Software reliability growth models based on local polynomial modeling with kernel smoothing

Software reliability growth models (SRGMs) are extensively employed in software engineering to assess the reliability of software before their release for operational use. These models are usually parametric functions obtained by statistically fitting parametric curves, using Maximum Likelihood estimation or Least–squared method, to the plots of the cumulative number of failures observed N(t) against a period of systematic testing time t. Since the 1970s, a very large number of SRGMs have been proposed in the reliability and software engineering literature and these are often very complex, reflecting the involved testing regime that often took place during the software development process. In this paper we extend some of our previous work by adopting a nonparametric approach to SRGM modeling based on local polynomial modeling with kernel smoothing. These models require very few assumptions, thereby facilitating the estimation process and also rendering them more relevant under a wide variety of situations. Finally, we provide numerical examples where these models will be evaluated and compared.

The Computer Software Rental Amendments Act of 1990 : the nonprofit library lending exemption to the "rental right" : a report of the acting Register of Copyrights.

"March 1994."

Computer software management : a primer for project management and quality control /

Includes bibliographical references (p. 48-49).

Developing Collective Teaching Computer Software for the Course “Decision Theory”

Improvement of training students using modern information technologies, like collective developing teaching computer software, is discussed. Organizational, technical, technological advices are given. Experience of using information technologies in educational course “Decision Theory” is described.

Reliability analysis of flip chip designs via computer simulation

A flip chip component is a silicon chip mounted to a substrate with the active area facing the substrate. This paper presents the results of an investigation into the relationship between a number of important material properties and geometric parameters on the thermal-mechanical fatigue reliability of a standard flip chip design and a flip chip design with the use of microvias. Computer modeling has been used to analyze the mechanical conditions of flip chips under cyclic thermal loading where the Coffin-Manson empirical relationship has been used to predict the life time of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young's modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE (CTEz) of the substrate, the thickness of the substrate, and the standoff height. When these parameters vary, the predicted life-times are calculated and some of the features of the results are explained. By comparing the predicted lifetimes of the two designs and the strain conditions under thermal loading, the local CTE mismatch has been found to be one of most important factors in defining the reliability of flip chips with microvias.

Using computer models to identify optimal conditions for flip-chip assembly and reliability

Flip-chip assembly, developed in the early 1960s, is now being positioned as a key joining technology to achieve high-density mounting of electronic components on to printed circuit boards for high-volume, low-cost products. Computer models are now being used early within the product design stage to ensure that optimal process conditions are used. These models capture the governing physics taking place during the assembly process and they can also predict relevant defects that may occur. Describes the application of computational modelling techniques that have the ability to predict a range of interacting physical phenomena associated with the manufacturing process. For example, in the flip-chip assembly process we have solder paste deposition, solder joint shape formation, heat transfer, solidification and thermal stress. Illustrates the application of modelling technology being used as part of a larger UK study aiming to establish a process route for high-volume, low-cost, sub-100-micron pitch flip-chip assembly.

Computer modelling of the reliability of flip chips with metal column bumping

Recently, research has been carried out to test a novel bumping method which omits the under bump metallurgy forming process by bonding copper columns directly onto the Al pads of the silicon dies. This bumping method could be adopted to simplify the flip chip manufacturing process, increase the productivity and achieve a higher I/O count. This paper describes an investigation of the solder joint reliability of flip-chips based on this new bumping process. Computer modelling methods are used to predict the shape of solder joints and response of flip chips to thermal cyclic loading. The accumulated plastic strain energy at the comer solder joints is used as the damage indicator. Models with a range of design parameters have been compared for their reliability. The parameters that have been investigated are the copper column height, radius and solder volume. The ranking of the relative importance of these parameters is given. For most of the results presented in the paper, the solder material has been assumed to be the lead-free 96.5Sn3.5Ag alloy but some results for 60Sn40Pb solder joints have also been presented.

Validity and reliability of hallux valgus angle measured on digital photographs

STUDY DESIGN: Controlled laboratory study. OBJECTIVES: To investigate the reliability and concurrent validity of photographic measurements of hallux valgus angle compared to radiographs as the criterion standard. BACKGROUND: Clinical assessment of hallux valgus involves measuring alignment between the first toe and metatarsal on weight-bearing radiographs or visually grading the severity of deformity with categorical scales. Digital photographs offer a noninvasive method of measuring deformity on an exact scale; however, the validity of this technique has not previously been established. METHODS: Thirty-eight subjects (30 female, 8 male) were examined (76 feet, 54 with hallux valgus). Computer software was used to measure hallux valgus angle from digital records of bilateral weight-bearing dorsoplantar foot radiographs and photographs. One examiner measured 76 feet on 2 occasions 2 weeks apart, and a second examiner measured 40 feet on a single occasion. Reliability was investigated by intraclass correlation coefficients and validity by 95% limits of agreement. The Pearson correlation coefficient was also calculated. RESULTS: Intrarater and interrater reliability were very high (intraclass correlation coefficients greater than 0.96) and 95% limits of agreement between photographic and radiographic measurements were acceptable. Measurements from photographs and radiographs were also highly correlated (Pearson r = 0.96). CONCLUSIONS: Digital photographic measurements of hallux valgus angle are reliable and have acceptable validity compared to weight-bearing radiographs. This method provides a convenient and precise tool in assessment of hallux valgus, while avoiding the cost and radiation exposure associated with radiographs.

Using mobile technology and augmented reality to increase data reliability for environmental assessment

Climate change and land use pressures are making environmental monitoring increasingly important. As environmental health is degrading at an alarming rate, ecologists have tried to tackle the problem by monitoring the composition and condition of environment. However, traditional monitoring methods using experts are manual and expensive; to address this issue government organisations designed a simpler and faster surrogate-based assessment technique for consultants, landholders and ordinary citizens. However, it remains complex, subjective and error prone. This makes collected data difficult to interpret and compare. In this paper we describe a work-in-progress mobile application designed to address these shortcomings through the use of augmented reality and multimedia smartphone technology.

A real-time software architecture for robotics and automation

This paper describes a software architecture for real-world robotic applications. We discuss issues of software reliability, testing and realistic off-line simulation that allows the majority of the automation system to be tested off-line in the laboratory before deployment in the field. A recent project, the automation of a very large mining machine is used to illustrate the discussion.

A Survey Of Software Dependability

This paper presents on overview of the issues in precisely defining, specifying and evaluating the dependability of software, particularly in the context of computer controlled process systems. Dependability is intended to be a generic term embodying various quality factors and is useful for both software and hardware. While the developments in quality assurance and reliability theories have proceeded mostly in independent directions for hardware and software systems, we present here the case for developing a unified framework of dependability—a facet of operational effectiveness of modern technological systems, and develop a hierarchical systems model helpful in clarifying this view. In the second half of the paper, we survey the models and methods available for measuring and improving software reliability. The nature of software “bugs”, the failure history of the software system in the various phases of its lifecycle, the reliability growth in the development phase, estimation of the number of errors remaining in the operational phase, and the complexity of the debugging process have all been considered to varying degrees of detail. We also discuss the notion of software fault-tolerance, methods of achieving the same, and the status of other measures of software dependability such as maintainability, availability and safety.