Peeling Experiments Of Ductile Thin Films Along Ceramic Substrates - Critical Assessment Of Analytical Models

Two types of peeling experiments are performed in the present research. One is for the Al film/Al2O3 substrate system with an adhesive layer between the film and the substrate. The other one is for the Cu film/Al2O3 substrate system without adhesive layer between the film and the substrate, and the Cu films are electroplated onto the Al2O3 substrates. For the case with adhesive layer, two kinds of adhesives are selected, which are all the mixtures of epoxy and polyimide with mass ratios 1:1.5 and 1:1, respectively. The relationships between energy release rate, the film thickness and the adhesive layer thickness are measured during the steady-state peeling process. The effects of the adhesive layer on the energy release rate are analyzed. Using the experimental results, several analytical criteria for the steady-state peeling based on the bending model and on the two-dimensional finite element analysis model are critically assessed. Through assessment of analytical models, we find that the cohesive zone criterion based on the beam bend model is suitable for a weak interface strength case and it describes a macroscale fracture process zone case, while the two-dimensional finite element model is effective to both the strong interface and weak interface, and it describes a small-scale fracture process zone case. (C) 2007 Elsevier Ltd. All rights reserved.

Nonlinear Mechanical Modeling Of Cell Adhesion

Cell adhesion, which is mediated by the receptor-ligand bonds, plays an essential role in various biological processes. Previous studies often described the force-extension relationship of receptor-ligand bond with linear assumption. However, the force-extension relationship of the bond is intrinsically nonlinear, which should have significant influence on the mechanical behavior of cell adhesion. In this work, a nonlinear mechanical model for cell adhesion is developed, and the adhesive strength was studied at various bond distributions. We find that the nonlinear mechanical behavior of the receptor-ligand bonds is crucial to the adhesive strength and stability. This nonlinear behavior allows more bonds to achieve large bond force simultaneously, and therefore the adhesive strength becomes less sensitive to the change of bond density at the outmost periphery of the adhesive area. In this way, the strength and stability of cell adhesion are soundly enhanced. The nonlinear model describes the cell detachment behavior better than the linear model. (C) 2007 Elsevier Ltd. All rights reserved.

Robotic body extension based on hot melt adhesives

The capability of extending body structures is one of the most significant challenges in the robotics research and it has been partially explored in self-reconfigurable robotics. By using such a capability, a robot is able to adaptively change its structure from, for example, a wheel like body shape to a legged one to deal with complexity in the environment. Despite their expectations, the existing mechanisms for extending body structures are still highly complex and the flexibility in self-reconfiguration is still very limited. In order to account for the problems, this paper investigates a novel approach to robotic body extension by employing an unconventional material called Hot Melt Adhesives (HMAs). Because of its thermo-plastic and thermo-adhesive characteristics, this material can be used for additive fabrication based on a simple robotic manipulator while the established structures can be integrated into the robot's own body to accomplish a task which could not have been achieved otherwise. This paper first investigates the HMA material properties and its handling techniques, then evaluates performances of the proposed robotic body extension approach through a case study of a "water scooping" task. © 2012 IEEE.

Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives

In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. Nearly 40% of the joints were opened (i.e. lifted away from the pad) after the reflow process with 260 °C peak temperature while no opening was observed when the peak temperature was 210 °C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. It was also found that the ACF joints after the reflow process with 210 °C peak temperature showed a high ability to resist water absorption under steady state 85 °C/85%RH conditions, probably because the curing degree of the ACF was improved during the reflow process. To give a good understanding, a 3D model of an ACF joint structure was built and finite element analysis was used to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process.

Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

This work describes the work of an investigation of the effects of solder reflow process on the reliability of anisotropic conductive film (ACF) interconnection for flip-chip on flex (FCOF) applications. Experiments as well as computer modeling methods have been used. The results show that the contact resistance of ACF interconnections increases after the reflow and the magnitude of the increase is strongly correlated to the peak reflow temperature. In fact, nearly 40 percent of the joints are open when the peak reflow temperature is 260°C, while there is no opening when the peak temperature is 210°C. It is believed that the coefficient of thermal expansion (CTE) mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a three-dimensional (3-D) finite element (FE) model of an ACF joint has been analyzed in order to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process. The stress level at the interface between the particle and its surrounding materials is significant and it is the highest at the interface between the particle and the adhesive matrix.

Failure mechanisms of ACF joints under isothermal ageing

The possible failure mechanisms of anisotropic conductive film (ACF) joints under isothermal ageing conditions have been identified through experiments. It has been found that ACF joints formed at higher bonding temperatures can prevent increases in the contact resistance for any ageing temperature. The higher the ageing temperature the higher the electrical failure rate is. The formation of conduction gaps between the conductive particles and the pads and damages to the metal coatings of the particle have been identified as the reasons behind the electrical failures during ageing. In order to understand the mechanism for the formation of the conduction gap and damages in metal coatings during the isothermal ageing, computer modelling has been carried out and the results are discussed extensively. The computer analysis shows that stresses concentrate at the edges of the particle–pad interface, where the adhesive matrix meets the particle. This could lead to subsequent damages and reductions in the adhesion strength in that region and it is possible for the conductive particle to be detached from the pad and the adhesive matrix. It is believed that because of this a conduction gap appears. Furthermore, under thermal loading the thermal expansion of the adhesive matrix squeezes the conductive particle and damages the metal coatings. Experimental evidences support this computational finding. It is, therefore, postulated that if an ACF-based electronic component operates in a high temperature aging condition, its electrical and mechanical functionalities will be at risk.

Effect of temperature on the shear strength of aluminium single lap bonded joints for high temperature applications

An experimental and numerical investigation into the shear strength behaviour of adhesive single lap joints (SLJs) was carried out in order to understand the effect of temperature on the joint strength. The adherend material used for the experimental tests was an aluminium alloy in the form of thin sheets, and the adhesive used was a high-strength high temperature epoxy. Tensile tests as a function of temperature were performed and numerical predictions based on the use of a bilinear cohesive damage model were obtained. It is shown that at temperatures below Tg, the lap shear strength of SLJs increased, while at temperatures above Tg, a drastic drop in the lap shear strength was observed. Comparison between the experimental and numerical maximum loads representing the strength of the joints shows a reasonably good agreement.

Estudo e otimização de juntas do tipo Tpeel soldadas, adesivas e híbridas

A necessidade de utilizar métodos de ligação que melhor satisfaçam as necessidades de projeto tem causado a crescente utilização das juntas adesivas, em detrimento dos métodos tradicionais tais como a soldadura, ligações aparafusadas e rebitadas. A sua utilização em diversas aplicações industriais justifica-se pela redução de peso, redução de concentrações de tensões, isolamento acústico e melhor resistência à corrosão. Contudo, também apresentam desvantagens, como a necessidade de preparação das juntas, a fraca resistência a esforços de arrancamento e a complexidade da previsão da sua resistência. As juntas híbridas são obtidas por combinação de uma técnica tradicional com uma ligação adesiva. As juntas híbridas adesivas-soldadas obtêm-se através da combinação da ligação adesiva com a ligação soldada, sendo a soldadura de resistência por pontos a técnica de soldadura mais usada no fabrico deste tipo de juntas. A sinergia entre ligação adesiva e soldadura por pontos oferece vantagens competitivas em relação às ligações adesivas, tais como superior resistência e rigidez, e maior resistência ao arrancamento e à fadiga. No presente trabalho é apresentado um estudo experimental e numérico de juntas T-peel soldadas, adesivas e híbridas (adesivas-soldadas) solicitadas ao arrancamento. Considerouse o adesivo frágil Araldite® AV138 e os adesivos dúcteis Araldite® 2015 e Sikaforce® 7752 e aderentes de aço (C45E). Foi realizada uma análise dos valores experimentais e efetuada uma comparação destes valores com os resultados obtidos pelo Método de Elementos Finitos (MEF) no software ABAQUS®, que incluiu uma análise de tensões na camada de adesivo e previsão do comportamento das juntas por MDC. Observou-se que, dos três adesivos em estudo, o adesivo Sikaforce® 7752 é o que apresenta o melhor desempenho na ligação de juntas T-peel. A boa concordância entre os resultados experimentais e numéricos permitiu validar a utilização de MDC para previsão da resistência de juntas T-peel adesivas e híbridas. Assim, o presente trabalho representa uma base para posterior aplicação no projeto deste tipo de ligação, com as vantagens decorrentes na redução do tempo de projeto e maior facilidade de otimização.

Identification of Salmonella spp. isolates from chicken abattoirs by multiplex-PCR

The present study was carried out to report the occurrence Salmonella spp., Salmonella Enteritidis, and Salmonella Typhimurium in chicken abattoirs. Samples of feces; feathers; scald, evisceration, and chiller water; and rinse water of non-eviscerated, eviscerated, and chilled carcass were collected from six chicken abattoirs. Salmonella isolates were identified by a multiplex-PCR using three sets of primers targeting the inuA, pefA, and sefA gene sequences from Salmonella spp., S. Typhimurium and S. Enteritidis, respectively. Salmonella spp. was detected in 10% (29/288) of the samples, whereas serovars Enteritidis and Typhimurium were identified in 62% (7/288), respectively. The results indicate the need to improve hygiene and sanitary standards in poultry slaughter lines, besides the education of food handlers and information to consumers. (c) 2006 Elsevier Ltd. All rights reserved.

