559 resultados para Interfaccia, integrata, CMOS
Resumo:
In questo lavoro di tesi verrà presentato un applicativo, sviluppato con l’azienda EBWorld, per dispositivi con sistema operativo Android. L’applicazione ha come destinatari i tecnici e gli operatori sul campo di aziende clienti di EBWorld. Nel dispositivo vengono caricati i dati estratti dal database (porzioni di mappe e informazioni ad esse correlate) che vengono lette e mostrate nello schermo. Le funzionalità fornite sono: utilizzo dello strumento trail, per effettuare misurazioni; creazione di progetti all’interno delle esportazioni; inserimento di sketch, definiti in accordo con l’azienda, all’interno dei progetti; selezione degli sketch e delle informazioni estratte dal database e visualizzazione delle relative informazioni / proprietà; eliminazione di sketch inseriti. È stato effettuato uno studio di progettazione dell’interfaccia per offrire un’ottima usabilità anche in situazioni critiche.
Resumo:
Il presente lavoro di tesi, nell’ambito della simulazione balistica di razzi a propellente solido, è volto alla creazione di un’interfaccia che permetta il caricamento delle geometrie dei motori desiderati, in formato SPP, nel codice di simulazione balistica ROBOOST come richiesto da Avio Spa. In particolare saranno descritte le procedure attraverso le quali tale interfaccia è stata realizzata e verranno analizzati i passaggi mediante i quali è possibile ottenere una mesh 3D del motore a propellente solido partendo dalla sua geometria in formato SPP. Si analizzerà inoltre il processo di chiusura di una mesh estratta da una qualsiasi iterazione della simulazione al fine di potervi effettuare delle simulazioni CFD sempre su richiesta della sopracitata azienda. Infine verranno mostrati e discussi i risultati ottenuti per meglio visualizzare il lavoro svolto.
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Panoramica di MPEG-DASH e TVWS, descrizione dell'implementazione di un middleware multi-interfaccia per lo streaming video adattivo e test di valutazione del lavoro svolto
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The single electron transistor (SET) is a charge-based device that may complement the dominant metal-oxide-semiconductor field effect transistor (MOSFET) technology. As the cost of scaling MOSFET to smaller dimensions are rising and the the basic functionality of MOSFET is encountering numerous challenges at dimensions smaller than 10nm, the SET has shown the potential to become the next generation device which operates based on the tunneling of electrons. Since the electron transfer mechanism of a SET device is based on the non-dissipative electron tunneling effect, the power consumption of a SET device is extremely low, estimated to be on the order of 10^-18J. The objectives of this research are to demonstrate technologies that would enable the mass produce of SET devices that are operational at room temperature and to integrate these devices on top of an active complementary-MOSFET (CMOS) substrate. To achieve these goals, two fabrication techniques are considered in this work. The Focus Ion Beam (FIB) technique is used to fabricate the islands and the tunnel junctions of the SET device. A Ultra-Violet (UV) light based Nano-Imprint Lithography (NIL) call Step-and-Flash- Imprint Lithography (SFIL) is used to fabricate the interconnections of the SET devices. Combining these two techniques, a full array of SET devices are fabricated on a planar substrate. Test and characterization of the SET devices has shown consistent Coulomb blockade effect, an important single electron characteristic. To realize a room temperature operational SET device that function as a logic device to work along CMOS, it is important to know the device behavior at different temperatures. Based on the theory developed for a single island SET device, a thermal analysis is carried out on the multi-island SET device and the observation of changes in Coulomb blockade effect is presented. The results show that the multi-island SET device operation highly depends on temperature. The important parameters that determine the SET operation is the effective capacitance Ceff and tunneling resistance Rt . These two parameters lead to the tunneling rate of an electron in the SET device, Γ. To obtain an accurate model for SET operation, the effects of the deviation in dimensions, the trap states in the insulation, and the background charge effect have to be taken into consideration. The theoretical and experimental evidence for these non-ideal effects are presented in this work.
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Neuromorphic computing has become an emerging field in wide range of applications. Its challenge lies in developing a brain-inspired architecture that can emulate human brain and can work for real time applications. In this report a flexible neural architecture is presented which consists of 128 X 128 SRAM crossbar memory and 128 spiking neurons. For Neuron, digital integrate and fire model is used. All components are designed in 45nm technology node. The core can be configured for certain Neuron parameters, Axon types and synapses states and are fully digitally implemented. Learning for this architecture is done offline. To train this circuit a well-known algorithm Restricted Boltzmann Machine (RBM) is used and linear classifiers are trained at the output of RBM. Finally, circuit was tested for handwritten digit recognition application. Future prospects for this architecture are also discussed.
