912 resultados para printed circuit boards


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This paper proposes two methods to improve the modelling of thin film transistors (TFTs). The first involves integrating Poissons equation numerically, given a density of trap states and other relevant material parameters including a constant mobility. Theresult is conductance as a numerical function of gate voltage. The second method recognizes that the data for areal conductance found by numerical integration, may easily be found by measurement without making assumptions about the density of trap states.

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This paper describes a unified approach to modelling the polysilicon thin film transistor (TFT) for the purposes of circuit design. The approach uses accurate methods of predicting the channel conductance and then fitting the resulting data with a polynomial. Two methods are proposed to find the channel conductance: a device model and measurement. The approach is suitable because the TFT does not have a well defined threshold voltage. The polynomial conductance is then integrated generally to find the drain current and channel charge, necessary for a complete circuit model. © 1991 The Japan Society of Applied Physics.

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The GTO model presented in this paper uses analytical expressions to describe the internal physics of the device. It has been implemented to run as compiled code in the SPICE simulation package and as a MAST template in the Saber simulator. A rigorous comparison of measured simulated waveforms and performance parameters (including turn-off energies) for a 3000A device is described and discussed.

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This paper presents a time-stepping shaker modeling scheme. The new method improves the accuracy of analysis of armature-position-dependent inductances and force factors, analysis of axial variation of current density in copper plates (short-circuited turns), and analysis of cooling holes in the magnetic circuit. Linear movement modeling allows armature position to be precisely included in the shaker analysis. A more accurate calculation of eddy currents in the coupled circuit is in particular crucial for the shaker analysis in a mid-or high-frequency operation range. Large currents in a shaker, including eddy currents, incur large Joule losses, which in turn require the use of a cooling system to keep temperature at bay. Sizable cooling holes have influence on the saturation state of iron poles, and hence have to be properly taken into account.

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This paper presents a practical destruction-free parameter extraction methodology for a new physics-based circuit simulator buffer-layer Integrated Gate Commutated Thyristor (IGCT) model. Most key parameters needed for this model can be extracted by one simple clamped inductive-load switching experiment. To validate this extraction method, a clamped inductive load switching experiment was performed, and corresponding simulations were carried out by employing the IGCT model with parameters extracted through the presented methodology. Good agreement has been obtained between the experimental data and simulation results.

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The laser is a major source of nonlinearity for optical fibre communication systems. In this paper, we propose a CMOS analogue predistortion circuit to reduce laser nonlinearity for wideband optical fibre links. The circuit uses a nonlinearity having the inverse transfer characteristic of the directly modulated vertical cavity surface emitting laser (VCSEL). It is shown by post-layout simulation that the predistortion circuit shows 12dBm improvement in the optical fibre system. The optical fibre transmitter front-end with predistortion lineariser is being fabricated using the austriamicrosystems (AMS) 0.3 5μm CMOS technology.

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A process to fabricate solution-processable thin-film transistors (TFTs) with a one-step self-aligned definition of the dimensions in all functional layers is demonstrated. The TFT-channel, semiconductor materials, and effective gate dimention of different layers are determined by a one-step imprint process and the subsequent pattern transfer without the need for multiple patterning and mask alignment. The process is compatible with fabrication of large-scale circuits. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

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Horizontal curved, vertical curved and V-shaped otter boards were studied to compare their relative efficiency under identical fishing conditions. The gear operated with V-shaped otter boards performed well followed by the gear fitted with horizontal curved boards. Vertical curved boards were found to be comparatively less efficient, but with slight modification, can be used advantageously for bottom and off bottom fishes. Fishing at various depths with horizontal curved and V-shaped otter boards at different scope ratios showed better performance of horizontal curved boards at a scope ratio of 1:6 and V-shaped otter boards at a scope ratio of 1:5.

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Processing technique and physical characteristics of thermal insulation boards prepared from coconut pith using rubber latex as the binding agent are reported in this communication. In view of the easy processing, low cost and comparable physical properties with other insulating materials available indigenously, manufacture of these boards appears to be promising.

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The paper gives briefly the experiments carried out to determine the optimum weight of otter board that should be used for a trawl gear for better efficiency.

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V shaped all steel boards, with their inherent stability to tide over obstacles and mud, interchangeability of starboard and portside boards are found to be superior to conventional flat rectangular boards for bottom trawling. These are cheaper in construction, offer less resistance and give longer service. Comparative trials with the two types of boards showed significant difference in tension between the boards but not in catch or horizontal opening.

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Integration of a piezoelectric high frequency ultrasound (HFUS) array with a microfabricated application specific integrated circuit (ASIC) performing a range of functions has several advantages for ultrasound imaging. The number of signal cables between the array/electronics and the data acquisition / imaging system can be reduced, cutting costs and increasing functionality. Electrical impedance matching is also simplified and the same approach can reduce overall system dimensions for applications such as endoscopic ultrasound. The work reported in this paper demonstrates early ASIC operation with a piezocomposite HFUS array operating at approximately 30 MHz. The array was tested in three different modes. Clear signals were seen in catch-mode, with an external transducer as a source of ultrasound, and in pitch-mode with the external transducer as a receiver. Pitch-catch mode was also tested successfully, using sequential excitation on three array elements, and viable signals were detected. However, these were relatively small and affected by interference from mixed-signal sources in the ASIC. Nevertheless, the functionality and compatibility of the two main components of an integrated HFUS - ASIC device have been demonstrated and the means of further optimization are evident.