Flexural Test on Recycled Polystyrene

In socio-environmental scenario increased the nature resources concern beyond products and subproducts reuse. Recycling is the approach for a material or energy reintroducing in productive system. This method allows the reduction of garbage volume dumped in environment, saving energy and decreasing the requirement of natural resources use. In general, the ending of expanded polystyrene is deposited sanitary landfills or garbage dumps without control that take large volume and spreads easily by aeolian action, with consequently environmental pollution, however, the recycling avoids their misuse and the obtainment from petroleum is reduced. This work recycled expanded polystyrene via merger and/or dissolution by solvents for the production of integrated circuits boards. The obtained material was characterized in flexural mode according to ASTM D 790 and results were compared with phenolite, traditionally used. Specimens fractures were observed by electronic microscopy scanning in order to establish patterns. Expanded Polyestirene recycled as well as phenolite were also thermo analyzed by TGA and DSC. The method using dissolution produced very brittle materials. The method using merger showed no voids formation nor increased the brittleness of the material. The recycled polystyrene presented a strength value significantly lower than that for the phenolite. (C) 2011 Published by Elsevier Ltd. Selection and peer-review under responsibility of ICM11

Development of a semi-automatic self learning pattern recognition system for the control of electronic boards

This project was funded under the Applied Research Grants Scheme administered by Enterprise Ireland. The project was a partnership between Galway - Mayo Institute of Technology and an industrial company, Tyco/Mallinckrodt Galway. The project aimed to develop a semi - automatic, self - learning pattern recognition system capable of detecting defects on the printed circuits boards such as component vacancy, component misalignment, component orientation, component error, and component weld. The research was conducted in three directions: image acquisition, image filtering/recognition and software development. Image acquisition studied the process of forming and digitizing images and some fundamental aspects regarding the human visual perception. The importance of choosing the right camera and illumination system for a certain type of problem has been highlighted. Probably the most important step towards image recognition is image filtering, The filters are used to correct and enhance images in order to prepare them for recognition. Convolution, histogram equalisation, filters based on Boolean mathematics, noise reduction, edge detection, geometrical filters, cross-correlation filters and image compression are some examples of the filters that have been studied and successfully implemented in the software application. The software application developed during the research is customized in order to meet the requirements of the industrial partner. The application is able to analyze pictures, perform the filtering, build libraries, process images and generate log files. It incorporates most of the filters studied and together with the illumination system and the camera it provides a fully integrated framework able to analyze defects on printed circuit boards.

Desenvolvimento de um Controlador de Boundary Scan (Ieee 1149.1)

Mestrado em Engenharia Electrotécnica e de Computadores - Área de Especialização em Automação e Sistemas

Control system for actuation and sensing in digital microfluidics devices

Digital Microfluidics (DMF) is a second generation technique, derived from the conventional microfluidics that instead of using continuous liquid fluxes, it uses only individual droplets driven by external electric signals. In this thesis a new DMF control/sensing system for visualization, droplet control (movement, dispensing, merging and splitting) and real time impedance measurement have been developed. The software for the proposed system was implemented in MATLAB with a graphical user interface. An Arduino was used as control board and dedicated circuits for voltage switching and contacts were designed and implemented in printed circuit boards. A high resolution camera was integrated for visualization. In our new approach, the DMF chips are driven by a dual-tone signal where the sum of two independent ac signals (one for droplet operations and the other for impedance sensing) is applied to the electrodes, and afterwards independently evaluated by a lock-in amplifier. With this new approach we were able to choose the appropriated amplitudes and frequencies for the different proposes (actuation and sensing). The measurements made were used to evaluate the real time droplet impedance enabling the knowledge of its position and velocity. This new approach opens new possibilities for impedance sensing and feedback control in DMF devices.

