Microstructural stability and nanoindentation of an electrodeposited nanocrystalline Ni-1.5wt.%P alloy

Microstructural stability of nanocrystalline Ni-1.5wt.%P alloy with an initial grain size of 3 nm processed by pulsed electrodeposition was studied using differential scanning calorimetry (DSC) and annealing. Microstructural characterization suggests that the observed exothermic peak during heating in DSC is related to both concurrent grain growth and Ni3P formation. Nanoindentation on samples with grain sizes from 3 to 50 nm revealed a breakdown in Hall-Petch strengthening in nano Ni-P alloy at grain sizes <= 10 nm, consistent with some previous observations. It is concluded that there is a grain boundary weakening regime for grain sizes < 10 nm, based on analysis which show that the data cannot be rationalized in terms of microstrain relaxation, variation in elastic modulus, texture evolution and duplex structure formation.

Polycrystal versus single-crystal strain rate sensitivity of cadmium

Taking polycrystalline cadmium as an example and by utilizing the predicted temperature or strain rate-dependence of the (Hall-Petch) stress-grain size parameters, a reasonably quantitative explanation is given for the grain size dependence of apparent activation volume measurements. The explanation involves the theoretical relation of these measurements to single-crystal measurements.

Microstructure and tensile properties of consolidated magnesium chips

In this study tensile properties of consolidated magnesium chips obtained from solid state re-cycling (SSR) has been examined and correlated with the microstructure. Chips machined from as-cast billet of pure magnesium were consolidated through SSR technique, comprising of compaction at ambient conditions followed by hot extrusion at four different temperatures viz., 250, 300, 350 and 400 degrees C. The extruded rods were characterized for microstructure and their room temperature tensile properties. Both ultimate tensile strength and 0.2% proof stress of these consolidated materials are higher by 15-35% compared to reference material (as cast and extruded). Further these materials obey Hall-Petch relation with respect to strength dependence of grain size. Strain hardening behavior, measured in terms of hardening exponent, hardening capacity and hardening rate was found to be distinctly different in chip consolidated material compared to reference material. Strength asymmetry, measured as a ratio of compressive proof stress to tensile proof stress was higher in chip consolidated material. (C) 2012 Elsevier B.V. All rights reserved.

Effects Analysis on the Mechanical Properties of Nanocrystalline Materials

Nanocrystalline materials are characterized by a typical grain size from 1 to 100nm. In order to study the nanocrystalline properties of nanocrystalline materials, we chose nanocrystalline coppers as the research object. The uniaxial tensile deformation of computer produced nanocrystalline coppers is simulated by using molecular dynamics with Finnis-Sinclair potential. The mean grain size of simulated nanocrystalline coppers is varied within the 5.38 to 1.79 nm range. The strength, Young's modulus and stress-strain are strongly depended on the grain size and nanocrystalline structure. The simulated nanocrystalline coppers show a reverse Hall-Petch effect.

Molecular Dynamics Simulation of the Uniaxial Tensile Deformation of Nanocrystalline Copper

纳米材料是由尺度在1～100 nm的微小颗粒组成的体系,由于它具有独特的性能而备受关注.本文简要地回顾了分子动力学在纳米材料研究中的应用,并运用它模拟了平均晶粒尺寸从1.79～5.38nm的纳米晶体的力学性质.模拟结果显示:随着晶粒尺寸的减小,系统与晶粒内部的原子平均能量升高,而晶界上则有所下降;纳米晶体的弹性模量要小于普通多晶体,并随着晶粒尺寸的减小而减小;纳米晶铜的强度随着晶粒的减小而减小,显示了反常的Hall-Petch效应;纳米晶体的塑性变形主要是通过晶界滑移与运动,以及晶粒的转动来实现的;位错运动起着次要的、有限的作用;在较大的应变下(约大于5%),位错运动开始起作用;这种作用随着晶粒尺寸的增加而愈加明显.

The Influence of Grain Size and Temperature on the mechanical Deformation of Nanocrystalline Materials: Molecular Dynamics Simulation

Nanocrystalline (nc) materials are characterized by a typical grain size of 1-100nm. The uniaxial tensile deformation of computer-generated nc samples, with several average grain sizes ranging from 5.38 to 1.79nm, is simulated by using molecular dynamics with the Finnis-Sinclair potential. The influence of grain size and temperature on the mechanical deformation is studied in this paper. The simulated nc samples show a reverse Hall-Petch effect. Grain boundary sliding and motion, as well as grain rotation are mainly responsible for the plastic deformation. At low temperatures, partial dislocation activities play a minor role during the deformation. This role begins to occur at the strain of 5%, and is progressively remarkable with increasing average grain size. However, at elevated temperatures no dislocation activity is detected, and the diffusion of grain boundaries may come into play.

