Fiber Bragg grating sensor interrogation system using a CCD side detection method with superimposed blazed gratings

We present, for the first time to our knowledge, experimental evidence showing that superimposed blazed fiber Bragg gratings may be fabricated and used to extend the dynamic range of a grating-based spectrometer. Blazed gratings of 4° and 8° were superimposed in germanosilicate fiber by ultraviolet inscription and used in conjunction with a coated charged-coupled device array to interrogate a wavelength-division-multiplexing sensor array. We show that the system can be used to monitor strain and temperature sensors simultaneously with an employable bandwidth which is extendedable to 70 nm.

Demultiplexing of fibre Bragg grating temperature and strain sensors

We describe a demultiplexing scheme for fibre optic Bragg grating sensors in which signal recovery is achieved by locking each sensor grating to a corresponding receiver grating. As a demonstration, the technique is applied to strain and temperature sensing, achieving a resolution of 3.0 µe and 0.2°C, respectively.

Demultiplexing of fibre Bragg grating temperature and strain sensors

We describe a demultiplexing scheme for fibre optic Bragg grating sensors in which signal recovery is achieved by locking each sensor grating to a corresponding receiver grating. As a demonstration, the technique is applied to strain and temperature sensing, achieving a resolution of 3.0 µe and 0.2°C, respectively.

Highly sensitive temperature and strain sensors based on all-fiber 45°-TFG Lyot filter

We demonstrate highly sensitive temperature and strain sensors based on an all-fiber Lyot filter structure, which is formed by concatenating two 45°-TFGs (tilted fiber gratings) with a PM fiber cavity. The experiment results show the all-fiber 45°-TFG Lyot filter has very high sensitivity to strain and temperature. The 45°-TFG Lyot filters of two different cavity lengths (18cm and 40 cm) have been evaluated for temperature sensing by heating a section of the cavity from 10°C to 50°C. The experiment results have shown remarkably high temperature sensitivities of 0.616nm/°C for 18cm and 0.31nm/°C for 40cm long cavity filter, respectively. The 18cm long cavity filter has been subjected to strain variations up to around 550μ ε and the filter has exhibited strain sensitivities of 0.02499nm/μ ε and 0.012nm/μ ε for two straining situations, where its cavity middle section of 18cm and 9cm were stretched, respectively. © 2012 SPIE.

Simultaneous measurement of temperature and strain: cross sensitivity considerations

Interferometric sensors using optical fibers as a transduction medium have been shown to be sensitive to a variety of physical measurands. A result of this is that the resolution of a system designed to sense strain, for example, may be compromised by fluctuations in the temperature of the environment. The possibility of simultaneously determining the strain and temperature applied to the same piece of highly birefringent fiber is discussed. Second-order effects are shown to be important for long sensing lengths or in the presence of high strains or temperature changes. The results of experiments carried out to verify the theoretical predictions are also described.

Annealing effects on strain and stress sensitivity of polymer optical fibre based sensors

The annealing effects on strain and stress sensitivity of polymer optical fibre Bragg grating sensors after their photo-inscription are investigated. PMMA optical fibre based Bragg grating sensors are first photo-inscribed and then they were placed into hot water for annealing. Strain, stress and force sensitivity measurements are taken before and after annealing. Parameters such as annealing time and annealing temperature are investigated. The change of the fibre diameter due to water absorption and the annealing process is also considered. The results show that annealing the polymer optical fibre tends to increase the strain, stress and force sensitivity of the photo-inscribed sensor.

Instability of surface-temperature filaments in strain and shear

The effects of uniform straining and shearing on the stability of a surface quasi-geostrophic temperature filament are investigated. Straining is shown to stabilize perturbations for wide filaments but only for a finite time until the filament thins to a critical width, after which some perturbations can grow. No filament can be stabilized in practice, since there are perturbations that can grow large for any strain rate. The optimally growing perturbations, defined as solutions that reach a certain threshold amplitude first, are found numerically for a wide range of parameter values. The radii of the vortices formed through nonlinear roll-up are found to be proportional to θ/s, where θ is the temperature anomaly of the filament and s the strain rate, and are not dependent on the initial size of the filament. Shearing is shown to reduce the normal-mode growth rates, but it cannot stabilize them completely when there are temperature discontinuities in the basic state; smooth filaments can be stabilized completely by shearing and a simple scaling argument provides the shear rate required. Copyright © 2010 Royal Meteorological Society

Behaviour of steel prestressing wires under extreme conditions of strain rate and temperature

The purpose of this paper is to provide information on the behaviour of steel prestressing wires under likely conditions that could be expected during a fire or impact loads. Four loadings were investigated: a) the influence of strain rate – from 10–3 to 600 s–1 – at room temperature, b) the influence of temperature – from 24 to 600 °C – at low strain rate, c) the influence of the joint effect of strain rate and temperature, and d) damage after three plausible fire scenarios. At room temperature it was found that using “static” values is a safe option. At high temperatures our results are in agreement with design codes. Regarding the joint effect of temperature and strain rate, mechanical properties decrease with increasing temperature, although for a given temperature, yield stress and tensile strength increase with strain rate. The data provided can be used profitably to model the mechanical behaviour of steel wires under different scenarios.

