434 resultados para FPGA


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Pós-graduação em Ciência da Computação - IBILCE

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Pós-graduação em Engenharia Elétrica - FEIS

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Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

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As redes de acesso usando cabos de cobre atualmente utilizam bandas de frequência até 30 MHz, especificada no padrão VDSL2. À medida que arquiteturas híbridas de fibra e cobre se tornam mais proeminentes na indústria e academia, torna-se possível utilizar cabos metálicos mais curtos (i.e. até 250 metros) conectando o último ponto de distribuição aos usuários, de modo que frequências mais altas podem ser exploradas para se alcançar taxas de transmissão de dados de 500 Mbps ou mais, como é o caso do padrão G.fast atualmente em desenvolvimento no ITU-T. Nesse trabalho, um simulador no domínio do tempo foi desenvolvido para avaliar a capacidade do sistema G.fast com diferentes tamanhos de extensão cíclica e diferentes topologias de rede especificadas pelo ITU-T. Os resultados das simulações mostram que sistemas G.fast são robustos a bridged taps e capazes de atingir altas taxas de dados para todas as topologias simuladas, provendo suporte à próxima geração de serviços de banda larga. Além disso, esse trabalho descreve o progresso da implementação de um protótipo de modem baseado no padrão G.fast em um ambiente híbrido de DSP multicore e FPGA utilizando kits de avaliação adquiridos pela UFPA. Arquiteturas, protocolos de comunicação e benchmarks são apresentados e avaliados para se chegar à conclusão de que tal protótipo é factível e fornece suporte flexível a várias linhas de pesquisa em banda larga da próxima geração.

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Patente de invenção de um método para arquitetura de computador reconfigurável e sujeita a constantes otimizações que compreende uma arquitetura de computador implementada em FPGA (Field Programmable Gate Array).

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This article describes the development of a visual stimulus generator to be used in neuroscience experiments with invertebrates such as flies. The experiment consists in the visualization of a fixed image that is displaced horizontally according to the stimulus data. The system is capable of displaying 640 x 480 pixels with 256 intensity levels at 200 frames per second (FPS) on conventional raster monitors. To double the possible horizontal positioning possibilities from 640 to 1280, a novel technique is presented introducing artificial inter-pixel steps. The implementation consists in using two video frame buffers containing each a distinct view of the desired image pattern. This implementation generates a visual effect capable of doubling the horizontal positioning capabilities of the visual stimulus generator allowing more precise and movements more contiguous. (C) 2011 Elsevier Inc. All rights reserved.

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The main objective of this work is to present an efficient method for phasor estimation based on a compact Genetic Algorithm (cGA) implemented in Field Programmable Gate Array (FPGA). To validate the proposed method, an Electrical Power System (EPS) simulated by the Alternative Transients Program (ATP) provides data to be used by the cGA. This data is as close as possible to the actual data provided by the EPS. Real life situations such as islanding, sudden load increase and permanent faults were considered. The implementation aims to take advantage of the inherent parallelism in Genetic Algorithms in a compact and optimized way, making them an attractive option for practical applications in real-time estimations concerning Phasor Measurement Units (PMUs).

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Programa de Doctorado: Ingeniería de Telecomunicación Avanzada.

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Programa de doctorado: Ingeniería de Telecomunicación Avanzada

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The digital electronic market development is founded on the continuous reduction of the transistors size, to reduce area, power, cost and increase the computational performance of integrated circuits. This trend, known as technology scaling, is approaching the nanometer size. The lithographic process in the manufacturing stage is increasing its uncertainty with the scaling down of the transistors size, resulting in a larger parameter variation in future technology generations. Furthermore, the exponential relationship between the leakage current and the threshold voltage, is limiting the threshold and supply voltages scaling, increasing the power density and creating local thermal issues, such as hot spots, thermal runaway and thermal cycles. In addiction, the introduction of new materials and the smaller devices dimension are reducing transistors robustness, that combined with high temperature and frequently thermal cycles, are speeding up wear out processes. Those effects are no longer addressable only at the process level. Consequently the deep sub-micron devices will require solutions which will imply several design levels, as system and logic, and new approaches called Design For Manufacturability (DFM) and Design For Reliability. The purpose of the above approaches is to bring in the early design stages the awareness of the device reliability and manufacturability, in order to introduce logic and system able to cope with the yield and reliability loss. The ITRS roadmap suggests the following research steps to integrate the design for manufacturability and reliability in the standard CAD automated design flow: i) The implementation of new analysis algorithms able to predict the system thermal behavior with the impact to the power and speed performances. ii) High level wear out models able to predict the mean time to failure of the system (MTTF). iii) Statistical performance analysis able to predict the impact of the process variation, both random and systematic. The new analysis tools have to be developed beside new logic and system strategies to cope with the future challenges, as for instance: i) Thermal management strategy that increase the reliability and life time of the devices acting to some tunable parameter,such as supply voltage or body bias. ii) Error detection logic able to interact with compensation techniques as Adaptive Supply Voltage ASV, Adaptive Body Bias ABB and error recovering, in order to increase yield and reliability. iii) architectures that are fundamentally resistant to variability, including locally asynchronous designs, redundancy, and error correcting signal encodings (ECC). The literature already features works addressing the prediction of the MTTF, papers focusing on thermal management in the general purpose chip, and publications on statistical performance analysis. In my Phd research activity, I investigated the need for thermal management in future embedded low-power Network On Chip (NoC) devices.I developed a thermal analysis library, that has been integrated in a NoC cycle accurate simulator and in a FPGA based NoC simulator. The results have shown that an accurate layout distribution can avoid the onset of hot-spot in a NoC chip. Furthermore the application of thermal management can reduce temperature and number of thermal cycles, increasing the systemreliability. Therefore the thesis advocates the need to integrate a thermal analysis in the first design stages for embedded NoC design. Later on, I focused my research in the development of statistical process variation analysis tool that is able to address both random and systematic variations. The tool was used to analyze the impact of self-timed asynchronous logic stages in an embedded microprocessor. As results we confirmed the capability of self-timed logic to increase the manufacturability and reliability. Furthermore we used the tool to investigate the suitability of low-swing techniques in the NoC system communication under process variations. In this case We discovered the superior robustness to systematic process variation of low-swing links, which shows a good response to compensation technique as ASV and ABB. Hence low-swing is a good alternative to the standard CMOS communication for power, speed, reliability and manufacturability. In summary my work proves the advantage of integrating a statistical process variation analysis tool in the first stages of the design flow.