918 resultados para melt extrusion


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Large, single grain Nd-Ba-Cu-O (NdBCO) composite samples of NdBa2Cu3O7-δ (Nd-123) containing 15 and 20 mol. % non-superconducting Nd4Ba2Cu2O10 (Nd-422) phase inclusions have been fabricated successfully by a variety of techniques based on top-seeded melt growth under reduced oxygen partial pressure. Specifically, individual grains up to 2cm in diameter have been grown using (100) oriented MgO seeding, self (NdBCO) seeding at elevated temperature and self-seeding of Ag and Au doped precursor pellets. The latter exhibit a reduced peritectic decomposition temperature compared with the undoped compound. These techniques, which vary in degree of difficulty and hence reliability, yield grains with a range of microstructural homogeneity. This paper describes the general aspects of large NdBCO grain fabrication and presents the results of the different fabrication techniques.

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Future applications of high temperature superconductors require bulk materials of a complex shape. The multi-seeded-melt-growth process (MSMG) represents a promising technique for obtaining qualitatively well oriented bulk materials with different kinds of shape. In the MSMG process, several seeds are placed on a precursor pellet, from which the growth of the bulk starts. A certain problem of the MSMG process is that grain boundaries become inevitable when the growth fronts of two neighboring seeds collide. These grain boundaries are responsible for a reduction of the critical currents and pose a problem for high current applications. By polishing the sample step by step, the influence of the grain boundaries was investigated by scanning Hall probe measurements and by the magnetoscan technique. Additionally, optical microscopy and electron microscopy were employed to investigate the details of the microstructure. © 2005 IEEE.

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Single grain REBa2C3uO7 ((RE)BCO, where RE is a rare earth element or yttrium) bulk superconducting materials have significant potential for a variety of engineering applications due to their ability to trap high magnetic fields. However, it is well known that the presence of grain boundaries coupled with a high angle of misorientation (typically 5�) significantly reduces the critical current density, J c , in all forms of high temperature superconducting materials. It is of considerable fundamental and technological interest, therefore, to investigate the grain boundary properties of bulk, film and tape (RE)BCO. We report a successful multi-seeding technique for the fabrication of fully aligned, artificial (0��misalignment) grain boundaries within large grain YBCO bulk superconductors using bridge-shaped seeds. The microstructure and critical current densities of the grain boundaries produced by this technique have been studied in detail.

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Neutron scattering experiments are fundamental to the study of magnetic order and related phenomena in a range of superconducting and magnetic materials. Traditional methods of crystal growth, however, do not yield single crystals of sufficient size for practical neutron scattering measurements. In this paper, we demonstrate the growth of relatively pure, large Y Ba 2Cu 3O 7 single crystals up to 30mm in diameter using a top seeded melt growth process. The characterization of the microstructural and magnetic properties of these crystals indicates that they contain <2% of impurity phases and, hence, exhibit only weak flux pinning behaviour. © 2012 IOP Publishing Ltd.

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We report the dependence of thermal conductivity, thermoelectric power and electrical resistivity on temperature for a bulk, large grain melt-processed Y-Ba-Cu-O (YBCO) high temperature superconductor (HTS) containing two grains separated by a well-defined grain boundary. Transport measurements at temperatures between 10 and 300 K were carried out both within one single grain (intra-granular properties) and across the grain boundary (inter-granular properties). The influence of an applied external magnetic field of up to 8 T on the measured sample properties was also investigated. The presence of the grain boundary is found to affect strongly the electrical resistivity of the melt-processed bulk sample, but has almost no effect on its thermoelectric power and thermal conductivity, within experimental error. The results of this study provide direct evidence that the heat flow in multi-granular melt-processed YBCO bulk samples should be virtually unaffected by the presence of grain boundaries in the material. © 2013 IOP Publishing Ltd.

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We show that tubes of melt cast Bi-2212 used as current leads for LTS magnets can also act as efficient magnetic shields. The magnetic screening properties under an axial DC magnetic field are characterized at several temperatures below the liquid nitrogen temperature (77 K). Two main shielding properties are studied and compared with those of Bi-2223, a material that has been considered in the past for bulk magnetic shields. The first property is related to the maximum magnetic flux density that can be screened, Blim; it is defined as the applied magnetic flux density below which the field attenuation measured at the centre of the shield exceeds 1000. For a cylinder of Bi-2212 with a wall thickness of 5 mm and a large ratio of length over radius, Blim is evaluated to 1 T at T = 10 K. This value largely exceeds the Blim value measured at the same temperature on similar tubes of Bi-2223. The second shielding property that is characterized is the dependence of Blim with respect to variations of the sweep rate of the applied field, dBapp/dt. This dependence is interpreted in terms of the power law E = Ec(J/Jc)^n and allows us to determine the exponent n of this E(J) characteristics for Bi-2212. The characterization of the magnetic field relaxation involves very small values of the electric field. This gives us the opportunity to experimentally determine the E(J) law in an unexplored region of small electric fields. Combining these results with transport and AC shielding measurements, we construct a piecewise E(J) law that spans over 8 orders of magnitude of the electric field.

