Instantiating this idea for the circuit domain produces a vocabulary for describing digital signals. The vocabulary has a level of temporal detail sufficient to make useful predictions abut the response of the circuit while it remains coarse enough to make those predictions computationally tractable. Other contributions are principles for using these representations. Although not embodied in a program, these principles are sufficiently concrete that models can be constructed manually from existing circuit descriptions such as schematics, part specifications, and state diagrams. One such principle is that if there are components with particularly likely failure modes or failure modes in which their behavior is drastically simplified, this knowledge should be incorporated into the model. Further contributions include the solution of technical problems resulting from the use of explicit temporal representations and design descriptions with tangled hierarchies.

Design of boundary-scan testing in CMOS image sensors for industrial applications: internship repor

Tests on printed circuit boards and integrated circuits are widely used in industry,resulting in reduced design time and cost of a project. The functional and connectivity tests in this type of circuits soon began to be a concern for the manufacturers, leading to research for solutions that would allow a reliable, quick, cheap and universal solution. Initially, using test schemes were based on a set of needles that was connected to inputs and outputs of the integrated circuit board (bed-of-nails), to which signals were applied, in order to verify whether the circuit was according to the specifications and could be assembled in the production line. With the development of projects, circuit miniaturization, improvement of the production processes, improvement of the materials used, as well as the increase in the number of circuits, it was necessary to search for another solution. Thus Boundary-Scan Testing was developed which operates on the border of integrated circuits and allows testing the connectivity of the input and the output ports of a circuit. The Boundary-Scan Testing method was converted into a standard, in 1990, by the IEEE organization, being known as the IEEE 1149.1 Standard. Since then a large number of manufacturers have adopted this standard in their products. This master thesis has, as main objective: the design of Boundary-Scan Testing in an image sensor in CMOS technology, analyzing the standard requirements, the process used in the prototype production, developing the design and layout of Boundary-Scan and analyzing obtained results after production. Chapter 1 presents briefly the evolution of testing procedures used in industry, developments and applications of image sensors and the motivation for the use of architecture Boundary-Scan Testing. Chapter 2 explores the fundamentals of Boundary-Scan Testing and image sensors, starting with the Boundary-Scan architecture defined in the Standard, where functional blocks are analyzed. This understanding is necessary to implement the design on an image sensor. It also explains the architecture of image sensors currently used, focusing on sensors with a large number of inputs and outputs.Chapter 3 describes the design of the Boundary-Scan implemented and starts to analyse the design and functions of the prototype, the used software, the designs and simulations of the functional blocks of the Boundary-Scan implemented. Chapter 4 presents the layout process used based on the design developed on chapter 3, describing the software used for this purpose, the planning of the layout location (floorplan) and its dimensions, the layout of individual blocks, checks in terms of layout rules, the comparison with the final design and finally the simulation. Chapter 5 describes how the functional tests were performed to verify the design compliancy with the specifications of Standard IEEE 1149.1. These tests were focused on the application of signals to input and output ports of the produced prototype. Chapter 6 presents the conclusions that were taken throughout the execution of the work.

Desenvolvimento de antenas de microfita e antenas DRA Broadband

The search for ever smaller device and without loss of performance has been increasingly investigated by researchers involving applied electromagnetics. Antennas using ceramics materials with a high dielectric constant, whether acting as a substract element of patch radiating or as the radiant element are in evidence in current research, that due to the numerous advantages offered, such as: low profile, ability to reduce the its dimensions when compared to other devices, high efficiency of ratiation, suitability the microwave range and/or millimeter wave, low temperature coefficient and low cost. The reason for this high efficiency is that the dielectric losses of ceramics are very low when compared to commercially materials sold used in printed circuit boards, such as fiberglass and phenolite. These characteristics make ceramic devices suitable for operation in the microwave band. Combining the design of patch antennas and/or dielectric resonator antenna (DRA) to certain materials and the method of synthesis of these powders in the manufacture of devices, it s possible choose a material with a dielectric constant appropriate for the design of an antenna with the desired size. The main aim of this work is the design of patch antennas and DRA antennas on synthesis of ceramic powders (synthesis by combustion and polymeric precursors - Pe- chini method) nanostructured with applications in the microwave band. The conventional method of mix oxides was also used to obtain nanometric powders for the preparation of tablets and dielectric resonators. The devices manufactured and studied on high dielectric constant materials make them good candidates to have their small size compared to other devices operating at the same frequency band. The structures analyzed are excited by three different techniques: i) microstrip line, ii) aperture coupling and iii) inductive coupling. The efficiency of these techniques have been investigated experimentally and compared with simulations by Ansoft HFSS, used in the accurate analysis of the electromagnetic behavior of antennas over the finite element method (FEM). In this thesis a literature study on the theory of microstrip antennas and DRA antenna is performed. The same study is performed about the materials and methods of synthesis of ceramic powders, which are used in the manufacture of tablets and dielectric cylinders that make up the devices investigated. The dielectric media which were used to support the analysis of the DRA and/or patch antennas are analyzed using accurate simulations using the finite difference time domain (FDTD) based on the relative electrical permittivity (er) and loss tangent of these means (tand). This work also presents a study on artificial neural networks, showing the network architecture used and their characteristics, as well as the training algorithms that were used in training and modeling some parameters associated with the devices investigated

