Engineering design of an integrated sustainable process system for cassava biobased materials

Cassava contributes significantly to biobased material development. Conventional approaches for its bio-derivative-production and application cause significant wastes, tailored material development challenges, with negative environmental impact and application limitations. Transforming cassava into sustainable value-added resources requires redesigning new approaches. Harnessing unexplored material source, and downstream process innovations can mitigate challenges. The ultimate goal proposed an integrated sustainable process system for cassava biomaterial development and potential application. An improved simultaneous release recovery cyanogenesis (SRRC) methodology, incorporating intact bitter cassava, was developed and standardized. Films were formulated, characterised, their mass transport behaviour, simulating real-distribution-chain conditions quantified, and optimised for desirable properties. Integrated process design system, for sustainable waste-elimination and biomaterial development, was developed. Films and bioderivatives for desired MAP, fast-delivery nutraceutical excipients and antifungal active coating applications were demonstrated. SRRC-processed intact bitter cassava produced significantly higher yield safe bio-derivatives than peeled, guaranteeing 16% waste-elimination. Process standardization transformed entire root into higher yield and clarified colour bio-derivatives and efficient material balance at optimal global desirability. Solvent mass through temperature-humidity-stressed films induced structural changes, and influenced water vapour and oxygen permeability. Sevenunit integrated-process design led to cost-effectiveness, energy-efficient and green cassava processing and biomaterials with zero-environment footprints. Desirable optimised bio-derivatives and films demonstrated application in desirable in-package O2/CO2, mouldgrowth inhibition, faster tablet excipient nutraceutical dissolutions and releases, and thymolencapsulated smooth antifungal coatings. Novel material resources, non-root peeling, zero-waste-elimination, and desirable standardised methodology present promising process integration tools for sustainable cassava biobased system development. Emerging design outcomes have potential applications to mitigate cyanide challenges and provide bio-derivative development pathways. Process system leads to zero-waste, with potential to reshape current style one-way processes into circular designs modelled on nature's effective approaches. Indigenous cassava components as natural material reinforcements, and SRRC processing approach has initiated a process with potential wider deployment in broad product research development. This research contributes to scientific knowledge in material science and engineering process design.

Humidity passive sensors based on UHF RFID using cork dielectric slabs

In this paper we show the design of passive UHF RFID tag antenna on cork substrate. Due to the cork sensitivity to humidity changes, we can use the developed sensor to sense changes in the relative humidity of the environment, without the need for batteries. The antenna is built using inkjet printing technology, which allows a good accuracy of the design manufacturing. The sensor proved usable for humidity changes detection with a variation of threshold power from 11 to 15 dB between 60 and near 100% humidity levels. Presenting, therefore, reading ranges between 3 to 5 meters. © 2015 EurAAP.

Dipolo impreso para aplicaciones Wi-fi y caracterización de la ganancia por medio de la celda TEM

Este trabajo recoge el estudio, diseño, fabricación y análisis de dos dipolos de media onda para aplicaciones Wi-fi, con objeto de caracterizar sus respectivas ganancias mediante el uso de dos sistemas de medida distintos, el primero basado en el análisis del balance de enlace entre antenas mediante un analizador de redes y el segundo mediante una celda TEM. Para obtener un correcto funcionamiento de los dipolos, resulta de vital importancia conseguir un buen ajuste de las dimensiones de los mismos durante el desarrollo práctico del proyecto, consiguiendo una máxima transferencia de potencia y un ancho de banda suficientemente amplio para asegurar que las antenas presenten una buena adaptación en la banda de los 2.4 GHz – 2.5 GHz.

Module property verification : A method to plan and perform quality verifications in modular architectures

Modular product architectures have generated numerous benefits for companies in terms of cost, lead-time and quality. The defined interfaces and the module’s properties decrease the effort to develop new product variants, and provide an opportunity to perform parallel tasks in design, manufacturing and assembly. The background of this thesis is that companies perform verifications (tests, inspections and controls) of products late, when most of the parts have been assembled. This extends the lead-time to delivery and ruins benefits from a modular product architecture; specifically when the verifications are extensive and the frequency of detected defects is high. Due to the number of product variants obtained from the modular product architecture, verifications must handle a wide range of equipment, instructions and goal values to ensure that high quality products can be delivered. As a result, the total benefits from a modular product architecture are difficult to achieve. This thesis describes a method for planning and performing verifications within a modular product architecture. The method supports companies by utilizing the defined modules for verifications already at module level, so called MPV (Module Property Verification). With MPV, defects are detected at an earlier point, compared to verification of a complete product, and the number of verifications is decreased. The MPV method is built up of three phases. In Phase A, candidate modules are evaluated on the basis of costs and lead-time of the verifications and the repair of defects. An MPV-index is obtained which quantifies the module and indicates if the module should be verified at product level or by MPV. In Phase B, the interface interaction between the modules is evaluated, as well as the distribution of properties among the modules. The purpose is to evaluate the extent to which supplementary verifications at product level is needed. Phase C supports a selection of the final verification strategy. The cost and lead-time for the supplementary verifications are considered together with the results from Phase A and B. The MPV method is based on a set of qualitative and quantitative measures and tools which provide an overview and support the achievement of cost and time efficient company specific verifications. A practical application in industry shows how the MPV method can be used, and the subsequent benefits

