An efficient methodological approach in the didatic of automation applied to integrated manufacturing

This work presents challenges and solutions for the teaching and learning of automation applied to integrated manufacturing by means of a methodological approach based on techniques, tools and industrial equipment directly applicable in the industry. The approach was implemented in a control and automation engineering course divided into expositive and laboratory classes. Since the success of the approach is mainly from the practical activities, the article focus more on activities developed in laboratory than theorical classes. Copyright © 2007 IFAC.

Uso do resíduo da produção de farinha de mandioca (Crueira) na produção de álcool fino

Pós-graduação em Agronomia (Energia na Agricultura) - FCA

Comparativo econômico do corte, carregamento e transporte de cana-de-açúcar com e sem palhada no sistema de colheita mecanizada

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Projeto estrutural e parametrização de uma comporta segmento utilizando o método dos elementos finitos

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Desenvolvimento de um sistema de análise de imagem para quantificação do tamanho e distribuição de partículas de desgaste

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Estudo, construção e caracterização de diodos orgânicos tipo Schttky

During the twentieth century the inorganic electronics was largely developed being present in various industrial equipment or household use. However, at the end of that century were verified electronic properties in organic compounds, giving rise to the field of organic electronics. Since then, the physical properties of elementary devices such as diodes and organic transistors have been studied. In this work was studied the properties of diode devices fabricated with a semiconductor polymer, the poly-o-methoxyaniline (POMA). Devices containing electrodes of Au and Al were fabricated with semiconductor polymer of different doping levels. We found that the rectifying behavior for the heterojunctions metal/polimer are reached only for high doping level (with conductivity greater than 1,77. 10-9 S / cm), which gives the devices characteristic of a Schottky diode. The rectifying behavior was observed for electric fields of low magnitude, below the operating field (~ 600 V/cm), while for electric field greater than 600 V/cm the a linear behavior I vs.V was obtained. We determined that this Ohmic behavior arises from the charge transport over the volume of the semiconductor material after the lowering of the metal/semiconductor barrier. In devices with weakly doped semiconductor, the electrical resistance of the volume becomes high and the process of charge transportation is dominated by the volume, for any intensity of the applied electric field