Micromechanics Modeling Of Strength For Nanocrystalline Copper

We present a model in this paper for predicting the inverse Hall-Petch phenomenon in nanocrystalline (NC) materials which are assumed to consist of two phases: grain phase of spherical or spheroidal shapes and grain boundary phase. The deformation of the grain phase has an elasto-viscoplastic behavior, which includes dislocation glide mechanism, Coble creep and Nabarro-Herring creep. However the deformation of grain boundary phase is assumed to be the mechanism of grain boundary diffusion. A Hill self-consistent method is used to describe the behavior of nanocrystalline pure copper subjected to uniaxial tension. Finally, the effects of grain size and its distribution, grain shape and strain rate on the yield strength and stress-strain curve of the pure copper are investigated. The obtained results are compared with relevant experimental data in the literature.

SiC_p/6151Al复合材料的微结构效应

利用分离式Hopkinson压杆和MTS通用材料试验机研究了SiC_p/6151Al颗粒增强复合材料在不同应变率下的变形行为和增强颗粒的尺寸对复合材料微结构及变形行为的影响。结果表明，对于在不同应变率下的SiC_p/6151Al复合材料，增强颗粒尺寸大小的流动应力高于增强颗粒尺寸的流动应力。根据位错强化理论中的Hall-Petch关系对这个结果进行了解释。首次在实验上观测到增强颗粒对复合材料微损伤-微带形成的影响，并根据微带（microband）形成的双位错墙理论（double dislocation walls）, 分析了增强颗粒对复合材料微带损伤及力学性能影响的微结构效应。

过滤电弧沉积的TiN/TiCrN/CrN/CrTiN多层膜

用过滤电弧技术在高速钢表面沉积了TiN/TiCrN/CrN/CrTiN多层膜 ,用扫描电镜 (SEM )观察了截面和断口形貌及划痕后的形貌。使用俄歇电子谱仪进行剥层成分分析 ,用纳米压痕仪测试了多层膜和单层膜的显微硬度和弹性模量。结果表明 ,在调制周期大于 10 0nm时 ,多层膜的显微硬度符合Hall Petch关系 ,在 80nm时 ,则脱离线性关系。划痕法测试多层膜的结合力达到 80N。

亚微米铜压缩的力学行为

<正>在亚微米/纳米尺度,材料强度按照Hall-Petch关系随晶粒尺度的减小而增加,然而却伴随拉伸延性的降低,变形参数、如变形温度和应变速率等显著影响延性。本文用等通道弯曲变形(ECAP)的方法制备超细晶铜材料。对其进行(准)静态压缩和动态冲击压缩(SplitHopkinsonPressureBar)实验,得出应变速率在10~(-4)～10~4s~(-1)范围的应力/应变响应。同时利用光学显微镜、扫描电子显微镜、

Dislocation nucleation governed softening and maximum strength in nano-twinned metals

In conventional metals, there is plenty of space for dislocations-line defects whose motion results in permanent material deformation-to multiply, so that the metal strengths are controlled by dislocation interactions with grain boundaries(1,2) and other obstacles(3,4). For nano-structured materials, in contrast, dislocation multiplication is severely confined by the nanometre-scale geometries so that continued plasticity can be expected to be source-controlled. Nano-grained polycrystalline materials were found to be strong but brittle(5-9), because both nucleation and motion of dislocations are effectively suppressed by the nanoscale crystallites. Here we report a dislocation-nucleation-controlled mechanism in nano-twinned metals(10,11) in which there are plenty of dislocation nucleation sites but dislocation motion is not confined. We show that dislocation nucleation governs the strength of such materials, resulting in their softening below a critical twin thickness. Large-scale molecular dynamics simulations and a kinetic theory of dislocation nucleation in nano-twinned metals show that there exists a transition in deformation mechanism, occurring at a critical twin-boundary spacing for which strength is maximized. At this point, the classical Hall-Petch type of strengthening due to dislocation pile-up and cutting through twin planes switches to a dislocation-nucleation-controlled softening mechanism with twin-boundary migration resulting from nucleation and motion of partial dislocations parallel to the twin planes. Most previous studies(12,13) did not consider a sufficient range of twin thickness and therefore missed this strength-softening regime. The simulations indicate that the critical twin-boundary spacing for the onset of softening in nano-twinned copper and the maximum strength depend on the grain size: the smaller the grain size, the smaller the critical twin-boundary spacing, and the higher the maximum strength of the material.