Diseño, implementación y verificación de un controlador para robots educativos

[EN] This project briefly analyzes the scope and applications of Industrial Robotics, as well as the importance that this technical discipline has gained in the past decades. In addition, it proposes a modern platform to assist in teaching this discipline in colleges and universities. This new educational platform for the teaching of Industrial Robotics is based on the robotic systems from Rhino Robotics Ltd., using the existing robotic arms and replacing the control electronics by a newer, modern and yet backwards-compatible controller. In addition to the controller, this platform also provides new, up-to-date software utilities that are more intuitive than those provided with the old system. The work to be done consists essentially in receiving commands from a personal computer which the controller must interpret in order to control the motors of the robotic arm. The controller itself will be implemented as an embedded system based on microcontrollers. This requires the implementation of a communication protocol between the personal computer and the microcontroller, the design of a command interpreter, the design of the electronics for motor control using PWM and H-bridges, and the implementation of control techniques (more precisely, PID control). Hence, this project combines software and hardware design and integration techniques with motor control techniques and feedback control methods from Control Engineering, along with the kinematic analysis of the Rhino XR-4 robotic arm. 

Anisotropy in plastic deformation of extruded magnesium alloy sheet during tensile straining at high temperature

Experimental measurements are used to characterize the anisotropy of flow stress in extruded magnesium alloy AZ31 sheet during uniaxial tension tests at temperatures between 350°C and 450°C, and strain rates ranging from 10-5 to 10-2 s-1. The sheet exhibits lower flow stress and higher tensile ductility when loaded with the tensile axis perpendicular to the extrusion direction compared to when it is loaded parallel to the extrusion direction. This anisotropy is found to be grain size, strain rate, and temperature dependent, but is only weakly dependent on texture. A microstructure based model (D. E. Cipoletti, A. F. Bower, P. E. Krajewski, Scr. Mater., 64 (2011) 931–934) is used to explain the origin of the anisotropic behavior. In contrast to room temperature behavior, where anisotropy is principally a consequence of the low resistance to slip on the basal slip system, elevated temperature anisotropy is found to be caused by the grain structure of extruded sheet. The grains are elongated parallel to the extrusion direction, leading to a lower effective grain size perpendicular to the extrusion direction. As a result, grain boundary sliding occurs more readily if the material is loaded perpendicular to the extrusion direction.

Impact of SLM build parameters on the surface quality

Additive manufacturing by melting of metal powders is an innovative method to create one-offs and customized parts. Branches like dentistry, aerospace engineering and tool making were indicated and the manufacturing methods are established. Besides all the advantages, like freedom of design, manufacturing without a tool and the reduction of time-to-market, there are however some disadvantages, such as reproducibility or the surface quality. The surface quality strongly depends on the orientation of the component in the building chamber, the process parameters which are laser power and exposure time, but also on the so-called “hatch”-strategy, which includes the way the laser exposes the solid areas. This paper deals with the investigation and characterization of the surface quality of generated parts produced by SLM. Main process parameters including part orientation, part size and hatch strategies are investigated and monitored. The outcome is a recommendation of suitable hatch strategies depending on desired part properties. This includes metered values and takes into account process stability and reproducibility.

Light curing through glass ceramics with a second- and a third-generation LED curing unit: effect of curing mode on the degree of conversion of dual-curing resin cements

