The influence of peel angle on the mechanics of peeling flexible adherends with arbitrary load-extension characteristics

The peel test is commonly used to determine the strength of adhesive joints. In its simplest form, a thin flexible strip which has been bonded to a rigid surface is peeled from the substrate at a constant rate and the peeling force which is applied to the debonding surfaces by the tension in the tape is measured. Peeling can be carried out with the peel angle, i.e. the angle made by the peel force with the substrate surface, from any value above about 10° although peeling tests at 90 and 180° are most common. If the tape is sufficiently thin for its bending resistance to be negligibly small then as well as the debonding or decohesion energy associated with the adhesive in and around the point of separation, the relation between the peeling force and the peeling angle is influenced both by the mechanical properties of the tape and any pre-strain locked into the tape during its application to the substrate. The analytic solution for a tape material which can be idealised as elastic perfectly-plastic is well established. Here, we present a more general form of analysis, applicable in principle to any constitutive relation between tape load and tape extension. Non-linearity between load and extension is of increasing significance as the peel angle is decreased: the model presented is consistent with existing equations describing the failure of a lap joint between non-linear materials. The analysis also allows for energy losses within the adhesive layer which themselves may be influenced by both peel rate and peel angle. We have experimentally examined the application of this new analysis to several specific peeling cases including tapes of cellophane, poly-vinyl chloride and PTFE. © 2005 Elsevier Ltd. All rights reserved.

High tilt angle FLC SLM for optical interconnects

The use of high tilt angle FLC SLM for optical interconnects was discussed. The transmissive SLM was designed as a 320×1 pixels glass SLM with 20 μm pitch pixels and 2 μm pixel deadspace. The SLM was fabricated using standard class 100 cleanroom facilities to make a glass on glass 1D SLM. The results show that a N×N optical switch can be built using the two-hologram architecture.