Analysis on turning Ti-6Al-4V with different cooling methods

The aim of this paper is to optimize the machining of Ti-6Al-4V alloy, by studying the chip formation, roughness and tool wear for different cooling conditions. The results were compared between cooling methods, minimal quantity of fluid (MQF) and flooding, and also without fluid for the tool H13A. The turning of Ti-6Al-4V has shown good results on roughness (0, 8μm) and tool life, which was 11% lower with MQF than with the flooding method. The tool wear causes variation of the shear angle, which promotes strength hardening of the chip. As a result, the machined surface could be damaged. The use of the cutting fluid helps to save the cutting edge and could reduce the strength hardening. Nevertheless, it could also facilitate the formation of built-up edge. The nucleation of alpha lamellar colonies can occur due to a combination of deformation rates and temperature, mainly when the flooding is used, but it's not conclusive. The lamellar colonies were also found with the MQF in some regions, however, this structure did not show hardness variation compared to equiaxial. For all this reasons, the machining parameters might be carefully chosen.

A valiação da integridade superficial e usinabilidade de engrenagens forjadas utilizando fresamento com alta velocidade de corte

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Estudo dos mecanismos governantes do efeito de escala na microusinagem

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Efeito do fresamento com alta velocidade de corte na usinabilidade de aços ferríticos com grãos ultrafinos

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Hot turning of a difficult-to-machine steel (sae xev-f) aided by infrared radiation

A possible way for increasing the cutting tool life can be achieved by heating the workpiece in order to diminish the shear stress of material and thus decrease the machining forces. In this study, quartz electrical resistances were set around the workpiece for heating it during the turning. In the tests, heat-resistant austenitic alloy steel was used, hardenable by precipitation, mainly used in combustion engine exhaustion valves, among other special applications for industry. The results showed that in the hot machining the cutting tool life can be increased by 340% for the highest cutting speed tested and had a reduction of 205% on workpiece surface roughness, accompanied by a force decrease in relation to conventional turning. In addition, the chips formed in hot turning exhibited a stronger tendency to continuous chip formation indicating less energy spent in material removal process. Microhardness tests performed in the workpieces subsurface layers at 5 m depth revealed slightly higher values in the hot machining than in conventional, showing a tendency toward the formation of compressive residual stress into plastically deformed layer. The hot turning also showed better performance than machining using cutting fluid. Since it is possible to avoid the use of cutting fluid, this machining method can be considered better for the environment and for the human health.

Fresamento de aço para moldes e matrizes em condições criogênicas

Pós-graduação em Engenharia Mecânica - FEIS

Estudo do processo de formação do cavaco durante o torneamento e sua relação com a microestrutura utilizando o método dos elementos finitos.

O objetivo desse trabalho foi avaliar o processo de formação do cavaco durante o torneamento utilizando simulação numérica pelo método dos elementos finitos. Para realizar o estudo foram definidos dois tipos de aços inoxidáveis austeníticos, um com matriz metálica sem a presença significativa de inclusões, do tipo ABNT 304, e outro com a presença de inclusões não metálicas, do tipo ABNT 303. O estudo foi focado nos mecanismos de formação e ruptura do cavaco, na determinação das forças de usinagem, no campo de tensões, deformações, e temperaturas durante o processo, que foram relacionados com aspectos e características da microestrutura do material. Os resultados obtidos foram comparados com as forças de usinagem experimentais, com a espessura e morfologia do cavaco. O desenvolvimento do trabalho, de acordo com a metodologia adotada, foi realizado em diferentes etapas. Inicialmente foi elaborado e aplicado um modelo de simulação da usinagem considerando o material homogêneo. Em outra etapa, foi realizada a modelagem de uma microestrutura submetida a um estado de tensão e deformação semelhante ao encontrado na simulação da usinagem realizada com material homogêneo. Os resultados mostraram que as partículas das inclusões maiores, alongadas, e em maior quantidade aumentam a tensão e a deformação na microestrutura. As elevadas temperaturas obtidas na usinagem dos aços inoxidáveis austeníticos aumentam a ductilidade dos sulfetos, esses se deformam em compressão junto com a matriz, e têm um efeito limitado como agente de redução dos esforços de usinagem. Por outro lado, os sulfetos facilitam a etapa de ruptura do cavaco em tensões trativas, e tendem a se romper facilitando o processo de quebra.