A physical frequency-dependent compact model for RF integrated inductors

A frequency-dependent compact model for inductors in high ohmic substrates, which is based on an energy point-of-view, is developed. This approach enables the description of the most important coupling phenomena that take place inside the device. Magnetically induced losses are quite accurately calculated and coupling between electric and magnetic fields is given by means of a delay constant. The later coupling phenomenon provides a modified procedure for the computation of the fringing capacitance value, when the self-resonance frequency of the inductor is used as a fitting parameter. The model takes into account the width of every metal strip and the pitch between strips. This enables the description of optimized layout inductors. Data from experiments and electromagnetic simulators are presented to test the accuracy of the model.

A current-mode interface circuit for a piezoresistive pressure sensor

An interfacing circuit for piezoresistive pressure sensors based on CMOS current conveyors is presented. The main advantages of the proposed interfacing circuit include the use of a single piezoresistor, the capability of offset compensation, and a versatile current-mode configuration, with current output and current or voltage input. Experimental tests confirm linear relation of output voltage versus piezoresistance variation.

Improvement of the quality factor of RF integrated inductors by layout optimization

A systematic method to improve the quality (Q) factor of RF integrated inductors is presented in this paper. The proposed method is based on the layout optimization to minimize the series resistance of the inductor coil, taking into account both ohmic losses, due to conduction currents, and magnetically induced losses, due to eddy currents. The technique is particularly useful when applied to inductors in which the fabrication process includes integration substrate removal. However, it is also applicable to inductors on low-loss substrates. The method optimizes the width of the metal strip for each turn of the inductor coil, leading to a variable strip-width layout. The optimization procedure has been successfully applied to the design of square spiral inductors in a silicon-based multichip-module technology, complemented with silicon micromachining postprocessing. The obtained experimental results corroborate the validity of the proposed method. A Q factor of about 17 have been obtained for a 35-nH inductor at 1.5 GHz, with Q values higher than 40 predicted for a 20-nH inductor working at 3.5 GHz. The latter is up to a 60% better than the best results for a single strip-width inductor working at the same frequency.

Design of boundary-scan testing in CMOS image sensors for industrial applications: internship repor

Tests on printed circuit boards and integrated circuits are widely used in industry,resulting in reduced design time and cost of a project. The functional and connectivity tests in this type of circuits soon began to be a concern for the manufacturers, leading to research for solutions that would allow a reliable, quick, cheap and universal solution. Initially, using test schemes were based on a set of needles that was connected to inputs and outputs of the integrated circuit board (bed-of-nails), to which signals were applied, in order to verify whether the circuit was according to the specifications and could be assembled in the production line. With the development of projects, circuit miniaturization, improvement of the production processes, improvement of the materials used, as well as the increase in the number of circuits, it was necessary to search for another solution. Thus Boundary-Scan Testing was developed which operates on the border of integrated circuits and allows testing the connectivity of the input and the output ports of a circuit. The Boundary-Scan Testing method was converted into a standard, in 1990, by the IEEE organization, being known as the IEEE 1149.1 Standard. Since then a large number of manufacturers have adopted this standard in their products. This master thesis has, as main objective: the design of Boundary-Scan Testing in an image sensor in CMOS technology, analyzing the standard requirements, the process used in the prototype production, developing the design and layout of Boundary-Scan and analyzing obtained results after production. Chapter 1 presents briefly the evolution of testing procedures used in industry, developments and applications of image sensors and the motivation for the use of architecture Boundary-Scan Testing. Chapter 2 explores the fundamentals of Boundary-Scan Testing and image sensors, starting with the Boundary-Scan architecture defined in the Standard, where functional blocks are analyzed. This understanding is necessary to implement the design on an image sensor. It also explains the architecture of image sensors currently used, focusing on sensors with a large number of inputs and outputs.Chapter 3 describes the design of the Boundary-Scan implemented and starts to analyse the design and functions of the prototype, the used software, the designs and simulations of the functional blocks of the Boundary-Scan implemented. Chapter 4 presents the layout process used based on the design developed on chapter 3, describing the software used for this purpose, the planning of the layout location (floorplan) and its dimensions, the layout of individual blocks, checks in terms of layout rules, the comparison with the final design and finally the simulation. Chapter 5 describes how the functional tests were performed to verify the design compliancy with the specifications of Standard IEEE 1149.1. These tests were focused on the application of signals to input and output ports of the produced prototype. Chapter 6 presents the conclusions that were taken throughout the execution of the work.

