987 resultados para 100-625B
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2008
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R. Zwiggelaar, '100 Jaar rontgen straling: wisselwerking tussen theorie, experiment en simulatie', Nederlands Tijdschrift voor Natuurkunde 61 (12), 207-209 (1995)
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25 hojas : ilustraciones, cuadros.
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We have implemented a large-scale classical molecular dynamics simulation at constant temperature to provide a theoretical insight into the results of a recently performed experiment on the monolayer and multi-layer formations of molecular films on the Si(100) reconstructed dimerized surface. Our simulation has successfully reproduced all of the morphologies observed on the monolayer film by this experiment. We have obtained the formation of both c(4 4) and c(4 3) structures of the molecules and have also obtained phase transitions of the former into the latter.
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This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil arc presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.
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This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.
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This paper presents the assembly process using next generation electroformed stencils and Isotropic Conductive Adhesives (ICAs) as interconnection material. The utilisation of ICAs in flip-chip assembly process is investigated as an alternative to the lead and lead-free solder alloys and aims to ensure a low temperature (T < 100 °C) assembly process. The paper emphasizes and discusses in details the assembly of a flip-chip package based on copper columns bumped die and substrate with stencil printed ICA deposits at sub-100 μm pitch. A computational modelling approach is undertaken to provide comprehensive results on reliability trends of ICA joints subject to thermal cycling of the flip-chip assembly based on easy to use damage criteria and damage evaluation. Important design parameters in the package are selected and investigated using numerical modelling techniques to provide knowledge and understanding of their impact on the thermo-mechanical behaviour of the flip-chip ICA joints. Sensitivity analysis of the damage in the adhesive material is also carried out. Optimal design rules for enhanced performance and improved thermo-mechanical reliability of ICA assembled flip-chip packages are finally formulated.
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: Static calculation and preliminary kinetic Monte Carlo simulation studies are undertaken for the nucleation and growth on a model system which follows a Frank-van der Merwe mechanism. In the present case, we consider the deposition of Ag on Au(100) and Au(111) surfaces. The interactions were calculated using the embedded atom model. The kinetics of formation and growth of 2D Ag structures on Au(100) and Au(111) is investigated and the influence of surface steps on this phenomenon is studied. Very different time scales are predicted for Ag diffusion on Au(100) and Au(111), thus rendering very different regimes for the nucleation and growth of the related 2D phases. These observations are drawn from the application of a model free of any adjustable parameter.