Efeito de concentrações de espalhante adesionante e doses de glyphosate no controle de Brachiaria decumbens e Panicum maximum

Foram avaliadas as interações entre o glyphosate e o espalhante adesionante correspondente ao condensado de alcoolfenóis com óxido de eteno e sulfonados orgânicos quanto à redução de tensão superficial e ao controle de Panicum maximum e Brachiaria decumbens. Os produtos comerciais apresentavam 360 g e.a./l e 466 g i.a./l, respectivamente. O herbicida reduziu o efeito do espalhante sobre a tensão superficial. Na concentração de 0,1% de p.c., o espalhante maximizou o controle das duas espécies pelo glyphosate. P. maximum mostrou-se menos sensível ao glyphosate que B. decumbens, exigindo doses 24,05% superiores.

Efeito da lavagem artificial na eficiência de acaricidas-ovicidas no controle de Brevipalpus phoenicis (Geijskes, 1939) (Acari: Tenuipalpidae) em citros

The objective of this research was to test the control of Brevipalpus phoenicis (Geijskes, 1939) by the hexythiazox and quinometionato products in citrus crop with and without adhesive spread and when submitted to artificial rain. The plants were sprayed at 2, 4, 8, 24 and 48 hours. When dried, the fruits were collected (eight/plants) and half of them were washed in laboratory with artificial rainfall on the basis of 30 mm/h during 15 minutes establishing the following treatments: T1 - hexythiazox + washing; T2 - hexythiazox + agral + washing; T3 - quinometionato + washing; T4 - quinometionato + agral + washing; T5 - control + agral + washing; T6 - hexythiazox; T7 - hexythiazox + agral; T8 - quinometionato; T9 - quinometionato + agral; T10 - control + agral. Thus, all the fruits were inoculated with ten females of B. phoenicis and five days later the mites alive were counted and eliminated. Approximately 15 days later the number of larvae alive were also counted. The results obtained allowed the following conclusions: a) the acaricides were efficient to control B. phoenicis; b) the rainfall (washing) did not alter the efficiency; c) the agral did not change the results.

Scanning electron microscope analysis of internal adaptation of materials used for pulp protection under composite resin restorations

Purpose: The aim of this study was to evaluate the interfacial microgap with different materials used for pulp protection. The null hypothesis tested was that the combination of calcium hydroxide, resin-modified glass ionomer, and dentin adhesive used as pulp protection in composite restorations would not result in a greater axial gap than that obtained with hybridization only. Materials and Methods: Standardized Class V preparations were performed in buccal and lingual surfaces of 60 caries-free, extracted human third molars. The prepared teeth were randomly assessed in six groups: (1) Single Bond (SB) (3M ESPE, St. Paul, MN, USA); (2) Life (LF) (Kerr Co., Romulus, MI, USA) + SB; (3) LF + Vitrebond (VT) (3M ESPE) + SB; (4) VT + SB; (5) SB + VT; (6) SB + VT + SB. They were restored with microhybrid composite resin Filtek Z250 (3M ESPE), according to the manufacturer's instructions. However, to groups 5 and 6, the dentin bonding adhesive was applied prior to the resin-modified glass ionomer. The specimens were then thermocycled, cross-sectioned through the center of the restoration, fixed, and processed for scanning electron microscopy. The specimens were mounted on stubs and sputter coated. The internal adaptation of the materials to the axial wall was analyzed under SEM with × 1,000 magnification. Results: The data obtained were analyzed with nonparametric tests (Kruskal-Wallis, p ≤ .05). The null hypothesis was rejected. Calcium hydroxide and resin-modified glass ionomer applied alone or in conjunction with each other (p < .001) resulted in statistically wider microgaps than occurred when the dentin was only hybridized prior to the restoration. ©2005 BC Decker Inc.

Influence of surface sealants on microleakage of composite resin restorations

Purpose: The purpose of this study was to verify the influence of surface sealants and dentin adhesive systems on the microleakage of composite restorations. Methods: Class V cavities were made on the buccal faces of 100 permanent third molars and restored with Z250. After 24 hours, they were submitted to polishing and finishing processes. The teeth were divided into groups according to the sealant agent: group 1 - Single Bond; group 2 - Opti Bond Solo Plus; group 3 - Fortify; group 4 - Fortify Plus; and group 5 - control without sealant. The analysis of immediate microleakage was performed in 10 restorations from each group, soon after the sealing. The other 10 specimens from each group were submitted to tooth-brushing and thermal cycles. The teeth were isolated and immersed in 2% methylene blue solution, washed in tap water, and sectioned in the buccolingual direction. The percentage of marginal leakage was calculated using an image analysis program, and results were submitted to analysis of variance and Tukey's test. Results: All the sealed groups demonstrated lower microleakage values compared to the control group. Group 3, sealed with Fortify, presented the lowest mean microleakage values. Conclusion: The application of surface sealants effectively decreased the microleakage in composite resin restorations.

Tempo de condicionamento da dentina hígida e afetada por cárie de dentes decíduos e permanentes: efeito na desmineralização do substrato, na produção e na resistência da união resina-dentina

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Avaliação da resistência adesiva à microtração após desproteinização da dentina. Efeito de diferentes sistemas adesivos

Pós-graduação em Ciências Odontológicas - FOAR