Análisis del comportamiento a fatiga de uniones adhesivas de acero recubierto

Los adhesivos se conocen y han sido utilizados en multitud de aplicaciones a lo lago de la historia. En la actualidad, la tecnología de la adhesión como método de unión de materiales estructurales está en pleno crecimiento. Los avances científicos han permitido comprender mejor los fenómenos de adhesión, así como, mejorar y desarrollar nuevas formulaciones poliméricas que incrementan el rango de aplicaciones de los adhesivos. Por otro lado, el desarrollo de nuevos materiales y la necesidad de aligerar peso, especialmente en el sector transporte, hace que las uniones adhesivas se introduzcan en aplicaciones hasta ahora reservadas a otros sistemas de unión como la soldadura o las uniones mecánicas, ofreciendo rendimientos similares y, en ocasiones, superiores a los aportados por estas. Las uniones adhesivas ofrecen numerosas ventajas frente a otros sistemas de unión. En la industria aeronáutica y en automoción, las uniones adhesivas logran una reducción en el número de componentes (tales como los tornillos, remaches, abrazaderas) consiguiendo como consecuencia diseños más ligeros y una disminución de los costes de manipulación y almacenamiento, así como una aceleración de los procesos de ensamblaje, y como consecuencia, un aumento de los procesos de producción. En el sector de la construcción y en la fabricación de equipos industriales, se busca la capacidad para soportar la expansión y contracción térmica. Por lo tanto, se usan las uniones adhesivas para evitar producir la distorsión del sustrato al no ser necesario el calentamiento ni la deformación de las piezas cuando se someten a un calentamiento elevado y muy localizado, como en el caso de la soldadura, o cuando se someten a esfuerzos mecánicos localizados, en el caso de montajes remachados. En la industria naval, se están desarrollando técnicas de reparación basadas en la unión adhesiva para distribuir de forma más uniforme y homogénea las tensiones con el objetivo de mejorar el comportamiento frente a fatiga y evitar los problemas asociados a las técnicas de reparación habituales de corte y soldadura. Las uniones adhesivas al no requerir importantes aportes de calor como la soldadura, no producen modificaciones microestructurales indeseables como sucede en la zona fundida o en la zona afectada térmicamente de las uniones soldadas, ni deteriora los recubrimientos protectores de metales de bajo punto de fusión o de naturaleza orgánica. Sin embargo, las uniones adhesivas presentan una desventaja que dificulta su aplicación, se trata de su durabilidad a largo plazo. La primera causa de rotura de los materiales es la rotura por fatiga. Este proceso de fallo es la causa del 85% de las roturas de los materiales estructurales en servicio. La rotura por fatiga se produce cuando se somete al material a la acción de cargas que varían cíclicamente o a vibraciones durante un tiempo prolongado. Las uniones y estructuras sometidas a fatiga pueden fallar a niveles de carga por debajo del límite de resistencia estática del material. La rotura por fatiga en las uniones adhesivas no se produce por un proceso de iniciación y propagación de grieta de forma estable, el proceso de fatiga va debilitando poco a poco la unión hasta que llega un momento que provoca una rotura de forma rápida. Underhill explica este mecanismo como un proceso de daño irreversible de los enlaces más débiles en determinados puntos de la unión. Cuando se ha producido el deterioro de estas zonas más débiles, su área se va incrementando hasta que llega un momento en que la zona dañada es tan amplia que se produce el fallo completo de la unión. En ensayos de crecimiento de grieta realizados sobre probetas preagrietadas en viga con doble voladizo (DCB), Dessureault identifica los procesos de iniciación y crecimiento de grietas en muestras unidas con adhesivo epoxi como una acumulación de microfisuras en la zona próxima al fondo de grieta que, luego, van coalesciendo para configurar la grieta principal. Lo que supone, igualmente, un proceso de daño del adhesivo en la zona de mayor concentración de tensiones que, posteriormente, conduce al fallo de la unión. La presente tesis surge con el propósito de aumentar los conocimientos existentes sobre el comportamiento a fatiga de las uniones adhesivas y especialmente las realizadas con dos tipos de adhesivos estructurales aplicados en aceros con diferentes acabados superficiales. El estudio incluye la obtención de las curvas de tensión frente al número de ciclos hasta el fallo del componente, curvas SN o curvas de Wöhler, que permitirán realizar una estimación de la resistencia a la fatiga de un determinado material o estructura. Los ensayos de fatiga realizados mediante ciclos predeterminados de carga sinusoidales, de amplitud y frecuencia constantes, han permitido caracterizar el comportamiento a la fatiga por el número de ciclos hasta la rotura, siendo el límite de fatiga el valor al que tiende la tensión cuando el número de ciclos es muy grande. En algunos materiales, la fatiga no tiende a un valor límite sino que decrece de forma constante a medida que aumenta el número de ciclos. Para estas situaciones, se ha definido la resistencia a la fatiga (o límite de resistencia) por la tensión en que se produce la rotura para un número de ciclos predeterminado. Todos estos aspectos permitirán un mejor diseño de las uniones y las condiciones de trabajo de los adhesivos con el fin de lograr que la resistencia a fatiga de la unión sea mucho más duradera y el comportamiento total de la unión sea mucho mejor, contribuyendo al crecimiento de la utilización de las uniones adhesivas respecto a otras técnicas. ABSTRACT Adhesives are well-known and have been used in many applications throughout history. At present, adhesion bonding technology of structural materials is experiencing an important growth. Scientific advances have enabled a better understanding of the phenomena of adhesion, as well as to improve and develop new polymeric formulations that increase the range of applications. On the other hand, the development of new materials and the need to save weight, especially in the transport sector, have promote the use of adhesive bonding in many applications previously reserved for other joining technologies such as welded or mechanical joints, presenting similar or even higher performances. Adhesive bonding offers many advantages over other joining methods. For example, in the aeronautic industry and in the automation sector, adhesive bonding allows a reduction in the number of components (such as bolts, rivets, clamps) and as consequence, resulting in lighter designs and a decrease in handling and storage costs, as well as faster assembly processes and an improvement in the production processes. In the construction sector and in the industrial equipment manufacturing, the ability to withstand thermal expansion and contraction is required. Therefore, adhesion bonding technology is used to avoid any distortion of the substrate since this technology does not require heating nor the deformation of the pieces when these are exposed to very high and localized heating, as in welding, or when are subjected to localized mechanical stresses in the case of riveted joints. In the naval industry, repair techniques based in the adhesive bonding are being developed in order to distribute stresses more uniform and homogeneously in order to improve the performance against fatigue and to avoid the problems associated with standard repair techniques as cutting and welding. Adhesive bonding does not require the use of high temperatures and as consequence they do not produce undesirable microstructural changes, as it can be observed in molten zones or in heat-affected zones in the case of welding, neither is there damage of the protective coating of metals with low melting points or polymeric films. However, adhesive bonding presents a disadvantage that limits its application, the low longterm durability. The most common cause of fractures of materials is fatigue fracture. This failure process is the cause of 85% of the fracture of structural materials in service. Fatigue failure occurs when the materials are subjected to the action of cyclic loads or vibrations for a long period of time. The joints and structures subjected to fatigue can fail at stress values below the static strength of the material. Fatigue failure do not occurs by a static and homogeneous process of initiation and propagation of crack. The fatigue process gradually weakens the bond until the moment in which the fracture occurs very rapidly. Underhill explains this mechanism as a process of irreversible damage of the weakest links at certain points of the bonding. When the deterioration in these weaker zones occurs, their area increase until the damage zone is so extensive that the full failure of the joint occurs. During the crack growth tests performed on precracked double-cantilever beam specimen, (DCB), Dessureault identified the processes of crack initiation and growth in samples bonded with epoxy adhesive as a process of accumulation of microcracks on the zone near the crack bottom, then, they coalesced to configure the main crack. This is a damage process of the adhesive in the zone of high stress concentration that leads to failure of the bond. This thesis aims to further the understanding of the fatigue behavior of the adhesive bonding, primarily those based on two different types of structural adhesives used on carbon-steel with different surface treatments. This memory includes the analysis of the SN or Wöhler curves (stress vs. number of cycles curves up to the failure), allowing to carry out an estimation of the fatigue strength of a specific material or structure. The fatigue tests carried out by means of predetermined cycles of sinusoidal loads, with a constant amplitude and frequency, allow the characterisation of the fatigue behaviour. For some materials, there is a maximum stress amplitude below which the material never fails for any number of cycles, known as fatigue limit. In the other hand, for other materials, the fatigue does not tend toward a limit value but decreases constantly as the number of cycles increases. For these situations, the fatigue strength is defined by the stress at which the fracture occurs for a predetermined number of cycles. All these aspects will enable a better joint design and service conditions of adhesives in order to get more durable joints from the fatigue failure point of view and in this way contribute to increase the use of adhesive bonding over other joint techniques.

