Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips

Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.

Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction

The high-intensity, high-resolution x-ray source at the European Synchrotron Radiation Facility (ESRF) has been used in x-ray diffraction (XRD) experiments to detect intermetallic compounds (IMCs) in lead-free solder bumps. The IMCs found in 95.5Sn3.8Ag0.7Cu solder bumps on Cu pads with electroplated-nickel immersion-gold (ENIG) surface finish are consistent with results based on traditional destructive methods. Moreover, after positive identification of the IMCs from the diffraction data, spatial distribution plots over the entire bump were obtained. These spatial distributions for selected intermetallic phases display the layer thickness and confirm the locations of the IMCs. For isothermally aged solder samples, results have shown that much thicker layers of IMCs have grown from the pad interface into the bulk of the solder. Additionally, the XRD technique has also been used in a temperature-resolved mode to observe the formation of IMCs, in situ, during the solidification of the solder joint. The results demonstrate that the XRD technique is very attractive as it allows for nondestructive investigations to be performed on expensive state-of-the-art electronic components, thereby allowing new, lead-free materials to be fully characterized.

The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

Purpose – Anisotropic conductive film (ACF) is now an attractive technology for direct mounting of chips onto the substrate as an alternative to lead-free solders. However, despite its various advantages over other technologies, it also has many unresolved reliability issues. For instance, the performance of ACF assembly in high temperature applications is questionable. The purpose of this paper is to study the effect of bonding temperatures on the curing of ACFs, and their mechanical and electrical performance after high temperature ageing. Design/methodology/approach – In the work presented in this paper, the curing degree of an ACF at different bonding temperatures was measured using a differential scanning calorimeter. The adhesion strength and the contact resistance of ACF bonded chip-on-flex assembly were measured before and after thermal ageing and the results were correlated with the curing degree of ACF. The ACF was an epoxy-based adhesive in which Au-Ni coated polymer particles were randomly dispersed. Findings – The results showed that higher bonding temperatures had resulted in better ACF curing and stronger adhesion. After ageing, the adhesion strength increased for the samples bonded at lower temperatures and decreased for the samples bonded at higher temperatures. ACF assemblies with higher degrees of curing showed smaller increases in contact resistance after ageing. Conduction gaps at the bump-particle and/or particle-pad interfaces were found with the help of scanning electron microscopy and are thought to be the root cause of the increase in contact resistance. Originality/value – The present study focuses on the effect of bonding temperatures on the curing of ACFs, and their adhesion strength and electrical performances after high temperature ageing. The results of this study may help the development of ACFs with higher heat resistance, so that ACFs can be considered as an alternative to lead-free solders.

Moisture Effects on the Reliability of Anisotropic Conductive Films

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports an investigation into the moisture effects on the reliability of ACF interconnections in the flip-chip-on-flex (FCOF) applications. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. The purposes of this modeling work was to understand the role that moisture plays in the failure of ACF flip chips, and to look into the influence of physical properties and geometric characteristics, such as the coefficient of the moisture expansion (CME), Young's modulus of the adhesive matrix and the bump height on the reliability of the ACF interconnections in a humid environment. Simulation results suggest that moisture-induced swelling of the adhesive matrix is the major cause of the ACF joint opening. Modeling results are consistent with the findings in the experimental work.

Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films

Anisotropic conductive films (ACFs) are widely used in the electronic packaging industries because of their fine pitch potential and the assembly process is simpler compared to the soldering process. However, there are still unsolved issues in the volume productions using ACFs. The main reason is that the effects of many factors on the interconnects are not well understood. This work focuses on the performance of ACF-bonded chip-on-flex assemblies subjected to a range of thermal cycling test conditions. Both experimental and three-dimensional finite element computer modelling methods are used. It has been revealed that greater temperature ranges and longer dwell-times give rise to higher stresses in the ACF interconnects. Higher stresses are concentrated along the edges of the chip-ACF interfaces. In the experiments, the results show that higher temperature ranges and prolonged dwell times increase contact resistance values. Close examination of the microstructures along the bond-line through the scanning electron microscope (SEM) indicates that cyclic thermal loads disjoint the conductive particles from the bump of the chip and/or pad of the substrate and this is thought to be related to the increase of the contact resistance value and the failure of the ACF joints.