The cutting performance of sialon ceramic tools

The thesis deals with a research programme in which the cutting performance of a new generation of ceramic cutting tool material is evaluated using the turning process. In part one, the performance of commercial Kyon 2000 sialon ceramic inserts is studied when machining a hardened alloy steel under a wide range of cutting conditions. The aim is to formulate a pattern of machining behaviour in which tool wear is related to a theoretical interpretation of the temperatures and stresses generated by the chip-tool interaction. The work involves a correlation of wear measurement and metallographic examination of the wear area with the measurable cutting data. Four main tool failure modes are recognised: (a) flank and crater wear (b) grooving wear (c) deformation wear and (d) brittle failure Results indicate catastrophic edge breakdown under certain conditions. Accordingly in part two, the edge geometry is modified to give a double rake tool; a negative/positive combination. The results are reported for a range of workpiece materials under orthogonal cutting conditions. Significant improvements in the cutting performance are achieved. The improvements are explained by a study of process parameters; cutting forces, chip thickness ratio, chip contact length, temperature distribution, stress distribution and chip formation. In part three, improvements in tool performance are shown to arise when the edge chamfer on a single rake tool is modified. Under optimum edge chamfer conditions a substantial increase in tool life is obtained compared with the commercial cutting geometry.

An energy based force prediction method for UD-CFRP orthogonal machining

The machining of carbon fiber reinforced polymer (CFRP) composite presents a significant challenge to the industry, and a better understanding of machining mechanism is the essential fundament to enhance the machining quality. In this study, a new energy based analytical method was developed to predict the cutting forces in orthogonal machining of unidirectional CFRP with fiber orientations ranging from 0° to 75°. The subsurface damage in cutting was also considered. Thus, the total specific energy for cutting has been estimated along with the energy consumed for forming new surfaces, friction, fracture in chip formation and subsurface debonding. Experiments were conducted to verify the validity of the proposed model.

Formation, Thermal Stability and Deformation Behavior of Graphite-Flakes Reinforced Cu-based Bulk Metallic Glass Matrix Composites

Graphite-flake reinforced Cu47Ti34Zr11 Ni-8 bulk metallic glass matrix composite was fabricated by water-cooled copper mould cast. Most of the graphite flakes still keep unreacted and distribute uniformly in the amorphous matrix except that some reactive wetting occurs by the formation of TiC particles around the flakes. It reveals that the presence of graphite flakes does not affect the onset of the glass transition temperature, crystallization reaction and liquidus of the metallic glass. The resulting material shows obvious serrated flow and higher fracture strength under room temperature compressive load, comparing with the monolithic bulk metallic glass (BMG). Three types of interaction between the shear bands and graphite flakes, namely, shear band termination, shear bands branching and new shear bands formation near the graphite flakes can be observed by quasi-static uniaxial compression test and bonded interface technique through Vickers indentation.

Axial growth of hexactinellid spicules: Formation of cone-like structural units in the giant basal spicules of the hexactinellid Monorhaphis

The glass sponge Monorhaphis chuni (Porifera: Hexactinellida) forms the largest bio-silica structures on Earth; their giant basal spicules reach sizes of up to 3 m and diameters of 8.5 mm. Previously, it had been shown that the thickness growth proceeds by appositional layering of individual lamellae; however, the mechanism for the longitudinal growth remained unstudied. Now we show, that the surface of the spicules have towards the tip serrated relief structures that are consistent in size and form with the protrusions on the surface of the spicules. These protrusions fit into the collagen net that surrounds the spicules. The widths of the individual lamellae do not show a pronounced size tendency. The apical elongation of the spicule proceeds by piling up cone-like structural units formed from silica. As a support of the assumption that in the extracellular space silicatein(-like) molecules exist that associate with the external surface of the respective spicule immunogold electron microscopic analyses were performed. With the primmorph system from Suberites domuncula we show that silicatein(-like) molecules assemble as string- and net-like arrangements around the spicules. At their tips the silicatein(-like) molecules are initially stacked and at a later stay also organized into net-like structures. Silicatein(-like) molecules have been extracted from the giant basal spicule of Monorhaphis. Applying the SDS-PAGE technique it could be shown that silicatein molecules associate to dimers and trimers. Higher complexes (filaments) are formed from silicatein(-like) molecules, as can be visualized by electron microscopy (SEM). In the presence of ortho-silicate these filaments become covered with 30-60 nm long small rod-like/cuboid particles of silica. From these data we conclude that the apical elongation of the spicules of Monorhaphis proceeds by piling up cone-like silica structural units, whose synthesis is mediated by silicatein(-like) molecules. (C) 2008 Elsevier Inc. All rights reserved.