Methodology analysis of a computational tool used in electronic circuit design

This paper considers the importance of using a top-down methodology and suitable CAD tools in the development of electronic circuits. The paper presents an evaluation of the methodology used in a computational tool created to support the synthesis of digital to analog converter models by translating between different tools used in a wide variety of applications. This tool is named MS 2SV and works directly with the following two commercial tools: MATLAB/Simulink and SystemVision. Model translation of an electronic circuit is achieved by translating a mixed-signal block diagram developed in Simulink into a lower level of abstraction in VHDL-AMS and the simulation project support structure in SystemVision. The method validation was performed by analyzing the power spectral of the signal obtained by the discrete Fourier transform of a digital to analog converter simulation model. © 2011 IEEE.

Estudo da compatibilidade eletromagnética em placa de circuito impresso de centrais telefônicas

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Feasible Dose Reduction in Routine Chest Computed Tomography Maintaining Constant Image Quality Using the Last Three Scanner Generations: From Filtered Back Projection to Sinogram-affirmed Iterative Reconstruction and Impact of the Novel Fully Integrated Detector Design Minimizing Electronic Noise

OBJECTIVE The aim of the present study was to evaluate a dose reduction in contrast-enhanced chest computed tomography (CT) by comparing the three latest generations of Siemens CT scanners used in clinical practice. We analyzed the amount of radiation used with filtered back projection (FBP) and an iterative reconstruction (IR) algorithm to yield the same image quality. Furthermore, the influence on the radiation dose of the most recent integrated circuit detector (ICD; Stellar detector, Siemens Healthcare, Erlangen, Germany) was investigated. MATERIALS AND METHODS 136 Patients were included. Scan parameters were set to a thorax routine: SOMATOM Sensation 64 (FBP), SOMATOM Definition Flash (IR), and SOMATOM Definition Edge (ICD and IR). Tube current was set constantly to the reference level of 100 mA automated tube current modulation using reference milliamperes. Care kV was used on the Flash and Edge scanner, while tube potential was individually selected between 100 and 140 kVp by the medical technologists at the SOMATOM Sensation. Quality assessment was performed on soft-tissue kernel reconstruction. Dose was represented by the dose length product. RESULTS Dose-length product (DLP) with FBP for the average chest CT was 308 mGy*cm ± 99.6. In contrast, the DLP for the chest CT with IR algorithm was 196.8 mGy*cm ± 68.8 (P = 0.0001). Further decline in dose can be noted with IR and the ICD: DLP: 166.4 mGy*cm ± 54.5 (P = 0.033). The dose reduction compared to FBP was 36.1% with IR and 45.6% with IR/ICD. Signal-to-noise ratio (SNR) was favorable in the aorta, bone, and soft tissue for IR/ICD in combination compared to FBP (the P values ranged from 0.003 to 0.048). Overall contrast-to-noise ratio (CNR) improved with declining DLP. CONCLUSION The most recent technical developments, namely IR in combination with integrated circuit detectors, can significantly lower radiation dose in chest CT examinations.

A tool for the automatic analysis of single events effects on electronic circuits

Nowadays integrated circuit reliability is challenged by both variability and working conditions. Environmental radiation has become a major issue when ensuring the circuit correct behavior. The required radiation and later analysis performed to the circuit boards is both fund and time expensive. The lack of tools which support pre-manufacturing radiation hardness analysis hinders circuit designers tasks. This paper describes an extensively customizable simulation tool for the characterization of radiation effects on electronic systems. The proposed tool can produce an in depth analysis of a complete circuit in almost any kind of radiation environment in affordable computation times.

