923 resultados para Cathodic protection.


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This synthesis presents a science overview of the major forest management Issues involved in the recovery of anadromous salmonids affected by timber harvest in the Pacific Northwest and Alaska. The issues involve the components of ecosystem-based watershed management and how best to implement them, including how to: Design buffer zones to protect fish habitat while enabling economic timber production; Implement effective Best Management Practices (BMPs) to prevent nonpoint-source pollution; Develop watershed-level procedures across property boundaries to prevent cumulative impacts; Develop restoration procedures to contribute to recovery of ecosystem processes; and Enlist support of private landowners in watershed planning, protection, and restoration. Buffer zones, BMPs, cumulative impact prevention, and restoration are essential elements of what must be a comprehensive approach to habitat protection and restoration applied at the watershed level within a larger context of resource concerns in the river basin, species status under the Endangered Species Act (ESA), and regional environmental and economic issues (Fig. ES. 1). This synthesis 1) reviews salmonid habitat requirements and potential effects of logging; 2) describes the technical foundation of forest practices and restoration; 3) analyzes current federal and non-federal forest practices; and 4) recommends required elements of comprehensive watershed management for recovery of anadromous salmonids.

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Tetrahedrally bonded amorphous carbon (ta-C) and nitrogen doped (ta-C:N) films were obtained at room temperature in a filtered cathodic vacuum arc (FCVA) system incorporating an off-plane double bend (S-bend) magnetic filter. The influence of the negative bias voltage applied to substrates (from -20 to -350 V) and the nitrogen background pressure (up to 10-3 Torr) on film properties was studied by scanning electron microscopy (SEM), electron energy loss spectroscopy (EELS), Raman spectroscopy, X-ray photoemission spectroscopy (XPS), secondary ion mass spectroscopy (SIMS) and X-ray reflectivity (XRR). The ta-C films showed sp3 fractions between 84% and 88%, and mass densities around 3.2 g/cm3 in the wide range of bias voltage studied. In contrast, the compressive stress showed a maximum value of 11 GPa for bias voltages around -90 V, whereas for lower and higher bias voltages the stress decreased to 6 GPa. As for the ta-C:N films grown at bias voltages below -200 V and with N contents up to 7%, it has been found that the N atoms were preferentially sp3 bonded to the carbon network with a reduction in stress below 8 GPa. Further increase in bias voltage or N content increased the sp2 fraction, leading to a reduction in film density to 2.7 g/cm3.

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Nanocluster carbon films grown using a cathodic arc process at room temperature in the presence of background gases such as helium are found to be good electron emitters. The variation in the surface morphology and the corresponding emission characteristics of the films with change in helium partial pressure (5×10-4 to 50 Torr) during film growth are reported. The effect of helium partial pressure on clustering was studied for films grown at nitrogen partial pressures of 10-4 and 10-3 Torr. The surface morphology of the films varied from smooth through clusters (with sizes 50-200 nm) to fibrous films. The threshold field varied from 1 to 10 V/μm for an emission current density 1 μA/cm2.

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Wooden test panels of different species of wood sheathed with fibre-glass reinforced plastic were subjected to immersion tests along with corresponding controls in Cochin Port area and the effect of the protective coating studied.

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Some presently used anti-fouling materials contain metals and other compounds, which are toxic in the environment. Coating products are not always stable, and there is a resulting pollution hazard. In particular if surfaces are poorly prepared and manufactures' instructions are not closely followed the application of anti-fouling substances becomes pointless and dangerous. In addition the salinity, constant biological activity and suspended particles make seawater a highly corrosive material in its own right.

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Avalanche multiplication has been one of the major destructive failure mechanisms in IGBTs; in order to avoid operating an IGBT under abnormal conditions, it is desirable to develop peripheral protecting circuits monolithically integrated without compromising the operation and performance of the IGBT. In this paper, a monolithically integrated avalanche diode (D av) for 600V Trench IGBT over-voltage protection is proposed. The mix-mode transient simulation proves the clamping capability of the D av when the IGBT is experiencing over-voltage stress in unclamped inductive switching (UIS) test. The spread of avalanche energy, which prevents hot-spot formation, through the help of the avalanche diode feeding back a large fraction of the avalanche current to a gate resistance (R G) is also explained. © 2011 IEEE.