Objectives The aim of this study was to measure the degree of conversion (DC) of five dual-curing resin cements after different curing modes with a second- and a third-generation light-emitting diode (LED) curing unit. Additionally, irradiance of both light curing units was measured at increasing distances and through discs of two glass ceramics for computer-aided design/manufacturing (CAD/CAM). Materials and methods Irradiance and spectra of the Elipar FreeLight 2 (Standard Mode (SM)) and of the VALO light curing unit (High Power Mode (HPM) and Xtra Power Mode (XPM)) were measured with a MARC radiometer. Irradiance was measured at increasing distances (control) and through discs (1.5 to 6 mm thickness) of IPS Empress CAD and IPS e.max CAD. DC of Panavia F2.0, RelyX Unicem 2 Automix, SpeedCEM, BisCem, and BeautiCem SA was measured with an attenuated total reflectance–Fourier transform infrared spectrometer when self-cured (negative control) or light cured in SM for 40 s, HPM for 32 s, or XPM for 18 s. Light curing was performed directly (positive control) or through discs of either 1.5- or 3-mm thickness of IPS Empress CAD or IPS e.max CAD. DC was analysed with Kruskal–Wallis tests followed by pairwise Wilcoxon rank sum tests (α = 0.05). Results Maximum irradiances were 1,545 mW/cm2 (SM), 2,179 mW/cm2 (HPM), and 4,156 mW/cm2 (XPM), and all irradiances decreased by >80 % through discs of 1.5 mm, ≥95 % through 3 mm, and up to >99 % through 6 mm. Generally, self-curing resulted in the lowest DC. For some cements, direct light curing did not result in higher DC compared to when light cured through ceramic discs. For other cements, light curing through ceramic discs of 3 mm generally reduced DC. Conclusions Light curing was favourable for dual-curing cements. Some cements were more susceptible to variations in curing mode than others. Clinical relevance When light curing a given cement, the higher irradiances of the third-generation LED curing unit resulted in similar DC compared to the second-generation one, though at shorter light curing times.

Exploiting the Modularity of Value Chains: Inter-firm Dynamics of the Taiwanese Notebook PC Industry

This paper explores the inter-firm dynamics that govern the rise of capabilities of latecomer firms operating in global value chains. By extending and modifying the model proposed by Gereffi, Humphrey and Sturgeon [2005], I present a framework in which the rise of supplier capabilities is determined by interactions among the strategies of the firms. Based on a case study of the Taiwanese notebook PC industry, the paper will explore how the interactions among outsourcing strategies by lead firms from the developed countries, the learning strategies of Taiwanese suppliers, and the product strategy of powerful component vendors have driven the explosive growth of the industry after the 1990s. By so doing, the paper attempts to highlight the active roles firms play in determining the speed and direction of the rise in supplier capabilities.

Essentials in Ontology Engineering: Methodologies, Languages, and Tools

In the beginning of the 90s, ontology development was similar to an art: ontology developers did not have clear guidelines on how to build ontologies but only some design criteria to be followed. Work on principles, methods and methodologies, together with supporting technologies and languages, made ontology development become an engineering discipline, the so-called Ontology Engineering. Ontology Engineering refers to the set of activities that concern the ontology development process and the ontology life cycle, the methods and methodologies for building ontologies, and the tool suites and languages that support them. Thanks to the work done in the Ontology Engineering field, the development of ontologies within and between teams has increased and improved, as well as the possibility of reusing ontologies in other developments and in final applications. Currently, ontologies are widely used in (a) Knowledge Engineering, Artificial Intelligence and Computer Science, (b) applications related to knowledge management, natural language processing, e-commerce, intelligent information integration, information retrieval, database design and integration, bio-informatics, education, and (c) the Semantic Web, the Semantic Grid, and the Linked Data initiative. In this paper, we provide an overview of Ontology Engineering, mentioning the most outstanding and used methodologies, languages, and tools for building ontologies. In addition, we include some words on how all these elements can be used in the Linked Data initiative.

Ku band transmitarray lens for microwave applications

In this document a microstrip constrained lens device for Ku band, for microwave purpose, is presented. This paper offers an overview of artificial lens-type devices and the proposed transmitarray lens is thoroughly studied in terms of design and manufacturing, with architecture discussion and selection, along with the design, manufacturing and validation of all the forming components of the transmitarray (transmission circuits, radiating elements, etc.). Each element is properly characterized and assembled properly in the complete transmitarray prototype. Eventually, radiation pattern measurements as well as gain and directivity values, are provided to show the proper behaviour of the proposed transmitarray lens.

Improvement of Mechanical Properties and Life Extension of High Reliability Structural Components by Laser Shock Processing

Profiting by the increasing availability of laser sources delivering intensities above 109 W/cm2 with pulse energies in the range of several Joules and pulse widths in the range of nanoseconds, laser shock processing (LSP) is being consolidating as an effective technology for the improvement of surface mechanical and corrosion resistance properties of metals and is being developed as a practical process amenable to production engineering. The main acknowledged advantage of the laser shock processing technique consists on its capability of inducing a relatively deep compression residual stresses field into metallic alloy pieces allowing an improved mechanical behaviour, explicitly, the life improvement of the treated specimens against wear, crack growth and stress corrosion cracking. Following a short description of the theoretical/computational and experimental methods developed by the authors for the predictive assessment and experimental implementation of LSP treatments, experimental results on the residual stress profiles and associated surface properties modification successfully reached in typical materials (specifically Al and Ti alloys) under different LSP irradiation conditions are presented. In particular, the analysis of the residual stress profiles obtained under different irradiation parameters and the evaluation of the corresponding induced surface properties as roughness and wear resistance are presented.