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

The effect of a high electric current density on the interfacial reactions of micro ball grid array solder joints was studied at room temperature and at 150 °C. Four types of phenomena were reported. Along with electromigration-induced interfacial intermetallic compound (IMC) formation, dissolution at the Cu under bump metallization (UBM)/bond pad was also noticed. With a detailed investigation, it was found that the narrow and thin metallization at the component side produced “Joule heating” due to its higher resistance, which in turn was responsible for the rapid dissolution of the Cu UBM/bond pad near to the Cu trace. During an “electromigration test” of a solder joint, the heat generation due to Joule heating and the heat dissipation from the package should be considered carefully. When the heat dissipation fails to compete with the Joule heating, the solder joint melts and molten solder accelerates the interfacial reactions in the solder joint. The presence of a liquid phase was demonstrated from microstructural evidence of solder joints after different current stressing (ranging from 0.3 to 2 A) as well as an in situ observation. Electromigration-induced liquid state diffusion of Cu was found to be responsible for the higher growth rate of the IMC on the anode side.

Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization

The dissolution of thin film under-bump-metallization (UBM) by molten solder has been one of the most serious processing problems in electronic packaging technology. Due to a higher melting temperature and a greater Sn content, a molten lead-free solder such as eutectic SnAg has a faster dissolution rate of thin film UBM than the eutectic SnPb. The work presented in this paper focuses on the role of 0.5 wt % Cu in the base Sn–3.5%Ag solder to reduce the dissolution of the Cu bond pad in ball grid array applications. We found that after 0.5 wt % Cu addition, the rate of dissolution of Cu in the molten Sn–3.5%Ag solder slows down dramatically. Systematic experimental work was carried out to understand the dissolution behavior of Cu by the molten Sn–3.5%Ag and Sn–3.5%Ag–0.5%Cu solders at 230–250 °C, for different time periods ranging from 1 to 10 min. From the curves of consumed Cu thickness, it was concluded that 0.5 wt % Cu addition actually reduces the concentration gradient at the Cu metallization/molten solder interface which reduces the driving force of dissolution. During the dissolution, excess Cu was found to precipitate out due to heterogeneous nucleation and growth of Cu6Sn5 at the solder melt/oxide interface. In turn, more Cu can be dissolved again. This process continues with time and leads to more dissolution of Cu from the bond pad than the amount expected from the solubility limit, but it occurs at a slower rate for the molten Sn–3.5%Ag–0.5%Cu solder. © 2003 American Institute of Physics.

Reliability study of the electroless Ni–P layer against solder alloy

Copper (Cu) has been widely used in the under bump metallurgy of chip and substrate metallization for chip packaging. However, due to the rapid formation of Cu–Sn intermetallic compound (IMC) at the tin-based solder/Cu interface during solder reaction, the reliability of this type of solder joint is a serious concern. In this work, electroless nickel–phosphorous (Ni–P) layer was deposited on the Cu pad of the flexible substrate as a diffusion barrier between Cu and the solder materials. The deposition was carried out in a commercial acidic sodium hypophosphite bath at 85 °C for different pH values. It was found that for the same deposition time period, higher pH bath composition (mild acidic) yields thicker Ni–P layer with lower phosphorous content. Solder balls having composition 62%Sn–36%Pb–2%Ag were reflowed at 240 °C for 1 to 180 min on three types of electroless Ni–P layers deposited at the pH value of 4, 4.8 and 6, respectively. Thermal stability of the electroless Ni–P barrier layer against the Sn–36%Pb–2%Ag solder reflowed for different time periods was examined by scanning electron microscopy equipped with energy dispersed X-ray. Solder ball shear test was performed in order to find out the relationship between the mechanical strength of solder joints and the characteristics of the electroless Ni–P layer deposited. The layer deposited in the pH 4 acidic bath showed the weak barrier against reflow soldering whereas layer deposited in pH 6 acidic bath showed better barrier against reflow soldering. Mechanical strength of the joints were deteriorated quickly in the layer deposited at pH 4 acidic bath, which was found to be thin and has a high phosphorous content. From the cross-sectional studies and fracture surface analyses, it was found that the appearance of the dark crystalline phosphorous-rich Ni layer weakened the interface and hence lower solder ball shear strength. Ni–Sn IMC formed at the interfaces was found to be more stable at the low phosphorous content (∼14 at.%) layer. Electroless Ni–P deposited at mild acidic bath resulting phosphorous content of around 14 at.% is suggested as the best barrier layer for Sn–36%Pb–2%Ag solder.

