An investigation into hot-spots in two large grid-connected PV plants

This paper details an investigation into the appearance of hot-spots in two large grid-connected photovoltaics (PV) plants, which were detected after the visual inspection of trackers whose energy output was decreasing at anomalous rate. Detected hot-spots appeared not only in the solar cells but also in resistive solder bonds (RSB) between cells and contact ribbons. Both types cause similar irreversible damage to the PV modules, but the latter are the main responsible for the detected decrease in energy output, which was confirmed in an experimental testing campaign. The results of this investigation, for example, how hot-spots were detected or their impact on the output power of PV modules, may be of interest for the routine maintenance of large grid-connected PV plants.

Observed degradation in photovoltaic plants affected by hot-spots

A number of findings have shown that the test procedures currently available to determine the reliability and durability of photovoltaic (PV) modules are insufficient to detect certain problems. To improve these procedures, ongoing research into the actual performance of the modules in the field is required. However, scientific literature contains but few references to field studies of defective modules. This article studies two different localized heating phenomena affecting the PV modules of two large-scale PV plants in Spain. The first problem relates to weak solder joints whilst the second is due to microcracks on the module cells. For both cases, the cause is identified, and consideration is given with regard to the effect on performance, the potential deterioration over time, and a way to detect the problems identified. The findings contained in this paper will prove to be of considerable interest to maintenance personnel at large-scale PV plants and also to those responsible for setting module quality standards and specifications, and even the PV module manufacturers themselves.

Induced thermo-mechanical stress in CPV receivers with cycled high intensity light

CPV receivers are made of materials with very different lineal expansion coefficients. Strong variations in DNI due to the passage of clouds can cause sudden temperature changes that creates mechanical stress. For common solder and metal filled polymers the plastic limit could be reached causing substantial fatigue. The best forecast of receiver reliability is therefore achieved by applying an intermittent light source with nominal irradiance level and a number of cycles equal to the expected cloud passages for a given site. The UPM has developed specialized equipment, dubbed the LYSS (Light cYcling Stressing Source), for carrying out such experiments. The small thermal capacity of receivers allows simulating more than 25000 cycles per week. The number of deep transients expected for Madrid in 30 years operation, based on available data, is about 45000. We are currently using the system to cycle a ?Ge/Ag Epoxy/aluminum? receiver, which shows no degradation after 20000 cycles. The equipment can cast up to 200 and 70 W/cm2 on 0.1 and 1 cm2 cells, respectively.

Fluxes and their use in soldering aluminum : a literature search /

Includes index.

Soldering ...

Mode of access: Internet.

Soft soldering; hard soldering and brazing; a practical treatise on tools, materials and operations; for the use of metal workers, plumbers, tinners, mechanics and manufacturers,

Mode of access: Internet.

Corrosion of magnesium alloys in commercial engine coolants

A number of magnesium alloys show promise as engine block materials. However, a critical issue for the automotive industry is corrosion of the engine block by the coolant and this could limit the use of magnesium engine blocks. This work assesses the corrosion performance of conventional magnesium alloy AZ91D and a recently developed engine block magnesium alloy AM-SC1 in several commercial coolants. Immersion testing, hydrogen evolution measurement, galvanic current monitoring and the standard ASTM D1384 test were employed to reveal the corrosion performance of the magnesium alloys subjected to the coolants. The results show that the tested commercial coolants are corrosive to the magnesium alloys in terms of general and galvanic corrosion. The two magnesium alloys exhibited slightly different corrosion resistance to the coolants with AZ91D being more corrosion resistant than AM-SC1. The corrosivity varied from coolant to coolant. Generally speaking. an oraganic-acid based long life coolant was less corrosive to the magnesium alloys than a traditional coolant. Among the studied commercial coolants. Toyota long, life coolant appeared to be the most promising one. In addition. it was found that potassium fluoride effectively inhibited corrosion of the magnesium alloys in the studied commercial coolants. Both general and galvanic corrosion rates were significantly decreased by addition of KF, and there were no evident side effects on the other engine block materials, such as copper, solder. brass. steel and aluminium alloys, in terms of their corrosion performance. The ASTM D 1384 test further confirmed these results and suggested that Toyota long life coolant with 1%wt KF addition is a promising coolant for magnesium engine blocks.

Microstructure control in Sn-0.7mass%Cu alloys

Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging front 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples anti samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic anti that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Multiobjective design optimization of IGBT power modules considering power cycling and thermal cycling

Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.

Real-time temperature estimation for power MOSFETs considering thermal ageing effects

This paper presents a novel real-time power-device temperature estimation method that monitors the power MOSFET's junction temperature shift arising from thermal aging effects and incorporates the updated electrothermal models of power modules into digital controllers. Currently, the real-time estimator is emerging as an important tool for active control of device junction temperature as well as online health monitoring for power electronic systems, but its thermal model fails to address the device's ongoing degradation. Because of a mismatch of coefficients of thermal expansion between layers of power devices, repetitive thermal cycling will cause cracks, voids, and even delamination within the device components, particularly in the solder and thermal grease layers. Consequently, the thermal resistance of power devices will increase, making it possible to use thermal resistance (and junction temperature) as key indicators for condition monitoring and control purposes. In this paper, the predicted device temperature via threshold voltage measurements is compared with the real-time estimated ones, and the difference is attributed to the aging of the device. The thermal models in digital controllers are frequently updated to correct the shift caused by thermal aging effects. Experimental results on three power MOSFETs confirm that the proposed methodologies are effective to incorporate the thermal aging effects in the power-device temperature estimator with good accuracy. The developed adaptive technologies can be applied to other power devices such as IGBTs and SiC MOSFETs, and have significant economic implications.

Nanowires for 3d silicon interconnection – low temperature compliant nanowire-polymer film for z-axis interconnect

Semiconductor chip packaging has evolved from single chip packaging to 3D heterogeneous system integration using multichip stacking in a single module. One of the key challenges in 3D integration is the high density interconnects that need to be formed between the chips with through-silicon-vias (TSVs) and inter-chip interconnects. Anisotropic Conductive Film (ACF) technology is one of the low-temperature, fine-pitch interconnect method, which has been considered as a potential replacement for solder interconnects in line with continuous scaling of the interconnects in the IC industry. However, the conventional ACF materials are facing challenges to accommodate the reduced pad and pitch size due to the micro-size particles and the particle agglomeration issue. A new interconnect material - Nanowire Anisotropic Conductive Film (NW-ACF), composed of high density copper nanowires of ~ 200 nm diameter and 10-30 µm length that are vertically distributed in a polymeric template, is developed in this work to tackle the constrains of the conventional ACFs and serves as an inter-chip interconnect solution for potential three-dimensional (3D) applications.

Multi-physics modelling - A vital component of virtual manufacturing

One of the core tasks of the virtual-manufacturing environment is to characterise the transformation of the state of material during each of the unit processes. This transformation in shape, material properties, etc. can only be reliably achieved through the use of models in a simulation context. Unfortunately, many manufacturing processes involve the material being treated in both the liquid and solid state, the trans-formation of which may be achieved by heat transfer and/or electro-magnetic fields. The computational modelling of such processes, involving the interactions amongst various interacting phenomena, is a consider-able challenge. However, it must be addressed effectively if Virtual Manufacturing Environments are to become a reality! This contribution focuses upon one attempt to develop such a multi-physics computational toolkit. The approach uses a single discretisation procedure and provides for direct interaction amongst the component phenomena. The need to exploit parallel high performance hardware is addressed so that simulation elapsed times can be brought within the realms of practicality. Examples of Multiphysics modelling in relation to shape casting, and solder joint formation reinforce the motivation for this work.

Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems

With the continued miniaturization and increasing performance of electronic devices, new technical challenges have arisen. One such issue is delamination occurring at critical interfaces inside the device. This major reliability issue can occur during the manufacturing process or during normal use of the device. Proper evaluation of the adhesion strength of critical interfaces early in the product development cycle can help reduce reliability issues and time-to-market of the product. However, conventional adhesion strength testing is inherently limited in the face of package miniaturization, which brings about further technical challenges to quantify design integrity and reliability. Although there are many different interfaces in today's advanced electronic packages, they can be generalized into two main categories: 1) rigid to rigid connections with a thin flexible polymeric layer in between, or 2) a thin film membrane on a rigid structure. Knowing that every technique has its own advantages and disadvantages, multiple testing methods must be enhanced and developed to be able to accommodate all the interfaces encountered for emerging electronic packaging technologies. For evaluating the adhesion strength of high adhesion strength interfaces in thin multilayer structures a novel adhesion test configuration called “single cantilever adhesion test (SCAT)” is proposed and implemented for an epoxy molding compound (EMC) and photo solder resist (PSR) interface. The test method is then shown to be capable of comparing and selecting the stronger of two potential EMC/PSR material sets. Additionally, a theoretical approach for establishing the applicable testing domain for a four-point bending test method was presented. For evaluating polymeric films on rigid substrates, major testing challenges are encountered for reducing testing scatter and for factoring in the potentially degrading effect of environmental conditioning on the material properties of the film. An advanced blister test with predefined area test method was developed that considers an elasto-plastic analytical solution and implemented for a conformal coating used to prevent tin whisker growth. The advanced blister testing with predefined area test method was then extended by employing a numerical method for evaluating the adhesion strength when the polymer’s film properties are unknown.

A series of trials in the UK as part of the Ofcom TV white spaces pilot

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