On-Chip Thermal Monitoring: Design, Placement and Interconnection of Temperature Sensors

La temperatura es una preocupación que juega un papel protagonista en el diseño de circuitos integrados modernos. El importante aumento de las densidades de potencia que conllevan las últimas generaciones tecnológicas ha producido la aparición de gradientes térmicos y puntos calientes durante el funcionamiento normal de los chips. La temperatura tiene un impacto negativo en varios parámetros del circuito integrado como el retardo de las puertas, los gastos de disipación de calor, la fiabilidad, el consumo de energía, etc. Con el fin de luchar contra estos efectos nocivos, la técnicas de gestión dinámica de la temperatura (DTM) adaptan el comportamiento del chip en función en la información que proporciona un sistema de monitorización que mide en tiempo de ejecución la información térmica de la superficie del dado. El campo de la monitorización de la temperatura en el chip ha llamado la atención de la comunidad científica en los últimos años y es el objeto de estudio de esta tesis. Esta tesis aborda la temática de control de la temperatura en el chip desde diferentes perspectivas y niveles, ofreciendo soluciones a algunos de los temas más importantes. Los niveles físico y circuital se cubren con el diseño y la caracterización de dos nuevos sensores de temperatura especialmente diseñados para los propósitos de las técnicas DTM. El primer sensor está basado en un mecanismo que obtiene un pulso de anchura variable dependiente de la relación de las corrientes de fuga con la temperatura. De manera resumida, se carga un nodo del circuito y posteriormente se deja flotando de tal manera que se descarga a través de las corrientes de fugas de un transistor; el tiempo de descarga del nodo es la anchura del pulso. Dado que la anchura del pulso muestra una dependencia exponencial con la temperatura, la conversión a una palabra digital se realiza por medio de un contador logarítmico que realiza tanto la conversión tiempo a digital como la linealización de la salida. La estructura resultante de esta combinación de elementos se implementa en una tecnología de 0,35 _m. El sensor ocupa un área muy reducida, 10.250 nm2, y consume muy poca energía, 1.05-65.5nW a 5 muestras/s, estas cifras superaron todos los trabajos previos en el momento en que se publicó por primera vez y en el momento de la publicación de esta tesis, superan a todas las implementaciones anteriores fabricadas en el mismo nodo tecnológico. En cuanto a la precisión, el sensor ofrece una buena linealidad, incluso sin calibrar; se obtiene un error 3_ de 1,97oC, adecuado para tratar con las aplicaciones de DTM. Como se ha explicado, el sensor es completamente compatible con los procesos de fabricación CMOS, este hecho, junto con sus valores reducidos de área y consumo, lo hacen especialmente adecuado para la integración en un sistema de monitorización de DTM con un conjunto de monitores empotrados distribuidos a través del chip. Las crecientes incertidumbres de proceso asociadas a los últimos nodos tecnológicos comprometen las características de linealidad de nuestra primera propuesta de sensor. Con el objetivo de superar estos problemas, proponemos una nueva técnica para obtener la temperatura. La nueva técnica también está basada en las dependencias térmicas de las corrientes de fuga que se utilizan para descargar un nodo flotante. La novedad es que ahora la medida viene dada por el cociente de dos medidas diferentes, en una de las cuales se altera una característica del transistor de descarga |la tensión de puerta. Este cociente resulta ser muy robusto frente a variaciones de proceso y, además, la linealidad obtenida cumple ampliamente los requisitos impuestos por las políticas DTM |error 3_ de 1,17oC considerando variaciones del proceso y calibrando en dos puntos. La implementación de la parte sensora de esta nueva técnica implica varias consideraciones de diseño, tales como la generación de una referencia de tensión independiente de variaciones de proceso, que se analizan en profundidad en la tesis. Para la conversión tiempo-a-digital, se emplea la misma estructura de digitalización que en el primer sensor. Para la implementación física de la parte de digitalización, se ha construido una biblioteca de células estándar completamente nueva orientada a la reducción de área y consumo. El sensor resultante de la unión de todos los bloques se caracteriza por una energía por muestra ultra baja (48-640 pJ) y un área diminuta de 0,0016 mm2, esta cifra mejora todos los trabajos previos. Para probar esta afirmación, se realiza una comparación exhaustiva con más de 40 propuestas de sensores en la literatura científica. Subiendo el nivel de abstracción al sistema, la tercera contribución se centra en el modelado de un sistema de monitorización que consiste de un conjunto de sensores distribuidos por la superficie del chip. Todos los trabajos anteriores de la literatura tienen como objetivo maximizar la precisión del sistema con el mínimo número de monitores. Como novedad, en nuestra propuesta se introducen nuevos parámetros de calidad aparte del número de sensores, también se considera el consumo de energía, la frecuencia de muestreo, los costes de interconexión y la posibilidad de elegir diferentes tipos de monitores. El modelo se introduce en un algoritmo de recocido simulado que recibe la información térmica de un sistema, sus propiedades físicas, limitaciones de área, potencia e interconexión y una colección de tipos de monitor; el algoritmo proporciona el tipo seleccionado de monitor, el número de monitores, su posición y la velocidad de muestreo _optima. Para probar la validez del algoritmo, se presentan varios casos de estudio para el procesador Alpha 21364 considerando distintas restricciones. En comparación con otros trabajos previos en la literatura, el modelo que aquí se presenta es el más completo. Finalmente, la última contribución se dirige al nivel de red, partiendo de un conjunto de monitores de temperatura de posiciones conocidas, nos concentramos en resolver el problema de la conexión de los sensores de una forma eficiente en área y consumo. Nuestra primera propuesta en este campo es la introducción de un nuevo nivel en la jerarquía de interconexión, el nivel de trillado (o threshing en inglés), entre los monitores y los buses tradicionales de periféricos. En este nuevo nivel se aplica selectividad de datos para reducir la cantidad de información que se envía al controlador central. La idea detrás de este nuevo nivel es que en este tipo de redes la mayoría de los datos es inútil, porque desde el punto de vista del controlador sólo una pequeña cantidad de datos |normalmente sólo los valores extremos| es de interés. Para cubrir el nuevo nivel, proponemos una red de monitorización