Flexural Test on Recycled Polystyrene

In socio-environmental scenario increased the nature resources concern beyond products and subproducts reuse. Recycling is the approach for a material or energy reintroducing in productive system. This method allows the reduction of garbage volume dumped in environment, saving energy and decreasing the requirement of natural resources use. In general, the ending of expanded polystyrene is deposited sanitary landfills or garbage dumps without control that take large volume and spreads easily by aeolian action, with consequently environmental pollution, however, the recycling avoids their misuse and the obtainment from petroleum is reduced. This work recycled expanded polystyrene via merger and/or dissolution by solvents for the production of integrated circuits boards. The obtained material was characterized in flexural mode according to ASTM D 790 and results were compared with phenolite, traditionally used. Specimens fractures were observed by electronic microscopy scanning in order to establish patterns. Expanded Polyestirene recycled as well as phenolite were also thermo analyzed by TGA and DSC. The method using dissolution produced very brittle materials. The method using merger showed no voids formation nor increased the brittleness of the material. The recycled polystyrene presented a strength value significantly lower than that for the phenolite. (C) 2011 Published by Elsevier Ltd. Selection and peer-review under responsibility of ICM11

Estudo da compatibilidade eletromagnética em placa de circuito impresso de centrais telefônicas

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Análise de integridade de sinal e crosstalk em placa de circuito impresso

Pós-graduação em Engenharia Elétrica - FEIS

A qualidade de placas de circuito impresso confeccionadas a partir de poliestireno reciclado

Pós-graduação em Engenharia Mecânica - FEG

Desenvolvimento de um computador de bordo para veículo Baja-SAE

The objective of this paper is show the development of an Eletronic Control Unit (ECU) for Baja-SAE vehicles from its requirements to final implementation. An ECU for Baja-SAE vehicles is made of electric and electronic circuits (appropriated to the hostile situations of an off-road competition) able to make important measurements for the running or stand-by vehicle performance. For this development, some concepts were studied: embedded electronics concepts (mainly microcontrollers and data acquisition circuits) and sensoring. Both the studies were made considering the off-road environment. After these initial studies, the elaboration of the basics hardware and software (under simulations) has begun, and this elaboration objectives maximum performance and low implementation cost. After the theorical studies, basic definition of the hardware and software’s architectures and simulations, the printed circuit boards (PCB) were made, as exhaustive tests in these boards for debugging and verify if the boards work well. Once the system was tested in the university, it ran into a regional Southeast competition in 2010, that definitely proved the efficiency of the whole system

Estudo para a implementação de um sistema de desbaste de cobre para manufatura de placas de circuito impresso

This paper presents a study on the development of a manufacturing system of printed circuit boards through copper milling. An advantage of this system is the replacement of chemical processes by physical process presenting a sustainable solution. The paper uses programs that will generate G-code needed to establish the coordinates where the milling forms the tracks. After obtaining the code, it will be transformed into steps that will be sent through the serial port to the microcontroller and the serial communication control will be in software. After obtaining information the microcontroller will execute the movement of the stepper motors through their drivers, H-bridge, the microcontroller also drives the spindle motor responsible for rotating the grinding tool, using a driver with a optocoupler and TRIAC

Reciclagem de poliestireno expandido: compósito com fibras de algodão para a confecção de placas de circuito impresso

In this work polymeric composites reinforced with cotton fibers, from the textile industry, were developed in order to manufacture printed circuit boards. It was used expanded polystyrene (EPS) as a thermoplastic matrix by melting it. For the obtention of 10% and 15% of fiber volume fraction in cotton fibers composites, it was used wasted cotton fibers as an incentive of recycling and reusing of the domestic and industrial wastes as well as for Expanded Polystyrene(EPS). The mechanical properties of the composites were evaluated by tensile and flexural strength from standardized test methods. Composites were characterized by a Scanning Electron Microscopy (SEM), Thermogravimetry (TG/DTG), Differential Scanning Calorimetry (DSC) and dielectric analysis. The analysis of the results showed that fiber in the composite directly influenced in the thermal and mechanical properties

Reciclagem de poliestireno expandido: compósito com fibras de sisal para confecção de placas de circuito impresso

In this work polystyrene composites reinforced with recycled sisal fibers were processed, in order to apply in the manufacture of printed circuit boards. A thermoplastic matrix of recycled polystyrene was used, this material came from waste expanded polystyrene (EPS) used in appliance's packages. Composites were prepared with 15% and 25% of sisal fibers. To obtain the composites, wasted EPS and natural sisal fibers were chosen, to encourage recycling and reuse of household waste and also the use of renewable resources. The composites were analyzed by standard tensile and flexural test, in order to verify the mechanical properties of the material. The characterization of the composite was done by scanning electron microscopy (SEM) , thermogravimetry (TGA / DTG) , differential scanning calorimetry (DSC) and dielectric analysis . The analysis of the results showed that the percentage of fibers in the composite influences directly the thermal and mechanical properties. Plates with a lower percentage of fibers showed superior properties at a higher percentage. The composite material obtained is easy to process and it's use is feasible for the confection of printed circuit boards, considering it's mechanical, thermal and insulative properties

Analysis of the influence of baffles and shields on the cooling of a digital transmission equipment

In this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and, the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels.