Laterally Electrostatically Driven Poly 3C-SiC Folded-Beam Resonant Microstructures

Micromachined comb-drive electrostatic resonators with folded-cantilever beams were designed and fabricated. A combination of Rayleigh＇s method and finite-element analysis was used to calculate the resonant frequency drift as we adjusted the device geometry and material parameters. Three micromachined lateral resonant resonators with different beam widths were fabricated. Their resonant frequencies were experimentally measured to be 64.5,147.2, and 255.5kHz, respectively, which are in good agreement with the simulated resonant frequency. It is shown that an improved frequency performance could be obtained on the poly 3C-SiC based device structural material systems with high Young＇s modulus.

Heteroepitaxial Growth of 3C-SiC Films on Maskless Patterned Silicon Substrates

Heteroepitaxial growth of 3C-SiC on patterned Si substrates by low pressure chemical vapor deposition (LPCVD) has been investigated to improve the crystal quality of 3C-SiC films. Si substrates were patterned with parallel lines, 1 to 10μm wide and spaced 1 to 10μm apart, which was carried out by photolithography and reactive ion etching. Growth behavior on the patterned substrates was systematically studied by scanning electron microscopy (SEM). An air gap structure and a spherical shape were formed on the patterned Si substrates with different dimensions. The air gap formed after coalescence reduced the stress in the 3C-SiC films, solving the wafer warp and making it possible to grow thicker films. XRD patterns indicated that the films grown on the maskless patterned Si substrates were mainly composed of crystal planes with (111) orientation.

微量掺碳ne-SiC:H薄膜用于p-i-n太阳电池的窗口层

采用等离子增强化学气相沉积方法(PEVVD)制备了微量掺碳的p型纳米非晶硅碳薄膜(p-nc-SiC:H),反应气体为硅烷和甲烷,掺杂气体采用硼烷,沉积温度分别采用333 K,353 K和373 K.测量结果表明随着沉积温度增加和碳含量的增加,薄膜的光学带隙增加;薄膜具有较宽的带隙和较高的电导率,同时有较低的激活能(0.06 eV).Raman和XRD测量结果表明薄膜存在纳米晶.优化的p型纳米非晶硅碳薄膜作为非晶硅p-i-n太阳电池的窗口层,使得太阳电池的开路电压达到0.94 V.

Uniformity Investigation in 3C-SiC Epitaxial Layers Grown on Si Substrates by Horizontal Hot-Wall CVD

50mm 3C-SiC epilayers are grown on （100） and （111） Si substrates in a newly developed horizontal lowpressure hot-wall CVD reactor under different growth pressures and flow rates of H_2 carrier gas. The structure,electrical properties, and thickness uniformity of the 3C-SiC epilayers are investigated by X-ray diffraction （XRD） ,sheet resistance measurement, and spectroscopic ellipsometry. XRD patterns show that the 3C-SiC films have excellent crystallinity. The narrowest full widths at half maximum of the SIC（200） and （111） peaks are 0.41° and 0.21°, respectively. The best electrical uniformity of the 50mm 3C-SiC films obtained by sheet resistance measurement is 2.15%. A σ/mean value of ± 5.7% in thickness uniformity is obtained.

高性能1mm SiC基AlGaN/GaN功率HEMT研制

在6H-SiC衬底上,外延生长了AlGaN/GaN HEMT结构,设计并实现了高性能1mm AlGaN/GaN微波功率HEMT,外延材料利用金属有机物化学气相淀积技术生长.测试表明,该1mm栅宽器件栅长为0.8μm,输出电流密度达到1.16A/mm,跨导为241mS/mm,击穿电压＞80V,特征频率达到20GHz,最大振荡频率为28GHz.5.4GHz连续波测试下功率增益为14.2dB,输出功率达4.1W,脉冲条件测试下功率增益为14.4dB,输出功率为5.2W,两端口阻抗特性显示了在微波应用中的良好潜力.

MOCVD-Grown AlGaN/AlN/GaN HEMT Structure with High Mobility GaN Thin Layer as Channel on SiC

AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with a high-mobility GaN thin layer as a channel are grown on high resistive 6H-SiC substrates by metalorganic chemical vapor deposition. The HEMT structure exhibits a typical two-dimensional electron gas (2DEG) mobility of 1944cm2/(V · s) at room temperature and 11588cm2/(V· s) at 80K with almost equal 2DEG concentrations of about 1.03 × 1013 cm-2 High crystal quality of the HEMT structures is confirmed by triple-crystal X-ray diffraction analysis. Atomic force microscopy measurements reveal a smooth AlGaN surface with a root-mean-square roughness of 0. 27nm for a scan area of 10μm × 10μm. HEMT devices with 0.8μm gate length and 1.2mm gate width are fabricated using the structures. A maximum drain current density of 957mA/mm and an extrinsic transconductance of 267mS/mm are obtained.

Effect of Silicon-on-Insulator Substrate on Residual Strain in 3C-SiC Films

One group of SiC films are grown on silicon-on-insulator （SOI） substrates with a series of silicon-overlayer thickness. Raman scattering spectroscopy measurement clearly indicates that a systematic trend of residual stress reduction as the silicon over-layer thickness decreases for the SOI substrates. Strain relaxation in the SiC epilayer is explained by force balance approach and near coincidence lattice model.