mono-conexión que se basa en un esquema de señalización en el dominio de tiempo. Este esquema reduce significativamente tanto la actividad de conmutación sobre la conexión como el consumo de energía de la red. Otra ventaja de este esquema es que los datos de los monitores llegan directamente ordenados al controlador. Si este tipo de señalización se aplica a sensores que realizan conversión tiempo-a-digital, se puede obtener compartición de recursos de digitalización tanto en tiempo como en espacio, lo que supone un importante ahorro de área y consumo. Finalmente, se presentan dos prototipos de sistemas de monitorización completos que de manera significativa superan la características de trabajos anteriores en términos de área y, especialmente, consumo de energía. Abstract Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management (DTM) techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. The field of on-chip temperature monitoring has drawn the attention of the scientific community in the recent years and is the object of study of this thesis. This thesis approaches the matter of on-chip temperature monitoring from different perspectives and levels, providing solutions to some of the most important issues. The physical and circuital levels are covered with the design and characterization of two novel temperature sensors specially tailored for DTM purposes. The first sensor is based upon a mechanism that obtains a pulse with a varying width based on the variations of the leakage currents on the temperature. In a nutshell, a circuit node is charged and subsequently left floating so that it discharges away through the subthreshold currents of a transistor; the time the node takes to discharge is the width of the pulse. Since the width of the pulse displays an exponential dependence on the temperature, the conversion into a digital word is realized by means of a logarithmic counter that performs both the timeto- digital conversion and the linearization of the output. The structure resulting from this combination of elements is implemented in a 0.35_m technology and is characterized by very reduced area, 10250 nm2, and power consumption, 1.05-65.5 nW at 5 samples/s, these figures outperformed all previous works by the time it was first published and still, by the time of the publication of this thesis, they outnumber all previous implementations in the same technology node. Concerning the accuracy, the sensor exhibits good linearity, even without calibration it displays a 3_ error of 1.97oC, appropriate to deal with DTM applications. As explained, the sensor is completely compatible with standard CMOS processes, this fact, along with its tiny area and power overhead, makes it specially suitable for the integration in a DTM monitoring system with a collection of on-chip monitors distributed across the chip. The exacerbated process fluctuations carried along with recent technology nodes jeop-ardize the linearity characteristics of the first sensor. In order to overcome these problems, a new temperature inferring technique is proposed. In this case, we also rely on the thermal dependencies of leakage currents that are used to discharge a floating node, but now, the result comes from the ratio of two different measures, in one of which we alter a characteristic of the discharging transistor |the gate voltage. This ratio proves to be very robust against process variations and displays a more than suficient linearity on the temperature |1.17oC 3_ error considering process variations and performing two-point calibration. The implementation of the sensing part based on this new technique implies several issues, such as the generation of process variations independent voltage reference, that are analyzed in depth in the thesis. In order to perform the time-to-digital conversion, we employ the same digitization structure the former sensor used. A completely new standard cell library targeting low area and power overhead is built from scratch to implement the digitization part. Putting all the pieces together, we achieve a complete sensor system that is characterized by ultra low energy per conversion of 48-640pJ and area of 0.0016mm2, this figure outperforms all previous works. To prove this statement, we perform a thorough comparison with over 40 works from the scientific literature. Moving up to the system level, the third contribution is centered on the modeling of a monitoring system consisting of set of thermal sensors distributed across the chip. All previous works from the literature target maximizing the accuracy of the system with the minimum number of monitors. In contrast, we introduce new metrics of quality apart form just the number of sensors; we consider the power consumption, the sampling frequency, the possibility to consider different types of monitors and the interconnection costs. The model is introduced in a simulated annealing algorithm that receives the thermal information of a system, its physical properties, area, power and interconnection constraints and a collection of monitor types; the algorithm yields the selected type of monitor, the number of monitors, their position and the optimum sampling rate. We test the algorithm with the Alpha 21364 processor under several constraint configurations to prove its validity. When compared to other previous works in the literature, the modeling presented here is the most complete. Finally, the last contribution targets the networking level, given an allocated set of temperature monitors, we focused on solving the problem of connecting them in an efficient way from the area and power perspectives. Our first proposal in this area is the introduction of a new interconnection hierarchy level, the threshing level, in between the monitors and the traditional peripheral buses that applies data selectivity to reduce the amount of information that is sent to the central controller. The idea behind this new level is that in this kind of networks most data are useless because from the controller viewpoint just a small amount of data |normally extreme values| is of interest. To cover the new interconnection level, we propose a single-wire monitoring network based on a time-domain signaling scheme that significantly reduces both the switching activity over the wire and the power consumption of the network. This scheme codes the information in the time domain and allows a straightforward obtention of an ordered list of values from the maximum to the minimum. If the scheme is applied to monitors that employ TDC, digitization resource sharing is achieved, producing an important saving in area and power consumption. Two prototypes of complete monitoring systems are presented, they significantly overcome previous works in terms of area and, specially, power consumption.