High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review

High current density induced damages such as electromigration in the on-chip interconnection /metallization of Al or Cu has been the subject of intense study over the last 40 years. Recently, because of the increasing trend of miniaturization of the electronic packaging that encloses the chip, electromigration as well as other high current density induced damages are becoming a growing concern for off-chip interconnection where low melting point solder joints are commonly used. Before long, a huge number of publications have been explored on the electromigration issue of solder joints. However, a wide spectrum of findings might confuse electronic companies/designers. Thus, a review of the high current induced damages in solder joints is timely right this moment. We have selected 6 major phenomena to review in this paper. They are (i) electromigration (mass transfer due electron bombardment), (ii) thermomigration (mass transfer due to thermal gradient), (iii) enhanced intermetallic compound growth, (iv) enhanced current crowding, (v) enhanced under bump metallisation dissolution and (vi) high Joule heating and (vii) solder melting. the damage mechanisms under high current stressing in the tiny solder joint, mentioned in the review article, are significant roadblocks to further miniaturization of electronics. Without through understanding of these failure mechanisms by experiments coupled with mathematical modeling work, further miniaturization in electronics will be jeopardized

Fact, fiction and nostalgia: an assessment of heritage interpretation at living museums

This paper aims to explore and discuss the role of nostalgia (a concept that is inherently grounded within a psychological framework) in heritage interpretation from both provider and consumer perspectives. Whilst many cultural practitioners recognise the relationship between sentimentality and authenticity, particularly within a folk-heritage context, few have sought to examine the effect this has on the visitor experience. This paper questions visitors’ ability to objectively assess objects and experiences at heritage sites, and the role of practitioners in presenting often blurred views of social history that may sometimes negate historical fact. Drawing on case study research at two UK living museums, Blists Hill Victorian Town in Shropshire, England, and the Big Pit: National Coal Museum in Wales, notions of reminiscence, authenticity, myth and intangibility are considered within the framework of the interpretive experience. Findings suggest that the visitor experience is inherently subjective, highly individual and that the concept of intangibility is integral to an understanding of the nostalgia-authenticity debate.

Cataloguing Kays: Body Image in the Catalogues of Kay & Co Ltd of Worcester, 1920 - 2000. JISC Final Report

Cataloguing Kays is a university-run project intended to create a community web-archive to celebrate the history and public memory of Kay & Co Ltd of Worcester, a noted mailorder catalogue company which was, until 2006, the largest employer in Worcester. The Kays Archive, housed at UoW, is one of the most comprehensive archive collections of 20th century mail-order catalogues in the UK and has a strong local elevance. The catalogues provide a window into over 100 years of body image, social history, consumable goods, fashion and design. The Project Team created www.WorldofKays.org, an online, fully-searchable archive containing 1500 digitised images from the catalogues, 1920-2000. The website is intended to form a seed bed for international research, focussing in particular on the representation of body image and the way the catalogues represent the developing tropes of consumer lifestyle and aspiration. The images are enhanced by blog postings from or film and audio interviews with local residents and former Kays staff members, who recall how the goods were selected and presented; as well as the impact the mail-order industry had on shaping 20th century lifestyle and consumption. These interviews and blogs have been sourced through the Cataloguing Kays team’s outreach activity in the local, academic and online communities. From the outset, we, the Cataloguing Kays team, engaged with online communities through social media sites, Facebook and Twitter, and through specialist blogs and online forums, inviting comment and contributions. Through events for the general public and a programme of targeted community outreach work with Kays Heritage Group and support groups for Worcestershire’s young and adult carers, we have also collected filmed and audio reminiscence material as well as community art and poetry content for the website. Our academic conference, the Catalogue of Dreams, showcased both the website and the physical archive to the wider academic, cultural and heritage sectors, provoking lively debateand much interest from international scholars.

Something to show for it: the place of mementoes in women’s oral histories of work

Workplace memorabilia, regarded here as artifacts and mementoes kept from workplaces and stored in homes, is varied, including; tools of a trade, ephemeral leaflets and pamphlets, union mementoes, uniforms and badges, long service awards, gifts from colleagues, and photographs both formal and informal. These objects can symbolize many years of work-life history and the corollary of this, their absence, perhaps the need to forget the drudgery of ‘the daily grind’. The materiality of an object saved or taken from the workplace often prompts reminiscence (Bornat, 2001) but can also, in itself and its method of display, represent and express key identities, work processes and traditions. Using examples from a three year ESRC funded project on work and identity this paper focuses on the women who participated in the study and investigates what is kept or not, whether the ways in which work memorabilia is displayed or stored is gendered, and how this might illuminate gendered social relations in the workplace and gendered work identities.

