STUDIES ON PREPARATION OF IRON, COBALT AND COPPER PHTHALOCYANINES Y ZEOLITE - CHARACTERIZATION AND THEIR CATALYSIS FOR HYDROXYLATION OF PHENOL

Iron, cobalt and copper phthalocyanines/Y zeolite, denoted as FePcY, CoPcY and CuPcY respectively,were prepared. The formation of metal phthalocyanine compounds within the cages of Y zeolite and their crystal structures were determined by elementary analyses, IR, UV-Vis, TG, BET, and XRD methods; The influence of experimental parameters upon phenol conversion and product selectivities was investigated as well.

Electrocatalytic Oxidation of Dihydric Phenol on Polypyrrole Film Modified Electrodes

The electrochemical behavior of catechol, hydroquinone and resorcinol on GC and PPy/GC electrode surface were studied by CV and RDE method. The results indicated that these three substance could be oxidized electrocatalytically on PPy film electrode. The possibility of fabrication of amperometric electrochemical sensor for catechol was also studied.

Preparation of titania-based catalysts for formaldehyde photocatalytic oxidation from TiCl4 by the sol-gel method

Titania sols were prepared by acid hydrolysis of a TiCl4 precursor instead of titanium alkoxides. The effect of acid concentration on the particle size and stability of sol was investigated. Stable titania sols with mean particle size of 14 nm could be obtained when the H+/Ti molar ratio was 0.5. The titania sols were modified with Pt, SiO2, ZrO2, WO3 and MoO3 to prepare a series of modified catalysts, which were used for the photocatalytic oxidation of formaldehyde at 37 degreesC. They showed different photocatalytic activities due to the influence of the additives. Comparing with pure TiO2, the addition of silica or zirconia increased the photocatalytic activity, while the addition of Pt and MoO3 decreased the activity, and the addition Of WO3 had little effect on the activity. It is of great significance that the conversion of formaldehyde was increased up to 94% over the SiO2-TiO2 catalyst. The increased activity was partly due to higher surface area and porosity or smaller crystallite size. A comparison of our catalyst compositions with the literature in this field suggested that the difference in activity due to the addition of a second metal oxide maybe caused by the surface chemistry of the catalysts, particularly the acidity. (C) 2001 Elsevier Science B.V. All rights reserved.

Wet air oxidation of nitrobenzene enhanced by phenol

Simultaneous nitrobenzene and phenol wet air oxidation was investigated in a stainless autoclave at temperature range of 180-220 ° C and 1.0 MPa oxygen partial pressure. Compared with the single oxidation of nitrobenzene under the same conditions, the presence of phenol in the reaction media greatly improved the removal efficiency of nitrobenzene. The effect of temperature on the reaction was studied. Phenol was considered as a type of initiator in the nitrobenzene oxidation. © 2004 Elsevier Ltd. All rights reserved.

Benzene electro-oxidation in a PEMFC for phenol and electricity cogeneration

In the present investigation, the electrochemically-assisted oxidation of benzene in a H-2-O-2 proton exchange membrane fuel cell (PEMFC) for electricity and phenol cogeneration is studied. Experiments were carried out in a PEMFC electrochemical reactor using Pd black as cathode electrocatalyst at 60 and 80 degrees C, respectively and 1 atm back pressure. Indeed, it was found that the only product detected under the examined experimental conditions was phenol. The online GC product analysis revealed that it is impossible to produce phenol when the fuel cell circuit is open (I = 0) under all the examined experimental conditions. When the fuel cell circuit was closed, however, the phenol yield was found to follow a volcano-type dependence on the cur-rent of the external circuit. It was found that the maximum phenol yield was 0.35% at 100 mA/cm(2) at 80 degrees C. At the same time, the PEMFC performance was also investigated during the phenol generation process. Furthermore, experiments with the rotating ring disc electrode (RRDE) technique showed that the intermediate oxidation product, i.e. H2O2 existed during the oxygen electro-reduction process. The cyclic voltammograms showed that benzene was strongly adsorbed on the Pd surface, leading to a degradation of the PEMFC performance. (c) 2005 Elsevier B.V. All rights reserved.

Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending

Flip chip interconnections using anisotropic conductive film (ACF) are now a very attractive technique for electronic packaging assembly. Although ACF is environmentally friendly, many factors may influence the reliability of the final ACF joint. External mechanical loading is one of these factors. Finite element analysis (FEA) was carried out to understand the effect of mechanical loading on the ACF joint. A 3-dimensional model of adhesively bonded flip chip assembly was built and simulations were performed for the 3-point bending test. The results show that the stress at its highest value at the corners, where the chip and ACF were connected together. The ACF thickness was increased at these corner regions. It was found that higher mechanical loading results in higher stress that causes a greater gap between the chip and the substrate at the corner position. Experimental work was also carried out to study the electrical reliability of the ACF joint with the applied bending load. As per the prediction from FEA, it was found that at first the corner joint failed. Successive open joints from the corner towards the middle were also noticed with the increase of the applied load.

Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology

Using thermosetting epoxy based conductive adhesive films for the flip chip interconnect possess a great deal of attractions to the electronics manufacturing industries due to the ever increasing demands for miniaturized electronic products. Adhesive manufacturers have taken many attempts over the last decade to produce a number of types of adhesives and the coupled anisotropic conductive-nonconductive adhesive film is one of them. The successful formation of the flip chip interconnection using this particular type of adhesive depends on, among factors, how the physical properties of the adhesive changes during the bonding process. Experimental measurements of the temperature in the adhesive have revealed that the temperature becomes very close to the required maximum bonding temperature within the first 1s of the bonding time. The higher the bonding temperature the faster the ramp up of temperature is. A dynamic mechanical analysis (DMA) has been carried out to investigate the nature of the changes of the physical properties of the coupled anisotropic conductive-nonconductive adhesive film for a range of bonding parameters. Adhesive samples that are pre-cured at 170, 190 and 210°C for 3, 5 and 10s have been analyzed using a DMA instrument. The results have revealed that the glass transition temperature of this type of adhesive increases with the increase in the bonding time for the bonding temperatures that have been used in this work. For the curing time of 3 and 5s, the maximum glass transition temperature increases with the increase in the bonding temperature, but for the curing time of 10s the maximum glass transition temperature has been observed in the sample which is cured at 190°C. Based on these results it has been concluded that the optimal bonding temperature and time for this kind of adhesive are 190°C and 10s, respectively.

Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes

The stencil printing process is an important process in the assembly of Surface Mount Technology (SMT)devices. There is a wide agreement in the industry that the paste printing process accounts for the majority of assembly defects. Experience with this process has shown that typically over 60% of all soldering defects are due to problems associated with the flow properties of solder pastes. Therefore, the rheological measurements can be used as a tool to study the deformation or flow experienced by the pastes during the stencil printing process. This paper presents results on the thixotropic behaviour of three pastes; lead-based solder paste, lead-free solder paste and isotropic conductive adhesive (ICA). These materials are widely used as interconnect medium in the electronics industry. Solder paste are metal alloys suspended in a flux medium while the ICAs consist of silver flakes dispersed in an epoxy resin. The thixotropy behaviour was investigated through two rheological test; (i) hysteresis loop test and (ii) steady shear rate test. In the hysteresis loop test, the shear rate were increased from 0.001 to 100s-1 and then decreased from 100 to 0.001s-1. Meanwhile, in the steady shear rate test, the materials were subjected to a constant shear rate of 0.100, 100 and 0.001s-1 for a period of 240 seconds. All the pastes showed a high degree of shear thinning behaviour with time. This might be due to the agglomeration of particles in the flux or epoxy resin that prohibits pastes flow under low shear rate. The action of high shear rate would break the agglomerates into smaller pieces which facilitates the flow of pastes, thus viscosity is reduced at high shear rate. The solder pastes exhibited a higher degree of structural breakdown compared to the ICAs. The area between the up curve and down curve in the hysteresis curve is an indication of the thixotropic behavior of the pastes. Among the three pastes, lead-free solder paste showed the largest area between the down curve and up curve, which indicating a larger structural breakdown in the pastes, followed by lead-based solder paste and ICA. In a steady shear rate test, viscosity of ICA showed the best recovery with the steeper curve to its original viscosity after the removal of shear, which indicating that the dispersion quality in ICA is good because the high shear has little effect on the microstructure of ICA. In contrast, lead-based paste showed the poorest recovery which means this paste undergo larger structural breakdown and dispersion quality in this paste is poor because the microstructure of the paste is easily disrupted by high shear. The structural breakdown during the application of shear and the recovery after removal of shear is an important characteristic in the paste printing process. If the paste’s viscosity can drop low enough, it may contribute to the aperture filling and quick recovery may prevent slumping.