Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .1. DSC characterization of curing reaction

The curing reaction process of epoxy-terminated poly(phenylene ether ketone) (E-PEK) with 4,4'-diaminodiphenyl sulfone (DDS) and hexahydrophthalic acid anhydride (Nadic) as curing agents was investigated using isothermal differential scanning calorimetry (IDSC) and nonisothermal differential scanning calorimetry (DDSC) techniques. It was found that the curing reactions of E-PEK/DDS and E-PEK/Nadic are nth-order reactions but not autoaccelerating. The experimental results revealed that the curing reaction kinetics parameters measured from IDSC and DDSC are not equivalent. This means that, in the curing reaction kinetics model for our E-PEK system, both isothermal and nonisothermal reaction kinetics parameters are needed to describe isothermal and nonisothermal curing processes, The isothermal and nonisothermal curing processes were successfully simulated using this model. A new extrapolation method was suggested. On the basis of this method the maximum extent of the curing reaction (A(ult)) that is able to reach a certain temperature can be predicted. The A(ult) for the E-PEK system estimated by the new method agrees well with the results obtained from another procedure reported in the literature. (C) 1997 John Wiley & Sons, Inc.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling

Chemorheology and corresponding models for an epoxy-terminated poly(phenylene ether ketone) (E-PEK) and 4,4'-diaminodiphenyl sulfone (DDS) system were investigated using a differential scanning calorimeter (DSC) and a cone-and-plate rheometer. For this system, the reported four-parameter chemorheological model and modified WLF chemorheological model can only be used in an isothermal or nonisothermal process, respectively. In order to predict the resin viscosity variation during a stepwise temperature cure cycle actually used, a new model based on the combination of the four-parameter model and the modified WLF model was developed. The combined model can predict the resin viscosity variation during a stepwise temperature cure cycle more accurately than the above two models. In order to simplify the establishment of this model, a new five-parameter chemorheological model was then developed. The parameters in this five-parameter model can be determined through very few rheology and DSC experiments. This model is practicable to describe the resin viscosity variation for isothermal, nonisothermal, or stepwise temperature cure cycles accurately. The five-parameter chemorheological model has also successfully been used in the E-PEK systems with two other curing agents, i.e., the diamine curing agent with the addition of a boron trifluride monoethylamine (BF3-MEA) accelerator and an anhydride curing agent (hexahydrophthalic acid anhydride). (C) 1997 John Wiley & Sons, Inc.

Flexural fatigue behavior of injection-molded composites based on poly(phenylene ether ketone)

Flexural fatigue tests were conducted on injection-molded short fiber composites, carbon fiber/poly(phenylene ether ketone) (PEK-C) and glass fiber/PEK-C (with addition of polyphenylene sulfide for improving adhesion between matrix and fibers), using four-point bending at stress ratio of 0.1. The fatigue behavior of these materials was presented. By comparing the S-N curves and analyzing the fracture surfaces of the two materials, the similarity and difference of the failure mechanisms in the two materials were discussed. It is shown that the flexural fatigue failure of the studied materials is governed by their respective tensile properties. The matrix yielding is main failure mechanism at high stress, while at lower stress the fatigue properties appear fiber and interface dominated. (C) 1997 John Wiley & Sons, Inc.

Ionizing radiation induced degradation of poly (2-methoxy-5-(2 '-ethyl-hexyloxy)-1,4-phenylene vinylene) in solution

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Synthesis and gas permeability of novel fluorinated poly(phenylene-co-naphthalimide)s

A new class of high-performance polymers [poly(phenylene-co-naphthalimide)s] was prepared through the Ni(0) catalytic coupling of N-(4-chloro-2-trifluromethylphenyl)-5-chloro-1,8-naphthalimide and 2,5-dichlorobenzophenone. The resulting copolymers exhibited high molecular weights (high inherent viscosities) and a combination of desirable properties such as good solubility in dipolar aprotic solvents, film-forming capability, and mechanical properties. The glass-transition temperatures of the copolymers ranged from 320 to 403 degrees C and increased as the content of the naphthalimide moiety increased. Tough polymer films, obtained via casting from N-methylpyrrolidone solutions, had tensile strengths of 64-107 MPa and tensile moduli of 3.4-4.7 GPa. The gas permeability coefficients of the copolymers were measured for H-2, CO2, O-2, CH4, and N-2. They showed oxygen permeability coefficients and permeability selectivity of oxygen to nitrogen (permeability coefficient for O-2/permeability coefficient for N-2) in the ranges of 1.39-4.31 and 4.92-5.38 barrer, respectively.

Synthesis and crystallization of a novel poly(ether ketone ether ketone ketone) containing meta-phenylene linkage: PEKEKK(T/I)

Poly(ether ketone ether ketone ketone) containing meta-phenylene linkage (PEKEKK(T/I)) was synthesized by electrophilic Friedel-Crafts acylation condensation of 1, 4-diphenoxybenzophenone with terephthaloyl chloride (T) and isophthaloyl chloride (I) with a T/I ratio of 1 and characterized by LR,DSC,TGA and WAXD. PEKEKK(T/I) has two different crystal structures: a conventional Farm I structure, the same as that observed in PEEK and PEK, wich is usually developed from melt crystallization, and a new Form II structure which can be developed from cold crystallization or solvent induced crystallization (by exposing the glassy sample to methylene chloride).