Desmonte de Maciços Rochosos: optimização da perfuração

Este trabalho pretende avaliar e melhorar o modo de execução da aplicação da técnica de perfuração, não comprometendo a jusante, no ciclo de operações, a qualidade do desmonte, visando assim, uma optimização técnico-económica. Este manuscrito irá centrar-se na optimização da etapa da perfuração, visando assim a optimização do ciclo total da perfuração. As tarefas realizadas numa pedreira constituem um ciclo de operações. Uma das operações envolvidas no desmonte de maciços rochosos é a perfuração. A forma como esta é executada é determinante para o sucesso do desmonte. O correcto dimensionamento dos acessórios de perfuração, afiação de bits, manutenção preventiva dos equipamentos de perfuração e a constante formação dos operadores fazem parte de um conjunto de acções que irão determinar o sucesso da operação de perfuração, tendo sempre em vista, uma optimização técnico-económica, ou seja, produzir mais a um custo mais baixo. O estudo dos parâmetros do maciço rochoso aliado a uma perfuração cuidadosa e alinhada é evidenciado com o intuito de uma abordagem de geoengenharia integrada dos maciços rochosos. O estudo foi realizado na pedreira da APS, S.A. (Pedreira de Monte Chãos), tendo como análise os dados desde o início do projecto até à data. Para fundamentar este estudo, aborda-se os parâmetros geológico-geotécnicos e geomecânicos do maciço remanescente, verificando assim as ferramentas de corte mais adequadas ao caso e averiguar a influência da afiação de bits, quer seja manual ou semiautomática, e de que forma a mesma irá influenciar nos rendimentos e vidas úteis obtidas, tendo como objectivo, melhorar o custo por metro de furação realizado.

L’utilisation des services de centre de jour par les personnes âgées qui présentent des incapacités

