Thermal-mechanical modeling of nodular defect embedded within multilayer coatings

The initiation of laser damage within optical coatings can be better understood by thermal-mechanical modeling of coating defects. The result of this modeling shows that a high-temperature rise and thermal stress can be seen just inside the nodular defect compared to surrounding coating layers. The temperature rise and thermal stress tend to increase with seed diameter. Shallower seed tend to cause higher temperature rise and greater thermal stress. There is a critical seed depth at which thermal stress is largest. The composition of the seed resulting from different coating-material emission during evaporation can affect the temperature rise and thermal stress distribution.

Fabrication and mechanical property of carbon nanotube/metal composites

Carbon nanotubes (CNTs) are known to exhibit extraordinary mechanical properties such as high tensile strength, the highest Young modulus etc. These, combining with their large aspect ratio, make CNTs an excellent additive candidate to complement or substitute traditional carbon black or glass fiber fillers for the development of nano-reinforced composites. CNTs have thus far been used as additives in polymers, ceramics and metals to be pursued on practical applications of their composites. © 2010 IEEE.

Microstructure and mechanical property of Mg-8.31Gd-1.12Dy-0.38Zr alloy

The Mg-8.31Gd-1.12Dy-0.38Zr (mass%) alloy was prepared by casting technology, and the microstructure, age hardening behavior and mechanical property have been investigated. It is noted that the alpha-Mg and the different Mg-RE (RE = Gd/Dy) compounds are subsistent in the as-cast and annealed state samples. The age hardening behavior is observed during the investigated temperature range, and the alloy exhibits high Vickers hardness, excellent ultimate tensile strength and yield strength at peak hardness.

Chemical bond characteristics, thermal expansion property and compressibility of AR(2)O(4) (A = Ca, Sr, Ba; R = rare earths)

Theoretical researches were performed on the CaFe2O4-type binary rare earth oxides AR(2)O(4) (A = Ca, Sr, Ba; R = rare earths) by using chemical bond theory of dielectric description. The chemical bond properties of these crystals were explored, and then the thermal expansion property and compressibility were studied. The theoretical values of linear thermal expansion coefficient (LTEC) and bulk modulus were presented. The calculations revealed that the LTECs and the bulk moduli do have linear relationship with the ionic radii of the rare earths. In the cases of Sc and Y, both the LTEC and bulk modulus values are larger than the lanthanide series. We attribute this to the difference in the electronic configuration between Sc (Y) and lanthanide series. For SrY2O4 and BaY2O4 crystals, the theoretical values of LTEC and bulk modulus agree well with experimental ones.

Improvement of mechanical property of polyimide blends with Co-60-irradiation

Radiation effects on polyimide blends' were studied at different irradiation temperatures and with different irradiation doses. The irradiation polyimides were the blends of linear polyimide (HQDPA/ODA) and 4-phenylethynyl phthalic anhydride end-capped oligomer polyimide. The tensile strength and the elongation at break of irradiated films were determined as the function of irradiation temperature and dose. Under proper conditions crosslinking reaction occurred when the polyimide blends were irradiated at high temperature. The mechanical properties of irradiated polyimide blends were found to be different from the linear polyimide.

Thermal, mechanical and ionic conductive behaviour of gamma-radiation induced PEO/PVDF(SIN)-LiClO4 polymer electrolyte system

An effort has been made to modify the mechanical behaviour of our previously reported gel-type gamma-radiation crosslinked polyethylene oxide (PEO)-LiClO4 polymer electrolyte. A highly polar and gamma-radiation crosslinkable crystalline polymer, polyvinylidene fluoride (PVDF), was selected to blend with PEO and then subjected to gamma-irradiation in order to make an simultaneous interpenetrating network (SIN), which was used as a polymer host to impart stiffness to the plasticized system. Experimental results have shown that the presence of PVDF in the system, through gamma-radiation induced SIN formation, could not only give a rather high mechanical modulus of 10(7) Pa at ambient temperature, but also maintain the room temperature ionic conductivity at a high level (greater than 10(-4) S/cm). DSC, DMA and conductivity measurement techniques were used to examine the effects of blending, gamma-irradiation and plasticization on the variations of glass transition and melting endotherm, on the appearance of high elastic plateau and on the temperature dependence of ionic conductivity: In addition, it was found that, in contrast with the unplasticized system, the ionic conductivity mechanism of this gel-type electrolyte seems to conform to the Arrhenius model, suggesting that, as a result of the high degree of plasticization, the polymer chains act mainly as the skeleton of the networks or polymer cages to immobilize the liquid electrolyte solution, whereas the ionic species migrate as if they were in a liquid medium. (C) 1997 Elsevier Science Ltd.

Thermal, mechanical and optical modelling of VCSEL packaging

Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. OECB's incorporate short range optical interconnects, and are based on VCSEL (Vertical Cavity Surface Emitting Diode) and PD (Photo Diode) pairs, connected to each other via embedded waveguides in the OECB. The VCSEL device is flip-chip assembled onto an organic substrate with embedded optical waveguides. The performance of the VCSEL device is governed by the thermal, mechanical and optical characteristics of this assembly. During operation, the VCSEL device will heat up and the thermal change together with the CTE mismatch in the materials, will result in potential misalignment between the VCSEL apertures and the waveguide openings in the substrate. Any degree of misalignment will affect the optical performance of the package. This paper will present results from a highly coupled modelling analysis involving thermal, mechanical and optical models. The paper will also present results from an optimisation analysis based on Design of Experiments (DOE).

Thermal-mechanical analysis of flexible substrates during lead-free solder reflow

This paper presents modeling results about the performance of flexible substrates when subjected to higher lead-free reflow temperatures. Both adhesiveless and adhesive types of polyimide substrates were studied. Finite element (FE) models of flex substrates were built, two copper tracks located in the centre of the substrate was considered. The thermal induced shear stress in the flex substrate during the lead-free reflow process was studied and the effect of the design changes including the track thickness, flex thickness, and copper width were studied. For both types of flexes, the one of most important variables for minimizing damage to the substrate is the height of the copper tracks. The height of flex and the width of copper track show less impact. Beside of the geometry effects, the increase in reflow peak temperature can also result in a significant increase in the interfacial stress between the copper track and flex. Higher stresses were identified within the adhesive flex due to the big CTE mismatch between the copper and adhesive/dielectric

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Ethylene-Propylene-Diene Terpolymer/Hexafluoropropylene-Vinylidinefluoride Elastomeric Composites: Thermal, Mechanical and Microwave Properties

In the present study, an attempt has been made to prepare composites by incorporating expanded graphite fillers in insulating elastomer matrices and to study its DC electrical conductivity, dielectric properties and electromagnetic shielding characteristics, in addition to evaluating the mechanical properties. Recently, electronic devices and components have been rapidly developing and advancing. Thus, with increased usage of electronic devices, electromagnetic waves generated by electronic systems can potentially create serious problems such as malfunctions of medical apparatus and industry robots and can even cause harm to the human body. Therefore, in this work the applicable utility of the prepared composites as electromagnetic interference (EMI) shielding material are also investigated. The dissertation includes nine chapters