1992 census of manufactures.

Mode of access: Internet.

1992 census of manufactures.

Mode of access: Internet.

1987 census of manufactures.

Mode of access: Internet.

1987 census of manufactures.

Mode of access: Internet.

Polymer film formulations for the preparation of enteric pharmaceutical capsules

Objectives. Standard pharmaceutical capsules are designed to dissolve in the acidic environment of the stomach releasing the encapsulated contents for absorption. When release is required further along the gastrointestinal tract capsules can be coated with acid insoluble polymers to enable passage through the stomach and dissolution in the intestine. This paper describes formulations that have the potential to be used to produce two-piece hard capsules for post-gastric delivery without the requirement of an exterior coat. Methods. The formulation uses three polysaccharides: sodium alginate, hypromellose and gellan gum to provide acid insolubility and the ability to form capsules using standard industrial equipment. Key findings. The rheological profile, on cooling, of the base material, water content and thickness of the films were shown to be comparable with those of commercial capsules. The capsules remained intact for 2 h in 100 mm HCl at pH 1.2, and within 5 min of being removed from the acid and submerged in phosphate-buffered saline at pH 6.8 were ruptured. Conclusions. Selected formulations from this study have potential for use as delayed release capsules.

The application of H controller synthesis to high speed independent drive systems

This thesis describes work completed on the application of H controller synthesis to the design of controllers for single axis high speed independent drive design examples. H controller synthesis was used in a single controller format and in a self-tuning regulator, a type of adaptive controller. Three types of industrial design examples were attempted using H controller synthesis, both in simulation and on a Drives Test Facility at Aston University. The results were benchmarked against a Proportional, Integral and Derivative (PID) with velocity feedforward controller (VFF), the industrial standard for this application. An analysis of the differences between a H and PID with VFF controller was completed. A direct-form H controller was determined for a limited class of weighting function and plants which shows the relationship between the weighting function, nominal plant and the controller parameters. The direct-form controller was utilised in two ways. Firstly it allowed the production of simple guidelines for the industrial design of H controllers. Secondly it was used as the controller modifier in a self-tuning regulator (STR). The STR had a controller modification time (including nominal model parameter estimation) of 8ms. A Set-Point Gain Scheduling (SPGS) controller was developed and applied to an industrial design example. The applicability of each control strategy, PID with VFF, H, SPGS and STR, was investigated and a set of general guidelines for their use was determined. All controllers developed were implemented using standard industrial equipment.

Evaluating the use of mobile collaborative augmented reality within field service networks: the case of Océ Italia – Canon Group

The adoption of Augmented Reality (AR) technologies can make the provision of field services to industrial equipment more effective. In these situations, the cost of deploying skilled technicians in geographically dispersed locations must be accurately traded off with the risks of not respecting the service level agreements with the customers. This paper, through the case study of a leading OEM in the production printing industry, presents the challenges that have to be faced in order to favour the adoption of a particular kind of AR named Mobile Collaborative Augmented Reality (MCAR). In particular, this study uses both qualitative and quantitative research. Firstly, a demonstration to show how MCAR can support field service was settled in order to achieve information about the use experience of the people involved. Then, the entire field force of Océ Italia – Canon Group was surveyed in order to investigate quantitatively the technicians’ perceptions about the usefulness and ease of use of MCAR, as well as their intentions to use this technology.