Isothermal and nonisothermal crystallization of poly(aryl ether ketone ketone) with all-para phenylene linkage

Isothermal and nonisothermal crystallization behavior for PEKK(T) was studied using differential scanning calorimetry (DSC), transmission electron microscopy (TEM), and electron diffraction (ED). In the isothermal crystallization process, the Avrami parameters obtained were n = 2.33-2.69, which shows crystal growth of two-dimensional extensions consistent with our observations by TEM. The lamellar thickness increases with the crystallization temperature of PEKK(T) crystallized isothermally from the melt. However, for the nonisothermal crystallization of PEKK(T), the results from the modified Avrami analysis show two different crystallization processes. Avrami exponents n(1) = 3.61-5.30, obtained from the primary crystallization process, are much bigger than are the secondary n(2) = 2.26-3.04 and confirmed by the observation of the spherulite morphology. PEKK(T) crystallized isothermally from the melt possesses the same crystal structure (Form I) as that from nonisothermal melt crystallization. The results from TEM observation show that the spherulite radius decreases with an increasing cooling rate. (C) 2001 John Wiley & Sons, Inc.

Syndiotactic polystyrene/thermoplastic polyurethane blends using poly(styrene-b-4-vinylpyridine) diblock copolymer as a compatibilizer

The effect of adding diblock copolymer poly(styrene-b-4-vinylpyridine) (P(S-b-4VPy), to immiscible blends of syndiotactic polystyrene (sPS)/thermoplastic polyurethane (TPU) on the morphology, thermal transition, crystalline structure, and rheological and mechanical properties of the blends has been investigated. The diblock copolymer was synthesized by sequential anionic copolymerization and was melt-blended with sPS and TPU. Scanning electron microscopy (SEM) showed that the added block copolymer reduced the domain size of the dispersed phase in the blends. Differential scanning calorimetry (DSC) and wide-angle X-ray diffraction (WAXD) revealed that the extent of compatibility between sPS and TPU affected the crystallization of the sPS in the blends. Tensile strength and elongation at break increased, while the dynamic modulus and complex viscosity decreased with the amount of P(S-b-4VPy) in the blend. The compatibilizing effect of the diblock copolymer is the result of its location at the interface between the sPS and the TPU phases and penetration of the blocks into the: corresponding phases, i.e. the polystyrene block enters the noncrystalline regions of the sPS, and the poly(4-vinylpyridine) block interacts with TPU through intermolecular hydrogen bonding. (C) 1999 Elsevier Science Ltd. All rights reserved.

Compatibilizing effect of polystyrene-block-poly(4-vinylpyridine) for poly(2,6-dimethyl-1,4-phenyleneoxide) chlorinated polyethylene blends

The compatibilizing effect and mechanism of compatibilization of the diblock copolymer polystyrene-block-poly(4-vinylpyridine) P(S-b-4VPy) on immiscible blends of poly(2,6-dimethyl-1,4-phenylene oxide) (PPO)/chlorinated polyethylene (CPE) were studied by means of scanning electron microscopy (SEM), differential scanning calorimetry (DSC), mechanical properties and FTIR measurements. The block copolymer was synthesized by sequential anionic polymerization and melt-blended with PPO and CPE. The results show that the P(S-b-4VPy) added acts as an effective compatibilizer, located at the interface between the PPO and the CPE phase, reducing the interfacial tension, and improving the interfacial adhesion. The tensile strength and modulus of all blends increase with P(S-b-4VPy) content, whereas the elongation at break increases for PPO-rich blends, but decreases for CPE-rich blends. The polystyrene block of the diblock copolymer is compatible with PPO, and the poly(4-vinylpyridine) block and CPE are partially miscible.

Studies on fracture morphology of short carbon fiber reinforced poly(phenylene ether ketone)(SCF/PEK-C) composites

The shear fracture morphology of SCF/PEK-C composite with carbon fibers treated for different times was studied carefully by SEM. The result shows that the adhesion between fiber and matrix was improved and fractured model also changed from interface fracture to brittle fracture with increasing treatment time of carbon fiber. The fracture mechanism was discussed preliminary.

Synthesis and characterization of the side chain liquid crystalline poly(monoester {6-[4-(p-nitrophenyl)azo]phenoxy-1-hexyloxy} of maleic anhydride)

The poly(monoester (6-[4-(p-nitrophenyl) azo]phenoxy-1-hexyloxy) of maleic anhydride) shows a smectic phase with a focal conic fan texture. With the decrease of the monoestering degree the phase transition temperature decreases and the mesomorphic temperature range becomes narrow. The hydrogen bonding between two carboxylic acid groups was found to play a very important role in forming the smectic phase structure. The smectic bilayer structure has been built through self-assembly via. intermolecular hydrogen bonding.

Compatibilization of blends of polybutadiene and poly(methyl methacrylate) with poly(butadiene-block-methyl methacrylate)

Compatibilization of blends of polybutadiene and poly(methyl methacrylate) with butadiene-methyl methacrylate diblock copolymers has been investigated by transmission electron microscopy. When the diblock copolymers are added to the blends, the size of PB particles decreases and their size distribution gets narrower. In PB/PMMA7.6K blends with P(B-b-MMA)25.2K as a compatibilizer, most of micelles exist in the PMMA phase. However, using P(B-b-MMA)38K as a compatibilizer, the micellar aggregation exists in PB particles besides that existing in the PMMA phase. The core of a micelle in the PMMA phase is about 10 nm. In this article the influences of temperature and homo-PMMA molecular weight on compatibilization were also examined. At a high temperature PB particles in blends tend to agglomerate into bigger particles. When the molecular weight of PMMA is close to that of the corresponding block of the copolymer, the best compatibilization result would be achieved. (C) 1998 John Wiley & Sons, Inc.