EFFECT OF ISOTHERMAL AGING ON SAC305 HARMONIC VIBRATION DURABILITY

The effect of isothermal aging on the harmonic vibration durability of Sn3.0Ag0.5Cu solder interconnects is examined. Printed wiring assemblies with daisy-chained leadless chip resistors (LCRs) are aged at 125°C for 0, 100, and 500 hours. These assemblies are instrumented with accelerometers and strain gages to maintain the same harmonic vibration profile in-test, and to characterize PWB behavior. The tested assemblies are excited at their first natural frequencies until LCRs show a resistance increase of 20%. Dynamic finite element models are employed to generate strain transfer functions, which relate board strain levels observed in-test to respective solder strain levels. The transfer functions are based on locally averaged values of strains in critical regions of the solder and in appropriate regions of the PWB. The vibration test data and the solder strains from FEA are used to estimate lower-bound material fatigue curves for SAC305 solder materials, as a function of isothermal pre-aging.

Análise de falhas em martelos oscilantes dos desfibradores da indústria sucroalcooleira da Região Norte-Nordeste

The failure of materials is always an unwelcome event for several reasons: human lives are put in danger, economic losses, and interference in the availability of products and services. Although the causes of failures and behaviour of materials can be known, the prevention of such a condition is difficult to be guaranteed. Among the failures, wear abrasion by the low voltage is the kind of failure that occurs in more equipment and parts industry. The Plants Sucroalcooleiras suffer significant losses because of such attrition, this fact that motivated their choice for the development of this work. For both, were considered failures in the swing hammers desfibradores stopped soon after the exchange provided in accordance with tonnage of cane processed, then were analyzed by the level of wear testing of rubber wheel defined by the standard ASTM G65-91.The failures were classified as to the origin of the cause and mechanism, moreover, were prepared with samples of welding procedures according to ASME code, sec. IX as well, using the technique of thermal spraying to analyze the performance of these materials produced in laboratories, and compares them with the solder used in the plant. It was observed that the bodies-of-proof prepared by the procedure described as welding, and the thermal spraying the results of losing weight have been minimized significantly compared to the preparations in the plant. This is because the use of techniques more appropriate and more controlled conditions of the parameters of welding. As for the thermal spraying, this technique has presented a satisfactory result, but requires the use of these coatings in the best condition for real affirmation of the results

DEVELOPMENT OF AN OFF-LINE RAINFLOW COUNTING ALGORITHM WITH TEMPORAL PARAMETERS AND DATA REDUCTION

Rainflow counting methods convert a complex load time history into a set of load reversals for use in fatigue damage modeling. Rainflow counting methods were originally developed to assess fatigue damage associated with mechanical cycling where creep of the material under load was not considered to be a significant contributor to failure. However, creep is a significant factor in some cyclic loading cases such as solder interconnects under temperature cycling. In this case, fatigue life models require the dwell time to account for stress relaxation and creep. This study develops a new version of the multi-parameter rainflow counting algorithm that provides a range-based dwell time estimation for use with time-dependent fatigue damage models. To show the applicability, the method is used to calculate the life of solder joints under a complex thermal cycling regime and is verified by experimental testing. An additional algorithm is developed in this study to provide data reduction in the results of the rainflow counting. This algorithm uses a damage model and a statistical test to determine which of the resultant cycles are statistically insignificant to a given confidence level. This makes the resulting data file to be smaller, and for a simplified load history to be reconstructed.

Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.