Numerical modelling of solder joint formation

Solder materials are used to provide a connection between electronic components and printed circuit boards (PCBs) using either the reflow or wave soldering process. As a board assembly passes through a reflow furnace the solder (initially in the form of solder paste) melts, reflows, then solidifies, and finally deforms between the chip and board. A number of defects may occur during this process such as flux entrapment, void formation, and cracking of the joint, chip or board. These defects are a serious concern to industry, especially with trends towards increasing component miniaturisation and smaller pitch sizes. This paper presents a modelling methodology for predicting solder joint shape, solidification, and deformation (stress) during the assembly process.

Using computer models to identify optimal conditions for flip-chip assembly and reliability

Flip-chip assembly, developed in the early 1960s, is now being positioned as a key joining technology to achieve high-density mounting of electronic components on to printed circuit boards for high-volume, low-cost products. Computer models are now being used early within the product design stage to ensure that optimal process conditions are used. These models capture the governing physics taking place during the assembly process and they can also predict relevant defects that may occur. Describes the application of computational modelling techniques that have the ability to predict a range of interacting physical phenomena associated with the manufacturing process. For example, in the flip-chip assembly process we have solder paste deposition, solder joint shape formation, heat transfer, solidification and thermal stress. Illustrates the application of modelling technology being used as part of a larger UK study aiming to establish a process route for high-volume, low-cost, sub-100-micron pitch flip-chip assembly.

Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology

Using thermosetting epoxy based conductive adhesive films for the flip chip interconnect possess a great deal of attractions to the electronics manufacturing industries due to the ever increasing demands for miniaturized electronic products. Adhesive manufacturers have taken many attempts over the last decade to produce a number of types of adhesives and the coupled anisotropic conductive-nonconductive adhesive film is one of them. The successful formation of the flip chip interconnection using this particular type of adhesive depends on, among factors, how the physical properties of the adhesive changes during the bonding process. Experimental measurements of the temperature in the adhesive have revealed that the temperature becomes very close to the required maximum bonding temperature within the first 1s of the bonding time. The higher the bonding temperature the faster the ramp up of temperature is. A dynamic mechanical analysis (DMA) has been carried out to investigate the nature of the changes of the physical properties of the coupled anisotropic conductive-nonconductive adhesive film for a range of bonding parameters. Adhesive samples that are pre-cured at 170, 190 and 210°C for 3, 5 and 10s have been analyzed using a DMA instrument. The results have revealed that the glass transition temperature of this type of adhesive increases with the increase in the bonding time for the bonding temperatures that have been used in this work. For the curing time of 3 and 5s, the maximum glass transition temperature increases with the increase in the bonding temperature, but for the curing time of 10s the maximum glass transition temperature has been observed in the sample which is cured at 190°C. Based on these results it has been concluded that the optimal bonding temperature and time for this kind of adhesive are 190°C and 10s, respectively.

Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process

As the trend toward further miniaturisation of pocket and handheld consumer electronic products continues apace, the requirements for even smaller solder joints will continue. With further reductions in the size of solder joints, the reliability of solder joints will become more and more critical to the long-term performance of electronic products. Solder joints play an important role in electronics packaging, serving both as electrical interconnections between the components and the board, and as mechanical support for components. With world-wide legislation for the removal/reduction of lead and other hazardous materials from electrical and electronic products, the electronics manufacturing industry has been faced with an urgent search for new lead-free solder alloy systems and other solder alternatives. In order to achieve high volume, low cost production, the stencil printing process and subsequent wafer bumping of solder paste has become indispensable. There is wide agreement in industry that the paste printing process accounts for the majority of assembly defects, and most defects originate from poor understanding of the effect of printing process parameters on printing performance. The printing of ICAs and lead-free solder pastes through the very small stencil apertures required for flip chip applications was expected to result in increased stencil clogging and incomplete transfer of paste to the printed circuit pads. Paste release from the stencil apertures is dependent on the interaction between the solder paste, surface pad and aperture wall; including its shape. At these very narrow aperture sizes the paste rheology becomes crucial for consistent paste withdrawal because for smaller paste volumes surface tension effects become dominant over viscous flow. Successful aperture filling and release will greatly depend on the rheology of the paste material. Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. The wall- slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. The wall slip effect can play an important role in ensuring successful paste release after the printing process. The aim of this study was to investigate the influence of the paste microstructure on slip formation for the paste materials (lead-free solder paste and isotropic conductive adhesives). The effect of surface roughness on the paste viscosity was investigated. It was also found that altering the surface roughness of the parallel plate measuring geometry did not significantly eliminate wall slip as was expected. But results indicate that the use of a relatively rough surface helps to increase paste adhesion to the plates, inducing structural breakdown of the paste. Most importantly, the study also demonstrated on how the wall slip formation in the paste material could be utilised for understanding of the paste microstructure and its flow behaviour