Implementación de un sistema multicanal de medida de temperatura con termopares

Este proyecto fin de carrera tiene como finalidad el diseño e implementación de un sistema multicanal de medida de temperaturas con termopares con procesado digital. Se ha realizado un prototipo de cuatro canales con conexión de termopar, que es el tipo de sensor utilizado para realizar dichas medidas. La tensión generada por el termopar es procesada mediante un conversor de termopar a digital con salida en interfaz modo serie o SPI (Serial Peripheral Interface). El control de dicha comunicación se realiza por medio de un Array de Puertas Lógicas Programables o FPGA (Field Programmable Gate Array), en concreto se ha utilizado una plataforma de desarrollo modelo Virtex-5 de la empresa Xilinx. Esta tarjeta se ha programado también para el procesado software y la posterior comunicación serie con el PC, el cual consta de una interfaz de usuario donde se muestran los resultados de las medidas en tiempo real. El proyecto ha sido desarrollado en colaboración con una empresa privada dedicada principalmente al diseño electrónico. La finalidad de este prototipo es el estudio de una actualización del bloque de medida para el control de las curvas de temperatura de un equipo de reparación aeronáutica. En esta memoria se describe el proceso realizado para el desarrollo del prototipo, incluye la presentación de los estudios realizados y la información necesaria para llevar a cabo el diseño, la fabricación y la programación de los diferentes bloques que componen el sistema. ABSTRACT. The aim of this project is to implement a multichannel temperature measurement system with digital processing, using thermocouples. A four-channel prototype with thermocouple connection has been built. The thermocouple voltage is converted to digital line using a Thermocouple-to-Digital Converter with a Serial Perpheral Interface (SPI) output. The master which controls this communication is embedded in a Field Programmable Gate Array (FPGA), specifically the Xilinx Virtex-5 model. This FPGA also has the code for software temperature processing and the prototype to PC serial communication embedded. The PC user interface displays the measurement results in real time. This project has been developed at a private electronics design company. The company wants to study an update to change the analogue temperature controller equipment to a digital one. So this prototype studies a digital version of the temperature measurement block. The processes accomplished for the prototype development are detailed in the next pages of this document. It includes the studies and information needed to develop the design, manufacturing process and programming of the blocks which integrate with the global system.

Propellantless de orbiting of space debris by bare electrodynamic tethers

A 3-year Project started on November 1 2010, financed by the European Commision within the FP-7 Space Program, and aimed at developing an efficient de-orbit system that could be carried on board by future spacecraft launched into LEO, will be presented. The operational system will deploy a thin uninsulated tape-tether to collect electrons as a giant Langmuir probe, using no propellant/no power supply, and generating power on board. This project will involve free-fall tests, and laboratory hypervelocity-impact and tether-current tests, and design/Manufacturing of subsystems: interface elements, electric control and driving module, electron-ejecting plasma contactor, tether-deployment mechanism/end-mass, and tape samples. Preliminary results to be presented involve: i) devising criteria for sizing the three disparate tape dimensions, affecting mass, resistance, current-collection, magnetic self-field, and survivability against debris itself; ii) assessing the dynamical relevance of tether parameters in implementing control laws to limit oscillations in /off the orbital plane, where passive stability may be marginal; iii) deriving a law for bare-tape current from numerical simulations and chamber tests, taking into account ambient magnetic field, ion ram motion, and adiabatic electron trapping; iv) determining requirements on a year-dormant hollow cathode under long times/broad emission-range operation, and trading-off against use of electron thermal emission; v) determining requirements on magnetic components and power semiconductors for a control module that faces high voltage/power operation under mass/volume limitations; vi) assessing strategies to passively deploy a wide conductive tape that needs no retrieval, while avoiding jamming and ending at minimum libration; vii) evaluating the tape structure as regards conductive and dielectric materials, both lengthwise and in its cross-section, in particular to prevent arcing in triple-point junctions.

