Electrochemical Behaviour of the AA2024 Aluminium Alloy Modified with Self-Assembled Monolayers/Polyaniline Double Films

The electrochemical characteristics of the AA2024 aluminium alloy modified with octadecyltrimethoxysilane (ODTMS) + polyaniline (PANi) and propiltrimethoxysilane (PTMS) + (PANi) were studied in the present work. The results show that the different protective coatings shift the values of corrosion and pit potentials to more positive values making the system nobler and indicate that the double film ODTMS + PANi present the best protection against corrosion characteristics, that is probably due to the two contributions: anodic protection associated with the barrier effect.

Corrosion behavior of Ti-13Nb-13Zr alloy used as a biomaterial

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Effect of cantilever length and framework alloy on the stress distribution of mandibular-cantilevered implant-supported prostheses

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Nanohardness and contact angle of Si wafers implanted with N and C and Al alloy with N by plasma ion implantation

Surfaces of silicon wafers implanted with N and C, respectively, and aluminum 5052 implanted with N alone by plasma immersion ion implantation WHO were probed by a nanoindentor and analyzed by the contact-angle method to provide information on surface nanohardness and wettability. Silicon nitride and silicon carbide are important ceramic materials for microelectronics, especially for high-temperature applications. These compounds can be synthesized by high-dose ion implantation. The nanohardness of a silicon sample implanted with 12-keV nitrogen PIII (with 3 X 10(17) cm(-2) dose) increased by 10% compared to the unimplanted sample, in layers deeper than the regions where the formation of the Si,N, compound occurred. A factor of 2.5 increase in hardness was obtained for C-implanted Si wafer at 35 keV (with 6 X 10(17) cm(-2) dose), again deeper than the SiC-rich layer, Both compounds are in the amorphous state and their hardness is much lower than that of the crystalline compounds, which require an annealing process after ion implantation. In the same targets, the contact angle increased by 65% and 35% for N- and C-implanted samples, respectively. Compared to the Si target, the nitrogen PIII-irradiated Al 5052 (wish 15 keV) showed negligible change in its hydrophobic character after ion implantation. Its near-surface nanohardness measurement showed a slight increase for doses of 1 X 10(17) cm(-2). We have been searching for an AlN layer of the order of 1000 A thick, using such a low-energy PIII process, but oxide formation during processing has precluded its synthesis. (C) 2002 Elsevier B.V. B.V. All rights reserved.

Effect of WC-10%Co-4%Cr coating on the Ti-6Al-4V alloy fatigue strength

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Describing fatigue crack growth and load ratio effects in Al 2524 T3 alloy with an enhanced exponential model

The fatigue crack behavior in metals and alloys under constant amplitude test conditions is usually described by relationships between the crack growth rate da/dN and the stress intensity factor range Delta K. In the present work, an enhanced two-parameter exponential equation of fatigue crack growth was introduced in order to describe sub-critical crack propagation behavior of Al 2524-T3 alloy, commonly used in aircraft engineering applications. It was demonstrated that besides adequately correlating the load ratio effects, the exponential model also accounts for the slight deviations from linearity shown by the experimental curves. A comparison with Elber, Kujawski and "Unified Approach" models allowed for verifying the better performance, when confronted to the other tested models, presented by the exponential model. (C) 2012 Elsevier Ltd. All rights reserved.

Effect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bath

The effect of the presence of tartrate additive on the chemical stability of a Cu-Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was observed that optimal galvanostatic deposition with or without tartrate occurs at approximately 11 mA cm(-2). However, in the presence of tartrate the deposition charge was lower, leading to lower energy consumption. SEM analysis showed that the tartrate added to the plating bath caused a marked change in the morphology of the Cu/Sn films obtained gal vanostatic ally. (C) 2002 Elsevier B.V. B.V. All rights reserved.

Evaluation of interface characterization and adhesion of glass ceramics to commercially pure titanium and gold alloy after thermal- and mechanical-loading