Contexte: Les centres de jour offrent des interventions de groupe à des personnes âgées qui présentent des incapacités, dans le but de favoriser leur maintien à domicile. Des études récentes tendent à démontrer qu’une utilisation régulière du service serait nécessaire pour induire des effets bénéfiques. Objectifs: Cette recherche visait à documenter l’utilisation des centres de jour par des personnes âgées qui présentent des incapacités. Elle comportait trois principaux objectifs: 1) Caractériser les utilisateurs de centre de jour et ce qui les distingue des non-utilisateurs et analyser les déterminants de l’utilisation du centre de jour. 2) Explorer l’adéquation entre les activités offertes par les centres de jour et les caractéristiques d’autonomie et de santé des utilisateurs. 3) Définir les facteurs associés à la régularité de la participation. Méthodes: Cette recherche s’appuie sur une analyse secondaire de données recueillies auprès de 723 personnes âgées qui ont participé au projet de démonstration SIPA (Services intégrés pour personnes âgées) implanté dans deux CLSC de la région de Montréal. L’utilisation du centre de jour a été documentée pendant une période de six mois, auprès des cinq centres de jour existant sur ce même territoire. Des informations sur le fonctionnement des centres de jour ont été obtenues par des entrevues et des rencontres de groupe auprès de coordonnateurs de ces centres. Les données ont été analysées à l’aide de statistiques descriptives, d’analyses en regroupement et d’analyses de régression logistique et multiple. Résultats: Les résultats sont présentés dans trois articles, soit un pour chacun des objectifs. Article 1: La proportion d’utilisateurs de centre de jour est de 18,8% (IC-0,95: 16,0 à 21,7%). Les facteurs suivants augmentent la probabilité d’utiliser le centre de jour: être plus jeune (RC: 1,12; IC-0,95: 1,06 à 1,19); ne pas avoir une éducation universitaire (RC: 1,92; IC-0,95: 1,04 à 3,57); recevoir l’aide du CLSC pour les activités de vie quotidienne plus d’une fois par semaine (RC: 1,73 et 2,48 pour aide de deux à cinq fois par semaine et aide de six à sept fois par semaine respectivement; IC-0,95: 1,06 à 2,80 et 1,22 à 5,06); faire partie du bassin de desserte d’un centre de jour dont les coûts sont moins élevés (RC: 1,054 ; IC-0,95: 1,001 à 1,108 pour chaque augmentation de 1$); et pour les hommes seulement, avoir déjà subi un accident vasculaire cérébral et présenter davantage d’incapacités fonctionnelles (interaction entre le sexe et la présence d’un AVC: RC: 0,298; IC-0,95: 0,108 à 0,825; interaction entre le sexe et les capacités fonctionnelles mesurées à l’OARS: RC: 1,096; IC-0,95: 1,019 à 1,178). De plus, on observe une plus grande probabilité d’utiliser le centre de jour chez les personnes qui cohabitent avec une personne de soutien. Toutefois, cette relation ne s’observe que chez les personnes nées au Canada (interaction entre la cohabitation avec la personne de soutien et le pays de naissance: RC: 0,417; IC-0,95: 0,185 à 0,938). Article 2: Des analyses en regroupement ont permis de distinguer quatre profils de participants ayant des caractéristiques similaires: 1) les personnes fragilisées par un âge avancé et un grand nombre de problèmes de santé; 2) les participants plus jeunes et plus autonomes que la moyenne, qui semblent des utilisateurs précoces; 3) les personnes qui présentent des incapacités d’origine cognitive; et 4) celles qui présentent des incapacités d’origine motrice. Les activités de groupe des centres de jour ont été regroupées en huit catégories: exercices physiques; groupe spécifique pour un diagnostic ou un problème fonctionnel commun; activités fonctionnelles; stimulation cognitive; activités musicales ou de réminiscence; sports et jeux physiques; intégration sociale; prévention et promotion de la santé. Les activités les plus fréquentes sont les exercices physiques et les activités d’intégration sociale auxquelles ont participé plus de 90% des utilisateurs de centre de jour, et ce en moyenne à respectivement 78% (±23%) et 72% (±24%) de leurs présences au centre de jour. Les autres catégories d’activités rejoignent de 45% à 77% des participants, et ce en moyenne à 35% (±15%) à 46% (±33%) de leurs présences. La participation aux diverses catégories d’activités a été étudiée pour chaque profil d’utilisateurs et comparée aux activités recommandées pour divers types de clientèle. On observe une concordance partielle entre les activités offertes et les besoins des utilisateurs. Cette concordance apparaît plus grande pour les participants qui présentent des problèmes de santé physique ou des incapacités d’origine motrice et plus faible pour ceux qui présentent des symptômes dépressifs ou des atteintes cognitives. Article 3: Les participants au centre de jour y sont inscrits en moyenne à raison de 1,56 (±0,74) jours par semaine mais sont réellement présents à 68,1% des jours attendus. Les facteurs suivants sont associés à une participation plus régulière au centre de jour en termes de taux de présences réelles / présences attendues: ne pas avoir travaillé dans le domaine de la santé (b: ,209; IC-0,95: ,037 à ,382); recevoir de l’aide du CLSC les jours de fréquentation du centre de jour (b: ,124; IC-0,95: ,019 à ,230); être inscrit pour la journée plutôt que la demi-journée (b: ,209: IC-0,95: ,018 à ,399); lors de ses présences au centre de jour, avoir une moins grande proportion d’activités de prévention et promotion de la santé (b: ,223; IC-0,95: ,044 à ,402); et enfin, avoir un aidant qui présente un fardeau moins élevé pour les personnes avec une atteinte cognitive et un fardeau plus élevé pour les personnes sans atteinte cognitive (interaction entre la présence d’atteinte cognitive et le fardeau de l’aidant: b: -,008; IC-0,95: -,014 à -,044). Conclusion: Conformément à leur mission, les centres de jour rejoignent une bonne proportion des personnes âgées qui présentent des incapacités. Cette étude fait ressortir les caractéristiques des personnes les plus susceptibles d’y participer. Elle suggère la nécessité de revoir la planification des activités pour assurer une offre de services qui tienne davantage compte des besoins des participants, en particulier de ceux qui présentent des atteintes cognitives et des symptômes de dépression. Elle démontre aussi que l’intensité d’exposition au service semble faible, ce qui soulève la question des seuils d’exposition nécessaires pour induire des effets favorables sur le maintien à domicile et sur la qualité de vie de la clientèle cible.

"Ici et là" : suivi de "Deuil, accueil, recueil"

Mémoire numérisé par la Division de la gestion de documents et des archives de l'Université de Montréal