The use of fibre optic sensors to monitor pipeline response to tunnelling

This paper describes the use of fibre optic sensing with Brillouin Optical Time-Domain Reflectometry (BOTDR) for near-continuous (distributed) strain monitoring of a large diameter pipeline, buried in predominantly granular material, subjected to a pipe jack tunnelling operation in London Clay. The pipeline, buried at shallow depth, comprises 4.6 m long sections connected with standard bell and spigot type joints, which connect to a continuous steel pipeline. In this paper the suitability of fibre optic sensing with BOTDR for monitoring pipeline behaviour is illustrated. The ability of the fibre optic sensor to detect local strain changes at joints and the subsequent impact on the overall strain profile is shown. The BOTDR strain profile was also used to infer pipe settlement through a process of double-integration and was compared to pipe settlement measurements. The close approximation of the measured pipe settlement provides further confidence in fibre optic strain sensing with BOTDR to investigate the intricacies of pipeline behaviour, pipe-soil interaction and interaction between pipe sections when subjected to ground movement. Copyright ASCE 2006.

A packaging technique for silicon MEMS strain sensors on steel

A packaging technique suited to applying MEMS strain sensors realized on a silicon chip to a steel flat surface is described. The method is based on adhesive bonding of the silicon chip rear surface on steel using two types of glue normally used for standard piezoresistive strain sensors (Mbond200/ 600), using direct wire bonding of the chip to a Printed Circuit Board, also fixed on steel. In order to protect the sensor from the external environment, and to improve the MEMS performance, the silicon chip is encapsulated with a metal cap hermetically sealed-off under vacuum condition with a vacuum adhesive in which the bonding wires are also protected from possible damage. In order to evaluate the mechanical coupling of the silicon chip with the bar and thestress transfer extent to the silicon surface, commercial strain sensors have been applied on the chip glued on a steel bar in alaboratory setup able to generate strain by inflection, yielding a stress transfer around 70% from steel to silicon. © 2008 IEEE.