Telemetría de vehículos FSAE con microcontrolador PIC32 y transceptor de radio CC1101

Quizás el campo de las telecomunicaciones sea uno de los campos en el que más se ha progresado en este último siglo y medio, con la ayuda de otros campos de la ciencia y la técnica tales como la computación, la física electrónica, y un gran número de disciplinas, que se han utilizado estos últimos 150 años en conjunción para mejorarse unas con la ayuda de otras. Por ejemplo, la química ayuda a comprender y mejorar campos como la medicina, que también a su vez se ve mejorada por los progresos en la electrónica creados por los físicos y químicos, que poseen herramientas más potentes para calcular y simular debido a los progresos computacionales. Otro de los campos que ha sufrido un gran avance en este último siglo es el de la automoción, aunque estancados en el motor de combustión, los vehículos han sufrido enormes cambios debido a la irrupción de los avances en la electrónica del automóvil con multitud de sistemas ya ampliamente integrados en los vehículos actuales. La Formula SAE® o Formula Student es una competición de diseño, organizada por la SAE International (Society of Automotive Engineers) para estudiantes de universidades de todo el mundo que promueve la ingeniería a través de una competición donde los miembros del equipo diseñan, construyen, desarrollan y compiten en un pequeño y potente monoplaza. En el ámbito educativo, evitando el sistema tradicional de clases magistrales, se introducen cambios en las metodologías de enseñanza y surge el proyecto de la Fórmula Student para lograr una mejora en las acciones formativas, que permitan ir incorporando nuevos objetivos y diseñar nuevas situaciones de aprendizaje que supongan una oportunidad para el desarrollo de competencias de los alumnos, mejorar su formación como ingenieros y contrastar sus progresos compitiendo con las mejores universidades del mundo. En este proyecto se pretende dotar a los alumnos de las escuelas de ingeniería de la UPM que desarrollan el vehículo de FSAE de una herramienta de telemetría con la que evaluar y probar comportamiento del vehículo de FSAE junto con sus subsistemas que ellos mismos diseñan, con el objetivo de evaluar el comportamiento, introducir mejoras, analizar resultados de una manera más rápida y cómoda, con el objetivo de poder progresar más rápidamente en su desarrollo, recibiendo y almacenando una realimentación directa e instantánea del funcionamiento mediante la lectura de los datos que circulan por el bus CAN del vehículo. También ofrece la posibilidad de inyectar datos a los sistemas conectados al bus CAN de manera remota. Se engloba en el conjunto de proyectos de la FSAE, más concretamente en los basados en la plataforma PIC32 y propone una solución conjunta con otros proyectos o también por sí sola. Para la ejecución del proyecto se fabricó una placa compuesta de dos placas de circuito impreso, la de la estación base que envía comandos, instrucciones y datos para inyectar en el bus CAN del vehículo mediante radiofrecuencia y la placa que incorpora el vehículo que envía las tramas que circulan por el bus CAN del vehículo con los identificadores deseados, ejecuta los comandos recibidos por radiofrecuencia y salva las tramas CAN en una memoria USB o SD Card. Las dos PCBs constituyen el hardware del proyecto. El software se compone de dos programas. Un programa para la PCB del vehículo que emite los datos a la estación base, codificado en lenguaje C con ayuda del entorno de desarrollo MPLAB de Microchip. El otro programa hecho con LabView para la PCB de la estación base que recibe los datos provenientes del vehículo y los interpreta. Se propone un hardware y una capa o funciones de software para los microcontroladores PIC32 (similar al de otros proyectos del FSAE) para la transmisión de las tramas del bus CAN del vehículo de manera inalámbrica a una estación base, capaz de insertar tramas en el bus CAN del vehículo enviadas desde la estación base. También almacena estas tramas CAN en un dispositivo USB o SD Card situado en el vehículo. Para la transmisión de los datos se hizo un estudio de las frecuencias de transmisión, la legislación aplicable y los tipos de transceptores. Se optó por utilizar la banda de radiofrecuencia de uso común ISM de 433MHz mediante el transceptor integrado CC110L de Texas Instruments altamente configurable y con interfaz SPI. Se adquirieron dos parejas de módulos compatibles, con amplificador de potencia o sin él. LabView controla la estación que recoge las tramas CAN vía RF y está dotada del mismo transceptor de radio junto con un puente de comunicaciones SPI-USB, al que se puede acceder de dos diferentes maneras, mediante librerías dll, o mediante NI-VISA con transferencias RAW-USB. La aplicación desarrollada posee una interfaz configurable por el usuario para la muestra