860 resultados para plastic recycling


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Thermal barrier coatings with a columnar microstructure are prone to erosion damage by a mechanism of surface cracking upon impact by small foreign particles. In order to explore this erosion mechanism, the elastic indentation and the elastic-plastic indentation responses of a columnar thermal barrier coating to a spherical indenter were determined by the finite element method and by analytical models. It was shown that the indentation response is intermediate between that of a homogeneous half-space and that given by an elastic-plastic mattress model (with the columns behaving as independent non-linear springs). The sensitivity of the indentation behaviour to geometry and to the material parameters was explored: the diameter of the columns, the gap width between columns, the coefficient of Coulomb friction between columns and the layer height of the thermal barrier coating. The calculations revealed that the level of induced tensile stress is sufficient to lead to cracking of the columns at a depth of about the column radius. It was also demonstrated that the underlying soft bond coat can undergo plastic indentation when the coating comprises parallel columns, but this is less likely for the more realistic case of a random arrangement of tapered columns. © 2009 Elsevier B.V.

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Six on-farm trials were conducted from 1 August to 23 November 2004 in two different environments such as homestead ditches (10 to 17 square meters) and plastic barrels (240 liters) to develop techniques for nonoculture [sic] of climbing perch, Anabas testudineus, stinging catfish, Heteropneustes fossilis and walking catfish, Clarias batrachus for poor and landless people who have no access to pond. Stocking density for ditch was 10 fry/square meter while that for barrel was 20 fry/cubic meter. The fishes were fed with 3-test diets viz. low-cost formulated feed (rice bran 20%, wheat meal 10%, mustered [sic] oil cake 35%, poultry offal 35%), live foods (chopped snails and clams), and a commercial feed (Saudi-Bangla feed, starter 3: first month and grower-1: subsequent two months) and designated as T1, T2 and T3, respectively. Feeding rate was the same in all the treatments viz. 10% of body weight (first two months), 8% (third month) and 6% (fourth month). T1 and T2 had three replications while T3 had two replications. Water temperature was recorded weekly while fish growth was monitored monthly. After 4 months' rearing, H. fossilis and C. batrachus in ditches and barrels attained higher average weight in T2 followed by T3 and T1 while A. testudineus in barrels also attained higher average weight in T2. The variation in net weight gain by A. testudineus in ditch fed test diets T2 and T3 was not significantly different (P>0.05) though the net gain in both T2 and T3 was significantly (P<0.05) higher than that of T1. The yield of climbing perch as obtained from T1, T2 and T3 was 988, 1136 and 1185 kg/ha, respectively while that stinging catfish was 395, 242 and 444 kg/ha and walking catfish was 1605, 2,099 and 1,654 kg/ha respectively. All the three species showed significantly lower growth rate in barrels than in ditches.

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Amorphous silicon thin-film transistors and pixel driver circuits for organic light-emitting diode displays have been fabricated on plastic substrates. Pixel circuits demonstrate sufficient current delivery and long-term stable operation. © 2005 IEEE.

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A constitutive equation is developed for geometrically-similar sharp indentation of a material capable of elastic, viscous, and plastic deformation. The equation is based on a series of elements consisting of a quadratic (reversible) spring, a quadratic (time-dependent, reversible) dashpot, and a quadratic (time-independent, irreversible) slider-essentially modifying a model for an elastic-perfectly plastic material by incorporating a creeping component. Load-displacement solutions to the constitutive equation are obtained for load-controlled indentation during constant loading-rate testing. A characteristic of the responses is the appearance of a forward-displacing "nose" during unloading of load-controlled systems (e.g., magnetic-coil-driven "nanoindentation" systems). Even in the absence of this nose, and the associated initial negative unloading tangent, load-displacement traces (and hence inferred modulus and hardness values) are significantly perturbed on the addition of the viscous component. The viscous-elastic-plastic (VEP) model shows promise for obtaining material properties (elastic modulus, hardness, time-dependence) of time-dependent materials during indentation experiments.

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This chapter focuses on relationships between plastic deformation structures and mechanical properties in metals and alloys deforming by dislocation glide. We start by summarizing plastic deformation processes, then look at the fundamental mechanisms of plastic deformation and explore how deformation structures evolve. We then turn to experimental techniques for characterization which have allowed deformation microstructures to be quantified in terms of common structural parameters. The microstructural evolution has been described over many length scales and analyzed theoretically based on general principles. The deformation microstructures are related to work hardening stages. Finally we identify correlations between a wide range of microstructural features and mechanical properties, particularly flow stress, and use experimental observations to illustrate their inter-relationships.

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The design and manufacture of a prototype chip level power supply is described, with both simulated and experimental results. Of particular interest is the inclusion of a fully integrated on-chip LC filter. A high switching frequency of 660MHz and the design of a device drive circuit reduce losses by supply stacking, low-swing signaling and charge recycling. The paper demonstrates that a chip level converter operating at high frequency can be built and shows how this can be achieved, using zero voltage switching techniques similar to those commonly used in larger converters. Both simulations and experimental data from a fabricated circuit in 0.18μm CMOS are included. The circuit converts 2.2V to 0.75∼1.0V at ∼55mA. ©2008 IEEE.