Objectives. This study evaluated the effect of thermal- and mechanical-cycling on the shear bond strength of three low-fusing glassy matrix dental ceramics to commercial pure titanium (cpTi) when compared to conventional feldspathic ceramic fused to gold alloy.Methods. Metallic frameworks (diameter: 5 min, thickness: 4 mm) (N = 96, n = 12 per group) were cast in cpTi and gold alloy, airborne particle abraded with 150 mu m aluminum oxide. Low-fusing glassy matrix ceramics and a conventional feldspathic ceramic were fired onto the alloys (thickness: 4mm). Four experimental groups were formed; Gr1 (control group): Vita Omega 900-Au-Pd alloy; Gr2: Ticeram-cpTi; Gr3: Super Porcelain Ti-22-cpTi and G4: Vita Titankeramik-cpTi. While half of the specimens from each ceramic-metal combination were randomly tested without aging (water storage at 37 C for 24h only), the other half were first thermocycled (6000 cycles, between 5 and 55 C, dwell time: 13 s) and then mechanically loaded (20,000 cycles under SON load, immersion in distilled water at 37 C). The ceramic-alloy interfaces were loaded under shear in a universal test machine (cross-head speed: 0.5 mm/min) until failure occur-red. Failure types were noted and the interfaces of the representative fractured specimens from each group were examined with stereo microscope and scanning electron microscope (SEM). in an additional study (N = 16, n = 2 per group), energy dispersive X-ray spectroscopy (EDS) analysis was performed from ceramic-alloy interfaces. Data were analyzed using ANOVA and Tukey's test.Results. Both ceramic-metal combinations (p < 0.001) and aging conditions (p < 0,001) significantly affected the mean bond strength values. Thermal- and mechanical-cycling decreased the bond strength (MPa) results significantly for Gr3 (33.4 +/- 4.2) and Gr4 (32.1 +/- 4.8) when compared to the non-aged groups (42.9 +/- 8.9, 42.4 +/- 5.2, respectively). Gr1 was not affected significantly from aging conditions (61.3 +/- 8.4 for control, 60.7 +/- 13.7 after aging) (p > 0.05). Stereomicroscope images showed exclusively adhesive failure types at the opaque ceramic-cpTi interfacial zone with no presence of ceramic on the substrate surface but with a visible dark titanium oxide layer in Groups 2-4 except Gr1 where remnants of bonder ceramic was visible. EDS analysis from the interfacial zone for cpTi-ceramic groups showed predominantly 34.5-85.1% O(2) followed by 1.1-36.7% Aland 0-36.3% Si except for Super Porcelain Ti-22 where a small quantity of Ba (1.4-8.3%), S (0.7%) and Sn (35.3%) was found. In the Au-Pd alloy-ceramic interface, 56.4-69.9% O(2) followed by 15.6-26.2% Si, 3.9-10.9% K, 2.8-6% Na, 4.4-9.6% Al and 0-0.04% Mg was observed.Significance. After thermal-cycling for 6000 times and mechanical-cycling for 20,000 times, Triceram-cpTi combination presented the least decrease among other ceramic-alloy combinations when compared to the mean bond strength results with Au-Pd alloy-Vita Omega 900 combination. (c) 2008 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Aging kinetics in the Cu-8 wt.% Al alloy with Ag additions

The influence of additions of 2, 4, 6, 8, 10 and 12 wt.% Ag in the isothermal aging kinetics of the Cu-8 wt.% Al alloy was studied using microhardness measurements, differential scanning calorimetry, optical and scanning electron microscopy and X-ray diffractometry. The results indicate that the presence of silver is responsible for the shift of the equilibrium concentration to higher Al contents, allowing the formation of the gamma(1) phase (Al4Cu9) in this alloy. For Ag additions up to 6% the dominant kinetic process is Ag precipitation and for additions from 8 to 12% Ag the nucleation of the perlitic phase dominates. (C) 2003 Elsevier B.V. B.V. All rights reserved.

Effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy

The effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy was studied using differential scanning calorimetry (DSC), optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results showed that the presence of silver causes (Cu)-alpha+(alpha+gamma1)-->(Cu)-alpha+beta transformation to occur in two stages. In the first one, part of the produced beta phase combines with the precipitated Ag to give a silver-rich phase and in the second one the transformation is completed. The formation of this silver-rich phase seems to be enhanced at very low cooling rates.

Estudo da influência de adições de prata na resistividade elétrica da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de precipitação da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Determinação das energias de ativação para nucleação de precipitados e difusão da prata na liga cu-2%al com adições de prata

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Morphological analysis of pits formed on Al 2024-T3 in chloride aqueous solution

It has been used a new image analysis method, based on segmentation by shape parameters, for pits morphology examination from Al 2024 aluminum-copper alloy in chloride aqueous solution. Corrosion behavior of this alloys in naturally aerated 3.5% NaCl solution has been investigated through open circuit potential measurements. Afterwards, pits have been characterized by image analysis taking density and size measurements right from corroded surfaces. Morphological investigation has been conducted for profiles, cut orthogonally from mean surface planes, and observed through light microscopy. Image analysis data could demonstrate that pits are wider than deep, evoluting for conical, quasi-conical or irregular shapes. Most pits have presented a quasi-conical morphology, but the wider ones have evoluted to an irregular shape influenced by sub-surface microstructure. Image analysis based on shape segmentation could enhance the differences on morphological behavior. (C) 2004 Elsevier B.V. All rights reserved.