de los futuros sensores o actuadores que se incorporen en el vehículo y es capaz de interpretar las tramas CAN, mostrarlas, gráfica, numéricamente y almacenar esta información, como si fuera el cuadro de instrumentos del vehículo. Existe una limitación de la velocidad global del sistema en forma de cuello de botella que se crea debido a las limitaciones del transceptor CC110L por lo que si no se desea filtrar los datos que se crean necesarios, sería necesario aumentar el número de canales de radio para altas ocupaciones del bus CAN. Debido a la pérdida de relaciones con el INSIA, no se pudo probar de manera real en el propio vehículo, pero se hicieron pruebas satisfactorias (hasta 1,6 km) con una configuración de tramas CAN estándar a una velocidad de transmisión de 1 Mbit/s y un tiempo de bit de 1 microsegundo. El periférico CAN del PIC32 se programará para cumplir con estas especificaciones de la ECU del vehículo, que se presupone que es la MS3 Sport de Bosch, de la que LabView interpretará las tramas CAN recibidas de manera inalámbrica. Para poder probar el sistema, ha sido necesario reutilizar el hardware y adaptar el software del primer prototipo creado, que emite tramas CAN preprogramadas con una latencia también programable y que simulará al bus CAN proporcionando los datos a transmitir por el sistema que incorpora el vehículo. Durante el desarrollo de este proyecto, en las etapas finales, el fabricante del puente de comunicaciones SPI-USB MCP2210 liberó una librería (dll) compatible y sin errores, por lo que se nos ofrecía una oportunidad interesante para la comparación de las velocidades de acceso al transceptor de radio, que se presuponía y se comprobó más eficiente que la solución ya hecha mediante NI-VISA. ABSTRACT. The Formula SAE competition is an international university applied to technological innovation in vehicles racing type formula, in which each team, made up of students, should design, construct and test a prototype each year within certain rules. The challenge of FSAE is that it is an educational project farther away than a master class. The goal of the present project is to make a tool for other students to use it in his projects related to FSAE to test and improve the vehicle, and, the improvements that can be provided by the electronics could be materialized in a victory and win the competition with this competitive advantage. A telemetry system was developed. It sends the data provided by the car’s CAN bus through a radio frequency transceiver and receive commands to execute on the system, it provides by a base station on the ground. Moreover, constant verification in real time of the status of the car or data parameters like the revolutions per minute, pressure from collectors, water temperature, and so on, can be accessed from the base station on the ground, so that, it could be possible to study the behaviour of the vehicle in early phases of the car development. A printed circuit board, composed of two boards, and two software programs in two different languages, have been developed, and built for the project implementation. The software utilized to design the PCB is Orcad10.5/Layout. The base station PCB on a PC receives data from the PCB connected to the vehicle’s CAN bus and sends commands like set CAN filters or masks, activate data logger or inject CAN frames. This PCB is connected to a PC via USB and contains a bridge USB-SPI to communicate with a similar transceiver on the vehicle PCB. LabView controls this part of the system. A special virtual Instrument (VI) had been created in order to add future new elements to the vehicle, is a dashboard, which reads the data passed from the main VI and represents them graphically to studying the behaviour of the car on track. In this special VI other alums can make modifications to accommodate the data provided from the vehicle CAN’s bus to new elements on the vehicle, show or save the CAN frames in the form or format they want. Two methods to access to SPI bus of CC110l RF transceiver over LabView have been developed with minimum changes between them. Access through NI-VISA (Virtual Instrument Software Architecture) which is a standard for configuring, programming, USB interfaces or other devices in National Instruments LabView. And access through DLL (dynamic link library) supplied by the manufacturer of the bridge USB-SPI, Microchip. Then the work is done in two forms, but the dll solution developed shows better behaviour, and increase the speed of the system because has less overload of the USB bus due to a better efficiency of the dll solution versus VISA solution. The PCB connected to the vehicle’s CAN bus receives commands from the base station PCB on a PC, and, acts in function of the command or execute actions like to inject packets into CAN bus or activate data logger. Also sends over RF the CAN