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Robust climbing in unstructured environments has been one of the long-standing challenges in robotics research. Among others, the control of large adhesion forces is still an important problem that significantly restricts the locomotion performance of climbing robots. The main contribution of this paper is to propose a novel approach to autonomous robot climbing which makes use of hot melt adhesion (HMA). The HMA material is known as an economical solution to achieve large adhesion forces, which can be varied by controlling the material temperature. For locomotion on both inclined and vertical walls, this paper investigates the basic characteristics of HMA material, and proposes a design and control of a climbing robot that uses the HMA material for attaching and detaching its body to the environment. The robot is equipped with servomotors and thermal control units to actively vary the temperature of the material, and the coordination of these components enables the robot to walk against the gravitational forces even with a relatively large body weight. A real-world platform is used to demonstrate locomotion on a vertical wall, and the experimental result shows the feasibility and overall performances of this approach. © 2013 Elsevier B.V. All rights reserved.

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Physical connection and disconnection control has practical meanings for robot applications. Compared to conventional connection mechanisms, bonding involving a thermal process could provide high connection strength, high repeatability, and power-free connection maintenance, etc. In terms of disconnection, an established bond can be easily weakened with a temperature rise of the material used to form the bond. Hot melt adhesives (HMAs) are such material that can form adhesive bonds with any solid surfaces through a thermally induced solidification process. This paper proposes a novel control method for automatic connection and disconnection based on HMAs. More specifically, mathematical models are first established to describe the flowing behavior of HMAs at higher temperatures, as well as the temperature-dependent strength of an established HMA bond. These models are then validated with a specific type of HMA in a minimalistic robot setup equipped with two mechatronic devices for automated material handling. The validated models are eventually used for determining open parameters in a feedback controller for the robot to perform a pick-and-place task. Through a series of trials with different wooden and aluminum parts, we evaluate the performance of the automatic connection and disconnection methods in terms of speed, energy consumption, and robustness. © 1996-2012 IEEE.

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Robust climbing in unstructured environments is a long-standing challenge in robotics research. Recently there has been an increasing interest in using adhesive materials for that purpose. For example, a climbing robot using hot melt adhesives (HMAs) has demonstrated advantages in high attachment strength, reasonable operation costs, and applicability to different surfaces. Despite the advantages, there still remain several problems related to the attachment and detachment operations, which prevent this approach from being used in a broader range of applications. Among others, one of the main problems lies in the fact that the adhesive characteristics of this material were not fully understood fin the context of robotic climbing locomotion. As a result, the previous robot often could not achieve expected locomotion performances and "contaminated" the environment with HMAs left behind. In order to improve the locomotion performances, this paper focuses on attachment and detachment operations in robot climbing with HMAs. By systematically analyzing the adhesive property and bonding strength of HMAs to different materials, we propose a novel detachment mechanism that substantially improves climbing performances without HMA traces. © 2012 IEEE.

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The capability of extending body structures is one of the most significant challenges in the robotics research and it has been partially explored in self-reconfigurable robotics. By using such a capability, a robot is able to adaptively change its structure from, for example, a wheel like body shape to a legged one to deal with complexity in the environment. Despite their expectations, the existing mechanisms for extending body structures are still highly complex and the flexibility in self-reconfiguration is still very limited. In order to account for the problems, this paper investigates a novel approach to robotic body extension by employing an unconventional material called Hot Melt Adhesives (HMAs). Because of its thermo-plastic and thermo-adhesive characteristics, this material can be used for additive fabrication based on a simple robotic manipulator while the established structures can be integrated into the robot's own body to accomplish a task which could not have been achieved otherwise. This paper first investigates the HMA material properties and its handling techniques, then evaluates performances of the proposed robotic body extension approach through a case study of a "water scooping" task. © 2012 IEEE.

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The ability of large-grain (RE)Ba2Cu3O7-δ ((RE)BCO; RE = rare earth) bulk superconductors to trap magnetic fields is determined by their critical current. With high trapped fields, however, bulk samples are subject to a relatively large Lorentz force, and their performance is limited primarily by their tensile strength. Consequently, sample reinforcement is the key to performance improvement in these technologically important materials. In this work, we report a trapped field of 17.6 T, the largest reported to date, in a stack of two silver-doped GdBCO superconducting bulk samples, each 25 mm in diameter, fabricated by top-seeded melt growth and reinforced with shrink-fit stainless steel. This sample preparation technique has the advantage of being relatively straightforward and inexpensive to implement, and offers the prospect of easy access to portable, high magnetic fields without any requirement for a sustaining current source. © 2014 IOP Publishing Ltd.