Heat stress, heat strain, and productivity in Washington State tree fruit harvesters

Thesis (Master's)--University of Washington, 2016-06

Optical fibre sensors and their interrogation

This thesis describes novel developments in the fabrication and understanding of type IA fibre Bragg gratings, the uses of said gratings as optical sensors and the interrogation of optical sensors using tilted fibre Bragg gratings. This thesis presents the most detailed study of type IA gratings performed to date and provides the basis of a dual grating optical sensor capable of independently measuring strain and temperature. Until this work it was not known how to reliably fabricate type IA gratings or how they would react to high ambient temperatures, nor was it known what effect external parameters such as fibre type, dopant levels, inscription laser intensity, or hydrogenation levels would have on the physical properties of the grating. This comprehensive study has yielded answers to all of these unknowns and produced several unexpected uses for type IA gratings, such as the use of the previously unreported strong loss band at 1400nm to locally heat fibres by optical absorption and thereby fabricate optically tuneable gratings which do not affect directly adjacent standard gratings. Blazed fibre Bragg gratings have been studied in detail and used to produce several high quality prototype sensor interrogation systems yielding stability an accuracy values unsurpassed by similar devices reported in literature. An accurate distribution map of light radiated by blazed gratings is shown for the first time and has been studied in respect of polarisation state showing that for certain easily achievable conditions a blazed grating spectrometer may be deemed to be polarisation insensitive. In a novel implementation of the system, it is shown that the dynamic wavelength range of a blazed grating spectrometer may be at least doubled by superimposing blazed gratings.