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During the last years the use of tracking cameras for SLR observations became less important due to the high accuracy of the predicted orbits. Upcoming new targets like satellites in eccentric orbits and space debris objects, however, require tracking cameras again. In 2013 the interline CCD camera was replaced at the Zimmerwald Observatory with a so called scientific CMOS camera. This technology promises a better performance for this application than all kinds of CCD cameras. After the comparison of the different technologies the focus will be on the integration in the Zimmerwald SLR system.
Resumo:
CMOS-sensors, or in general Active Pixel Sensors (APS), are rapidly replacing CCDs in the consumer camera market. Due to significant technological advances during the past years these devices start to compete with CCDs also for demanding scientific imaging applications, in particular in the astronomy community. CMOS detectors offer a series of inherent advantages compared to CCDs, due to the structure of their basic pixel cells, which each contains their own amplifier and readout electronics. The most prominent advantages for space object observations are the extremely fast and flexible readout capabilities, feasibility for electronic shuttering and precise epoch registration,and the potential to perform image processing operations on-chip and in real-time. Here, the major challenges and design drivers for ground-based and space-based optical observation strategies for objects in Earth orbit have been analyzed. CMOS detector characteristics were critically evaluated and compared with the established CCD technology, especially with respect to the above mentioned observations. Finally, we simulated several observation scenarios for ground- and space-based sensor by assuming different observation and sensor properties. We will introduce the analyzed end-to-end simulations of the ground- and spacebased strategies in order to investigate the orbit determination accuracy and its sensitivity which may result from different values for the frame-rate, pixel scale, astrometric and epoch registration accuracies. Two cases were simulated, a survey assuming a ground-based sensor to observe objects in LEO for surveillance applications, and a statistical survey with a space-based sensor orbiting in LEO observing small-size debris in LEO. The ground-based LEO survey uses a dynamical fence close to the Earth shadow a few hours after sunset. For the space-based scenario a sensor in a sun-synchronous LEO orbit, always pointing in the anti-sun direction to achieve optimum illumination conditions for small LEO debris was simulated.
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En este proyecto, se presenta un sensor de temperatura integrado CMOS basado en la medida de una variable secundaria, cuyo valor es dependiente de la temperatura, como es el tiempo de subida que presenta una señal eléctrica en sus flancos de subida. Con el objetivo de reducir coste y potencia consumida, el sensor integrado de temperatura propuesto genera un pulso con un ancho proporcional a la temperatura medida. Este sensor para realizar la medida elimina la necesidad de tener una señal que sirva de referencia. El área ocupada por este modelo de sensor es de 1.8967mm2, siendo éste fabricado en tecnología CMOS de 0.35µm de 4 capas de metal. Gracias a la excelente linealidad que presenta la salida digital del sensor, el error de medida alcanzado es como máximo de ±0.520ºC. La resolución efectiva mostrada en el caso peor es de 0.7ºC, y el consumo de potencia se encuentra por debajo de los 263µW, con una velocidad de realización de medidas que puede llegar a alcanzar las 1.5x10^6 medidas por segundo.
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This paper presents a CMOS temperature sensor based on the thermal dependencies of the leakage currents targeting the 65 nm node. To compensate for the effect of process fluctuations, the proposed sensor realizes the ratio of two measures of the time it takes a capacitor to discharge through a transistor in the subthreshold regime. Furthermore, a novel charging mechanism for the capacitor is proposed to further increase the robustness against fabrication variability. The sensor, including digitization and interfacing, occupies 0.0016 mm2 and has an energy consumption of 47.7–633 pJ per sample. The resolution of the sensor is 0.28 °C, and the 3σ inaccuracy over the range 40–110 °C is 1.17 °C.
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Using CMOS transistors for terahertz detection is currently a disruptive technology that offers the direct integration of a terahertz detector with video preamplifiers. The detectors are based on the resistive mixer concept and its performance mainly depends on the following parameters: type of antenna, electrical parameters (gate to drain capacitor and channel length of the CMOS device) and foundry. Two different 300 GHz detectors are discussed: a single transistor detector with a broadband antenna and a differential pair driven by a resonant patch antenna.
Resumo:
Using CMOS transistors for terahertz detection is currently a disruptive technology that offers the direct integration of a terahertz detector with video preamplifiers. The detectors are based on the resistive mixer concept and performance mainly depends on the following parameters: type of antenna, electrical parameters (gate to drain capacitor and channel length of the CMOS device) and foundry. Two different 300 GHz detectors are discussed: a single transistor detector with a broadband antenna and a differential pair driven by a resonant patch antenna.