frames present on the bus, which can be filtered, to avoid unnecessary radio emissions or overflowing the RF transceiver. This PCB consists of two basic pieces: A microcontroller with 32 bit architecture PIC32MX795F512L from Microchip and the radio transceiver integrated circuit CC110l from Texas Instruments. The PIC32MX795F512L has an integrated CAN and several peripherals like SPI controllers that are utilized to communicate with RF transceiver and SD Card. The USB controller on the PIC32 is utilized to store CAN data on a USB memory, and change notification peripheral is utilized like an external interrupt. Hardware for other peripherals is accessible. The software part of this PCB is coded in C with MPLAB from Microchip, and programming over PICkit 3 Programmer, also from Microchip. Some of his libraries have been modified to work properly with this project and other was created specifically for this project. In the phase for RF selection and design is made a study to clarify the general aspects of regulations for the this project in order to understand it and select the proper band, frequency, and radio transceiver for the activities developed in the project. From the different options available it selects a common use band ICM, with less regulation and free to emit with restrictions and disadvantages like high occupation. The transceiver utilized to transmit and receive the data CC110l is an integrated circuit which needs fewer components from Texas Instruments and it can be accessed through SPI bus. Basically is a state machine which changes his state whit commands received over an SPI bus or internal events. The transceiver has several programmable general purpose Inputs and outputs. These GPIOs are connected to PIC32 change notification input to generate an interrupt or connected to GPIO to MCP2210 USB-SPI bridge to inform to the base station for a packet received. A two pair of modules of CC110l radio module kit from different output power has been purchased which includes an antenna. This is to keep away from fabrication mistakes in RF hardware part or designs, although reference design and gerbers files are available on the webpage of the chip manufacturer. A neck bottle is present on the complete system, because the maximum data rate of CC110l transceiver is a half than CAN bus data rate, hence for high occupation of CAN bus is recommendable to filter the data or add more radio channels, because the buffers can’t sustain this load along the time. Unfortunately, during the development of the project, the relations with the INSIA, who develops the vehicle, was lost, for this reason, will be made impossible to test the final phases of the project like integration on the car, final test of integration, place of the antenna, enclosure of the electronics, connectors selection, etc. To test or evaluate the system, it was necessary to simulate the CAN bus with a hardware to feed the system with entry data. An early hardware prototype was adapted his software to send programed CAN frames at a fixed data rate and certain timing who simulate several levels of occupation of the CAN Bus. This CAN frames emulates the Bosch ECU MS3 Sport.

Printed circuit laboratory manual /

This manual provides a description of the laboratory and a step-by-step outline of the manufacturing techniques employed at Sandia Corporation, Livermore Laboratory (SCLL), in the fabrication of the etched circuit boards.

Optimal production planning for PCB assembly

It is indisputable that printed circuit boards (PCBs) play a vital role in our daily lives. With the ever-increasing applications of PCBs, one of the crucial ways to increase a PCB manufacturer’s competitiveness in terms of operation efficiency is to minimize the production time so that the products can be introduced to the market sooner. Optimal Production Planning for PCB Assembly is the first book to focus on the optimization of the PCB assembly lines’ efficiency. This is done by: • integrating the component sequencing and the feeder arrangement problems together for both the pick-and-place machine and the chip shooter machine; • constructing mathematical models and developing an efficient and effective heuristic solution approach for the integrated problems for both types of placement machines, the line assignment problem, and the component allocation problem; and • developing a prototype of the PCB assembly planning system. The techniques proposed in Optimal Production Planning for PCB Assembly will enable process planners in the electronics manufacturing industry to improve the assembly line’s efficiency in their companies. Graduate students in operations research can familiarise themselves with the techniques and the applications of mathematical modeling after reading this advanced introduction to optimal production planning for PCB assembly.