Bragg grating in polymer optical fibre for strain, bend and temperature sensing

We report on a Bragg grating written in an eccentric-cored polymer optical fibre for measurement of strain, bend and temperature. The strain sensitivity achieves 1.13 pm µe -1. The temperature response shows a negative sign with the thermal sensitivity of -50.1 pm ?C-1. For bend sensing, this device exhibits a strong fibre orientational dependence, wide bend curvature range of ±22.7 m-1 and a high bend sensitivity of 63.3 pm/m-1.

Sensitivity of LPGs in PCFs fabricated by an electric arc to temperature, strain, and external refractive index

Sensing properties of long-period gratings (LPGs) fabricated in photonic crystal fibers by an electric arc are explained and quantified by semianalytical and numerical models. In particular, the grating's insensitivity to temperature and simultaneous sensitivity to strain and refractive index are simulated. The modeling procedure is generalized so that it can be applied to a wide range of LPGs in various fibers.

Fibre Bragg grating strain sensors

The fabrication of in-fibre Bragg gratings (FBGs) and their application as sensors is reported. The strain and temperature characteristic results for a number of chirped and uniform gratings written into three different host fibres are presented. The static and dynamic temperature response of a commercially available temperature compensated grating is reported. A five sensor wavelength division multiplexed fibre Bragg grating strain measurement system with an interrogation rate of 25 Hz and resolution of 10 was constructed. The results from this system are presented. A novel chirped FBG interrogation method was implemented in both the 1.3 and 1.5 m telecommunication windows. Several single and dual strain sensor systems, employing this method, were constructed and the results obtained from each are reported and discussed. These systems are particularly suitable for the measurement of large strain. The results from a system measuring up to 12 m and with a potential measurement range of 30 m are reported. This technique is also shown to give an obtainable resolution of 20 over a measurement range of 5 000 for a dual sensor system. These systems are simple, robust, passive and easy to implement. They offer low cost, high speed and, in the case of multiple sensors, truly simultaneous interrogation. These advantages make this technique ideal for strain sensing in SMART structures. Systems based on this method have been installed in the masts of four superyachts. A system, based on this technique, is currently being developed for the measurement of acoustic waves in carbon composite panels. The results from an alternative method for interrogating uniform FBG sensors are also discussed. Interrogation of the gratings was facilitated by a specifically written asymmetric grating which had a 15 nm long linearly sloped spectral edge. This technique was employed to interrogate a single sensor over a measurement range of 6 m and two sensors over a range of 4.5 me. The results obtained indicated achievable resolutions of 47 and 38 respectively.

Fabrication and characterisation of 45º and Ex 45º:tilted fibre gratings and their applications in fibre lasers and sensors

In this thesis, I present the studies on fabrication, spectral and polarisation characterisation of fibre gratings with tilted structures at 45º and > 45º (namely 45º- TFGs and ex 45º-TFGs throughout this thesis) and a range of novel applications with these two types of grating. One of the major contributions made in this thesis is the systematic investigation of the grating structures, inscription analysis and spectral and polarisation properties of both types of TFGs. I have inscribed 45º-TFGs in standard telecom and polarisation maintaining (PM) fibres. Two wavelength regions of interest have been explored including 1.55 µm and 1.06 µm. Detailed analysis on fabrication and characterisation of 45º-TFGs on PM fibres have also been carried out for the first time. For ex 45º- TFGs, fabrication has been investigated only on low-cost standard telecom fibre. Furthermore, thermal responses have been measured and analysed showing that both types of TFG have low responsivity to temperature change. More importantly, their refractive index (RI) responses have been characterised to verify the high responsivity to surrounding medium. Based on the unique polarisation properties, both types of TFG have been applied in fibre laser systems to improve the laser performance, which forms another major contribution of the research presented in this thesis. The integration of a 45º-TFG to the Erbium doped fibre laser (EDFL) enables single polarisation laser output at a single wavelength. When combing with ex 45º-TFGs, the EDFL can be transformed to a multi-wavelength switchable laser with single polarisation output. Furthermore, by utilising the polarisation property of the TFGs, a 45º-TFG based mode locked fibre laser is implemented. This laser can produce laser pulses at femtosecond scale and is the first application of TFG in the field of nonlinear optics. Another important contribution from the studies is the development of TFG based passive and active optical sensor systems. An ex 45º-TFG has been successfully developed into a liquid level sensor showing high sensitivity to water based solvents. Strain and twist sensors have been demonstrated via a fibre laser system using both 45°- and ex 45º-TFG with capability identifying not just the twist rate but also the direction. The sensor systems have shown the added advantage of low cost signal demodulation. In addition, load sensor applications have been demonstrated using the 45º-TFG based single polarisation EDFL and the experimental results show good agreement with the theoretical simulation.