Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon

By means of Tersoff and Morse potentials, a three-dimensional molecular dynamics simulation is performed to study atomic force microscopy cutting on silicon monocrystal surface. The interatomic forces between the workpiece and the pin tool and the atoms of workpiece themselves are simulated. Two partial edge dislocations are introduced into workpiece Si, it is found that the motion of dislocations does not occur during the atomic force microscopy cutting processing. Simulation results show that the shear stress acting on dislocations is far below the yield strength of Si. (c) 2008 Elsevier Ltd. All rights reserved.

Path Planner for Intelligent Laser Surface Modification

An optimal algorithm of manufacturing path planner for intelligent laser surface modification is presented. Elements included in the optimal objective have been analyzed. A 6-D manufacture trace that satisfies the requirements of special craft and 5-axis laser processing robot system has been generated from the path planner by method of parallel section in which combinations of modification spots size with curvature of processing surfaces and modification craft parameters are considered. Related experiments have been successfully carried out with the computer integrated multifunctional laser manufacturing system.

The Intelligent Measuring Sub-System in the Computer Integrated and Flexible Laser Processing System

Based on the computer integrated and flexible laser processing system, develop the intelligent measuring sub-system. A novel model has been built to compensate the deviations of the main frame, a new-developed 3-D laser tracker system is applied to adjust the accuracy of the system. Analyzing the characteristic of all kinds of automobile dies, which is the main processing object of the laser processing system, classify the types of the surface and border needed to be measured and be processed. According to different types of surface and border, develop 2-D adaptive measuring method based on B?zier curve and 3-D adaptive measuring method based on spline curve. During the data processing, a new 3-D probe compensation method has been described in details. Some measuring experiments and laser processing experiments are carried out to testify the methods. All the methods have been applied in the computer integrated and flexible laser processing system invented by the Institute of Mechanics, CAS.