Demonstration thermo-electric and MHD mathematical models of a 500 kA A1 electrolysis cell

In the present study, a 3D full cell quarter thermo-electric model of a 500kA demonstration cell has been developed and solved. In parallel, a non-linear wave MHD model of the same 500 kA demonstration cell has been developed and solved. A preliminary study of the impact of the interactions between the cell thermo-electric and MHD models will be presented.

Thermo-mechanical modelling of power electronics module structures

Power electronic modules distinguish themselves from other modules by their high power operation. These modules are used extensively in high power application markets such as aerospace, automotive, industrial and traction and drives. This paper discusses typical packaging technologies for power electronics modules. It also discusses the latest results from a UK research project investigating the physics-of-failure approach to reliability analysis and predictions for power modules. An integrated design enviroment for incorporating of affects of uncertainty into the design environment was outlined.

Thermo-mechanical analysis of the packaging process for micro-electronic displays

Micro-electronic displays are sensitive devices and its performance is easily affected by external environmental factors. To enable the display to perform in extreme conditions, the device must be structurally strengthened, the effects of this packaging process was investigated. A thermo-mechanical finite element analysis was used to discover potential problems in the packaging process and to improve the overall design of the device. The main concern from the analysis predicted that displacement of the borosilicate glass and the Y stress of the adhesive are important. Using this information a design which reduced the variation of displacement and kept the stress to a minimum was suggested

Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display

The performance enhancement of AMLCD's has been hindered with problems encountered during the curing process, such as window framing and de-lamination of the glass and adhesive. A thermo-mechanical analysis using FEA was conducted to help optimise the design of the rugged display and enhance the optical performance.

Review of methods to predict solder joint reliability under thermo-mechanical cycling

Solder joints are often the cause of failure in electronic devices, failing due to cyclic creep induced ductile fatigue. This paper will review the modelling methods available to predict the lifetime of SnPb and SnAgCu solder joints under thermo-mechanical cycling conditions such as power cycling, accelerated thermal cycling and isothermal testing, the methods do not apply to other damage mechanisms such as vibration or drop-testing. Analytical methods such as recommended by the IPC are covered, which are simple to use but limited in capability. Finite element modelling methods are reviewed, along with the necessary constitutive laws and fatigue laws for solder, these offer the most accurate predictions at the current time. Research on state-of-the-art damage mechanics methods is also presented, although these have not undergone enough experimental validation to be recommended at present

The effects of thermo-electrically induced convection in alloy solidification

The effects of a constant uniform magnetic field on thermoelectric currents during dendritic solidification were investigated using a 2-dimensional enthalpy based numerical model. Using an approximation of the dendrite growing in free space it was found that the resulting Lorentz force generates a circulating flow influencing the solidification pattern. As the magnetic field strength increases it was found that secondary growth on the clockwise side of the primary arm of the dendrite was encouraged, while the anticlockwise side is suppressed due to a reduction in local free energy. The preferred direction of growth rotated in the clockwise sense under an anti-clockwise flow for both the binary alloy and pure material. The tip velociy is significantly increased compared to growth in stagnant flow. This is due to a small recirculation that follows the tip of the dendrite; bringing in colder liquid and lower concentrations of solute. The recirculation being not normally incident on the tip is most likely the cause for the rotation. Grain growth consisting of multiple seeds with the same anisotropy growing in the same plane, gives a competition to release latent heat resulting in stunted growth. The initial growth for each dendrite is very similar to the single seed cases indicating that dendrites must become before the thermoelectric interactions are significant.

Dynamical and steady-state requirements for effective entanglement transfer

Entanglement transfer processes from a continuous-variable (CV) to a qubit system have primary importance in quantum information processing due to some practical implications in the realization of a quantum network. A CV system can propagate entanglement while a qubit system is easy to manipulate. We study conditions to entangle two atomic qubits with a two-mode squeezed field driving two cavities containing the atoms.

Dynamical entanglement transfer for quantum-information networks

A key element in the architecture of a quantum-information processing network is a reliable physical interface between fields and qubits. We study a process of entanglement transfer engineering, where two remote qubits respectively interact with an entangled two-mode continuous-variable (CV) field. We quantify the entanglement induced in the qubit state at the expenses of the loss of entanglement in the CV system. We discuss the range of mixed entangled states which can be obtained with this setup. Furthermore, we suggest a protocol to determine the residual entangling power of the light fields inferring, thus, the entanglement left in the field modes which, after the interaction, are no longer in a Gaussian state. Two different setups are proposed: a cavity-QED system and an interface between superconducting qubits and field modes. We address in detail the practical difficulties inherent in these two proposals, showing that the latter is promising in many aspects.

Enhanced dynamical entanglement transfer with multiple qubits

We present two strategies to enhance the dynamical entanglement transfer from continuous-variable (CV) to finite-dimensional systems by employing multiple qubits. First, we consider the entanglement transfer to a composite finite-dimensional system of many qubits simultaneously interacting with a bipartite CV field. We show that, considering realistic conditions in the generation of CV entanglement, a small number of qubits resonantly coupled to the CV system are sufficient for an almost complete dynamical transfer of the entanglement. Our analysis also sheds further light on the transition between the microscopic and macroscopic behaviors of composite finite-dimensional systems coupled to bosonic fields (like atomic clouds interacting with light). Furthermore, we present a protocol based on sequential interactions of the CV system with some ancillary qubit systems and on subsequent measurements, allowing us to probabilistically convert CV entanglement into "almost-perfect" Bell pairs of two qubits. Our proposals are suited for realizations in various experimental settings, ranging from cavity-QED to cavity-integrated superconducting devices.

Dynamical simulation of inelastic quantum transport

A method for correlated quantum electron-ion dynamics is combined with a method for electronic open boundaries to simulate in real time the heating, and eventual equilibration at an elevated vibrational energy, of a quantum ion under current flow in an atomic wire, together with the response of the current to the ionic heating. The method can also be used to extract inelastic current voltage corrections under steady-state conditions. However, in its present form the open-boundary method contains an approximation that limits the resolution of current-voltage features. The results of the simulations are tested against analytical results from scattering theory. Directions for the improvement of the method are summarized at the end.

Dynamical Equations For The Period Vectors In A Periodic System Under Constant External Stress

The purpose of this paper is to derive the dynamical equations for the period vectors of a periodic system under constant external stress. The explicit starting point is Newton’s second law applied to halves of the system. Later statistics over indistinguishable translated states and forces associated with transport of momentum are applied to the resulting dynamical equations. In the final expressions, the period vectors are driven by the imbalance between internal and external stresses. The internal stress is shown to have both full interaction and kinetic-energy terms.