Controlled crystallinity and crystallographic orientation of Cu nanowires fabricated in ion-track templates

The hallmark of materials science is the ability to tailor the structures of a given material to provide a desired response. In this work, the structures involving crystallinity and crystallographic orientation of Cu nanowires electrochemically fabricated in ion-track templates have been investigated as a function of fabrication condition. Both single crystalline and polycrystalline nanowires were obtained by adjusting applied voltages and temperatures of electrochemical deposition. The anti-Hall-Petch effect was experimentally evidenced in the polycrystalline nanowires. The dominant crystallographic orientations of wires along [111], [100], or [110] directions were obtained by selecting electrochemical deposition conditions, i.e., H2SO4 concentration in electrolyte, applied voltage, and electrodeposition temperature.

Análise da solidificação para o projeto de molde e a relação com as propriedades mecânicas na fundição da liga de latão 60/40

As propriedades metalúrgicas e mecânicas de uma liga metálica dependem fundamentalmente do fenômeno de solidificação e dos parâmetros associados a este. O trabalho proposto analisa a solidificação em uma primeira etapa para o projeto e otimização de moldes de fundição em areia. Nessa etapa utilizou-se como ferramenta um software comercial e resultados experimentais obtidos na indústria. Em uma segunda etapa do trabalho foi investigado as características de solidificação e suas influencias nas propriedades mecânicas e metalúrgicas de ligas de latão. A liga de latão 60/40, foi vazada em molde de areia com base de cobre objetivando uma condição de solidificação unidirecional. O monitoramento de temperaturas foi realizado utilizando-se termopares do Tipo K posicionados ao longo da altura do lingote. O lingote solidificado foi dividido em várias secções ao longo de sua altura, e para cada secção foram retirados corpos de provas e ensaiados segundo as normas ASTM E 8M-97 e ASTM E 18 – 94 para os ensaios mecânicos (σu, HRB e HV) e ASTM E112 para análise metalográfica. Os resultados da solidificação, como por exemplo o espaçamento dendritico secundário foram correlacionados com o comportamento da transferência de calor no sistema, tomando como parâmetros o gradiente térmico, a velocidade da interface (S/L) e a taxa de resfriamento, os quais foram obtidos experimentalmente. Estas características do processo metalúrgico e os resultados da solidificação foram relacionados com as propriedades mecânicas como a resistência à tração (σu) e a dureza (HRB e HV). Foram obtidas, empiricamente, expressões do tipo σu = f( λ2), HRB = f( λ2) , HV = f( λ2) e σu = f( HRB). Os resultados se mostraram coerentes com os dados da literatura e a relação de Hall-Petch que associa a dureza HRB com o espaçamento dendritico secundario. Palavras Chaves: modelagem em areia, microestrutura, propriedades mecânicas, liga de latão, solidificação, EDS.

Crossing over : the relationship between overseas Vietnamese and their homeland

This paper deals with the question—what are the effects of displacement on the perceptions diasporic Vietnamese have of their homeland, and of themselves? Identity has become an issue partly because there has frequently been an assumption that identity is somehow seamless, stable and unchanging. Migration highlights the relational and intersubjective nature of identity (see Bhabha, 1990; Hall, 1990). The homeland itself is also a site of constant transformation and negotiation of identities but the translocation of people accentuates the disjuncture between place and identity. When examining the Vietnamese diaspora, identity must be conceived within the locus of power relations that Vietnamese people operate within, both at a local and global level. The efflorescence of an interest in the politics of identity has come about through massive post-war decolonisation and the redrawing of national boundaries. Here, I will scrutinise how these wider relations of power act upon diasporic identities.

Genetic and Malt Quality Diversity of East Asian Two-Rowed Barley Accessions in Relationship to North American Malting Barley.

Because of epidemics of Fusarium head blight (FHB; caused by Fusarium graminearum Schwabe [teleomorph Gibberella zeae (Schwein.) Petch]) in the northern Great Plains of the United States and Canada in the past two decades, malting barley breeders have been forced to use nonadapted barley (Hordeum vulgare L.) accessions as sources of FHB resistance. Many of the resistant accessions are from East Asia, and limited information is available on their genetic diversity and malt quality. The objectives of this study were to determine the genetic diversity among 30 East Asian accessions and two North American cultivars. Genetic diversity was based on 49 simple-sequence repeat markers. All accessions were tested for barley grain brightness; protein content; 1,000-kernel weight; malting loss; fine-grind malt extract; content of plump kernels, free amino nitrogen, soluble protein, and wort beta-glucan; the Kolbach index (i.e., the ratio of malt soluble protein to malt total protein); a-amylase activity; diastatic power; won color; and wort viscosity. A few accessions had equal quality compared with Harrington and Conlon barley for individual traits but not for all. Qing 2, Mokkei 93-78, and Nitakia 48 could be excellent sources for increased malt extract; Nitakia 48 is a possible source for low wort viscosity; and Mokkei 93-78 and Nitakia 48 are putative sources of low beta-glucan content. The cluster analyses also implied that the malt quality of an accession cannot be predicted based on the country where it was developed.