低能碳离子束沉积（111）织构的立方SiC薄膜

在硅衬底上利用具有质量选择功能的低能离子束沉积技术沉积碳离子制备出除碳、硅之外无其他杂质元素的纯净的立方SiC薄膜．利用X射线光电子谱、俄歇电子能谱、X射线衍射对样品进行了表征．结果显示常温和400℃制备的样品为非晶结构，在800℃制备的样品由一富碳的表面层和有着良好化学计量比的SiC层组成，碳化硅晶体薄膜是（111）织构的．通过分析可知衬底温度、离子沉积能量和样品保温扩散时间等因素综合在一起对于在硅上沉积SiC薄膜起着重要作用．远远大于TRIM预测厚度的SiC薄膜的获得是高的衬底温度、一定注入能量的碳离子引起的增强扩散以及通道注入效应综合作用的结果。

Si上外延的n型3C-SiC欧姆接触研究

用LPCVD在si（111）上异质外延了n型3C-SiC，并在所外延的3C-SiC上蒸发Au／Ti，通过不同温度下的RTA（快速热退火）形成欧姆接触。用两种不同的传输线模型对Ti／3C-SiC欧姆接触的ρc（比接触电阻率）进行测量，在750℃退火后Ti／3C-SiC的ρc达到了最低值为3．68×10^-5Ω·cm^2这满足了应用的要求。AES分析结果还表明由于Ti的氧化，更高温度下的退火会使ρc增大。

LPCVD Growth of 3C-SiC on Si Mesas and SiO2/Si Substrates for MEMS Applications

This paper presents the development of LPCVD growth of 3C-SiC thin films grown on Si mesas and thermally oxidized SiO2 masks over Si with an area of 150 × 100μm^2 and SiO2/Si substrates. The growth has been performed via chemical vapor deposition using SiH4 and C2H4 precursor gases with carrier gas of H2. 3C-SiC films on these substrates were characterized by optical microscopy, X-ray diffraction （ XRD ）, X-ray photoelectron spectroscopy （ XPS ）, scanning electron microscopy （SEM） and room temperature Hall effect measurements. It is shown that there were no voids at the interface between 3C-SiC and SiO2.

非晶硅碳(a-SiC:H)薄膜光学常数的透射谱表征

报道了一种用透射谱数据分析法计算非晶硅碳薄膜的厚度、折射率、吸收系数和光学带隙等光学常数的方法和程序.这一方法引用有效谐振子模型理论的折射率色散关系,所有公式均为解析表达式,便于进行数据处理,无须专用软件,使用Excel即可完成,适用于多种半导体薄膜材料.将这种方法应用于PECVD方法制备的非晶硅碳(a-SiC∶H)薄膜,对其光学特性进行了分析.

氢稀释对非晶硅碳(a-SiC:H)合金薄膜生长和光学特性的影响

用PECVD方法,以固定的甲烷硅烷气体流量比([CH4]/[SiH4]=1.2)和不同的氢稀释比(RH=[H2]/[CH4+SiH4]=12,22,33,102和135)制备了一系列的氢化非晶硅碳合金(a-SiC:H)薄膜.运用紫外-可见光透射谱(UV-VIS)、红外吸收谱(IR)、Raman谱以及光荧光发射谱(PL)测量研究了氢稀释和高温退火对薄膜生长和光学特性的影响.实验发现氢稀释使薄膜光学带隙展宽(从1.92到2.15 eV).高氢稀释条件下制备的薄膜经过1250℃退火后在室温下观察到可见光发光峰,峰位位于2.1 eV.结合Raman谱分析,认为发光峰源于纳米硅的量子限制效应,纳米硅被Si-C和Si-O限制.

Preparation of 50mm 3C-SiC/Si(111) as Substrates Suited for Ⅲ-Nitrides

50mm SiC films with high electrical uniformity are grown on Si(111) by a newly developed vertical low-pressure chemical vapor deposition (LPCVD) reactor.Both in-situ n- and p-type doping of 3C-SiC are achieved by intentional introduction of ammonia and boron into the precursor gases.The dependence of growth rate and surface morphology on the C/Si ratio and optimized growth conditions is obtained.The best electrical uniformity of 50mm 3C-SiC films obtained by non-contact sheet resistance measurement is ±2.58%.GaN films are grown atop the as-grown 3C-SiC/Si(111) layers using molecular beam epitaxy (MBE).The data of both X-ray diffraction and low temperature photoluminescence of GaN/3C-SiC/Si(111) show that 3C-SiC is an appropriate substrate or buffer layer for the growth of Ⅲ-nitrides on Si substrates with no cracks.

厚表层Si柔性绝缘衬底上SiC薄膜的外延生长

利用LPCVD方法,在厚表层Si(SOL≈0.5μm)柔性绝缘衬底(SOI)(001)上外延生长出了可与硅衬底上外延晶体质量相比拟的SiC/SOI,表明SOI是一种很有潜力的柔性衬底. Raman 光谱结果表明SiC/SOI外延层比SiC/Si外延层有更大的残存应力,对此从理论上进行了解释.利用X射线衍射(XRD)、原子力显微镜(AFM)、扫描电镜(SEM)和喇曼散射光谱(RAM)技术研究了外延材料的晶体结构、界面性质和应变情况.

High Temperature Characteristics of 3C-SiC/Si Heterojunction Diodes Grown by LPCVD

The high temperature (300～480K) characteristics of the n-3C-SiC/p-Si heterojunction diodes (HJD) fabricated by low-pressure chemical vapor deposition on Si (100) substrates are investigated.The obtained diode with best rectifying properties has 1.8×104 of ratio at room temperature,and slightly rectifying characteristics with 3.1 of rectification ratio is measured at 480K of an ambient temperature .220V of reverse breakdown voltage is acquired at 300K.Capacitance-voltage characteristics show that the abrupt junction model is applicable to the SiC/Si HJD structure and the built-in voltage is 0.75V.An ingenious equation is employed to perfectly simulate and explain the forward current density-voltage data measured at various temperatures.The 3C-SiC/Si HJD represents a promising approach for the fabrication of high quality heterojunction devices such as SiC-emitter heterojunction bipolar transistors.