Fiabilidad de minimodulos de silicio

El objetivo de este Proyecto Final de Carrera es la realización de un ensayo de fiabilidad de componentes electrónicos, más concretamente de Minimódulos de Silicio, con el fin de estudiar su comportamiento a lo largo del tiempo de vida. Debido a la larga duración de los Minimódulos de Silicio , un ensayo de este tipo podría durar años, por lo que es necesario realizar un ensayo acelerado que acorte significativamente el tiempo del experimento, para ello, han de someterse a esfuerzos mayores que en condiciones normales de funcionamiento. A día de hoy, los Minimódulos de silicio, que conocemos como placas solares fotovoltaicas, se usan en infinidad de dispositivos debido a las múltiples ventajas que conllevan. La principal ventaja es poder llevar electricidad a cualquier parte del planeta sin necesidad de tener que hacer unas elevadas inversiones. Esta electricidad proviene de una fuente de energía inagotable y nada contaminante, con lo que ayudamos a mantener el equilibrio del planeta. La mayoría de las veces estas placas solares fotovoltaicas se usan en el exterior, soportando cambios de temperatura y de humedad elevados, de ahí, la importancia de realizar ensayos de fiabilidad, que muestren sus posibles causas de fallo, los efectos que producen estos fallos y los aspectos de diseño, fabricación y mantenimiento que puedan afectarles. Los Minimódulos de silicio utilizados en este proyecto son el modelo MC-SP0.8-NF-GCS de la empresa fabricante Multicomp. Para realizar el Proyecto hubiéramos necesitado una cámara climática que simulara unas condiciones ambientales determinadas, pero debido a la dificultad de iluminar el módulo dentro de la cámara climática hemos desarrollado un nuevo sistema de ensayos acelerados en temperatura. El nuevo sistema de ensayos acelerados consiste en: •Colocar los módulos fotovoltaicos en el laboratorio con un foco de 500W que irradia lo equivalente al sol. •Los tres módulos trabajarán a tres temperaturas diferentes para simular condiciones ambientales distintas, concretamente a 60°C, 72°C y 84°C. •Mediante un sistema automático de medida diseñado en LabVIEW, de manera simultánea tomará medidas de tensión en las tres placas y estudiaremos el grado degradación en cada placa. Se analizaran los resultados obtenido de cada una de las medidas y se realizará un estudio de fiabilidad y del proceso de degradación sufrido por los Minimódulos de silicio. Este PFC se puede dividir en las siguientes fases de trabajo siendo el ensayo la parte más larga en el tiempo: •Búsqueda de bibliografía documentación y normas aplicables. •Familiarización con los equipos y software, estudiando el manejo del software que viene con el Multímetro Keithley 2601 y el programa LabVIEW. •Desarrollo del hardware y sistemas necesarios para la realización del ensayo. •Montaje del ensayo •Realización del ensayo. •Análisis de resultados. ABSTRACT. The objective of this Final Project is conducting a test reliability of electronic components, more specifically Silicon minimodules, in order to study their behavior throughout the life span. Due to the long duration of Silicon minimodules a test like this could take years, so it is necessary to perform an accelerated significantly shorten the time of the experiment, testing for it, should be subjected to greater efforts than in normal operating. Today, the mini-modules, silicon is known as photovoltaic solar panels are used in a multitude of devices due to the many advantages they bring. The main advantage is to bring electricity to anywhere in the world without having to make high investments. This electricity comes from an inexhaustible source of energy and no pollution, thus helping to maintain the balance of the planet. Most of the time these solar photovoltaic panels are used on the outside, enduring changes in temperature and high humidity, hence, the importance of reliability testing, showing the possible causes of failure, the effects produced by these faults and aspects of design, manufacturing and maintenance that may affect them. The silicon mini-modules used in this project are the MC-SP0.8-NF-GCS model Multicomp manufacturing company. To realize the project we would have needed a climatic chamber to simulate specific environmental conditions, but due to the difficulty of illuminating the module in the climate chamber we have developed a new system of accelerated tests in temperature. The new system is accelerated tests: •Place the PV modules in the laboratory with a focus on the equivalent 500W radiating sun. •The three modules work at three different temperatures to simulate different environmental conditions, namely at 60 °C, 72 °C and 84 °C. •Automatic measurement system designed in LabVIEW, simultaneous voltage measurements taken at the three plates and study the degradation degree in each plate. The results obtained from each of the measurements and a feasibility study and degradation suffered by the silicon is performed minimodules were analyzed. This PFC can be divided into the following phases of the test work the longest part being overtime: •Literature search and documentation standards. •Familiarization with equipment and software, studying management software that comes with the Keithley 2601 multimeter and the LabVIEW program. •Development of hardware and systems necessary for the conduct of the trial. •Experiment setup •Carrying out the experiment. •Analysis of results.