Optimum adhesive thickness in structural adhesives joints using statistical techniques base on Weibull distribution

The geometrical factors defining an adhesive joint are of great importance as its design greatly conditions the performance of the bonding. One of the most relevant geometrical factors is the thickness of the adhesive as it decisively influences the mechanical properties of the bonding and has a clear economic impact on the manufacturing processes or long runs. The traditional mechanical joints (riveting, welding, etc.) are characterised by a predictable performance, and are very reliable in service conditions. Thus, structural adhesive joints will only be selected in industrial applications demanding mechanical requirements and adverse environmental conditions if the suitable reliability (the same or higher than the mechanical joints) is guaranteed. For this purpose, the objective of this paper is to analyse the influence of the adhesive thickness on the mechanical behaviour of the joint and, by means of a statistical analysis based on Weibull distribution, propose the optimum thickness for the adhesive combining the best mechanical performance and high reliability. This procedure, which is applicable without a great deal of difficulty to other joints and adhesives, provides a general use for a more reliable use of adhesive bondings and, therefore, for a better and wider use in the industrial manufacturing processes.

Degradation in seawater of structural adhesives for hybrid fibre-metal laminated materials

The adhesives used for applications in marine environments are subject to particular chemical conditions, which are mainly characterised by an elevated chlorine ion content and intermittent wetting/drying cycles, among others.These conditions can limit the use of adhesives due to the degradation processes that they experience. In this work, the chemical degradation of two different polymers, polyurethane and vinylester, was studied in natural seawater under immersion for different periods of time.The diffusion coefficients and concentration profiles of water throughout the thickness of the adhesiveswere obtained.Microstructural changes in the polymer due to the action of water were observed by SEM, and the chemical degradation of the polymer was monitored with the Fourier transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). The degradation of the mechanical properties of the adhesive was determined by creep tests withMixed Cantilever Beam (MCB) specimens at different temperatures. After 180 days of immersion of the specimens, it was concluded that the J-integral value (depending on the strain) implies a loss of stiffness of 51% and a decrease in the failure load of 59% for the adhesive tested.

Muro cortina modular con marco de baja transmitancia térmica integrado en el vidrio aislante a través de adhesivos estructurales = Unitised curtain wall with low thermal transmittance frame integrated within the insulating glass unit through structural adhesives

Los muros cortina modulares están constituidos por paneles prefabricados que se fijan al edificio a través de anclajes a lo largo del borde del forjado. El proceso de prefabricación garantiza buena calidad y control de los acabados y el proceso de instalación es rápido y no requiere andamiaje. Por estas razones su uso está muy extendido en torres. Sin embargo, el diseño de los marcos de aluminio podría ser más eficiente si se aprovechara la rigidez de los vidrios para reducir la profundidad estructural de los montantes. Asimismo, se podrían reducir los puentes térmicos en las juntas si se sustituyeran los marcos por materiales de menor conductividad térmica que el aluminio. Esta investigación persigue desarrollar un muro cortina alternativo que reduzca la profundidad estructural, reduzca la transmisión térmica en las juntas y permita un acabado enrasado al interior, sin que sobresalgan los montantes. La idea consiste en conectar un marco de material compuesto de fibra de vidrio a lo largo del borde del vidrio aislante a través de adhesivos estructurales para así movilizar una acción estructural compuesta entre los dos vidrios y lograr una baja transmitancia térmica. El marco ha de estar integrado en la profundidad del vidrio aislante. En una primera fase se han efectuado cálculos estructurales y térmicos preliminares para evaluar las prestaciones a un nivel esquemático. Además, se han realizado ensayos a flexión en materiales compuestos de fibra de vidrio y ensayos a cortante en las conexiones adhesivas entre vidrio y material compuesto. Con la información obtenida se ha seleccionado el material del marco y del adhesivo y se han efectuado cambios sobre el diseño original. Los análisis numéricos finales demuestran una reducción de la profundidad estructural de un 80% y una reducción de la transmisión térmica de un 6% en comparación con un sistema convencional tomado como referencia. El sistema propuesto permite obtener acabados enrasados. ABSTRACT Unitised curtain wall systems consist of pre manufactured cladding panels which can be fitted to the building via pre fixed brackets along the edge of the floor slab. They are universally used for high rise buildings because the factory controlled assembly of units ensures high quality and allows fast installation without external access. However, its frame is structurally over-dimensioned because it is designed to carry the full structural load, failing to take advantage of potential composite contribution of glass. Subsequently, it is unnecessarily deep, occupying valuable space, and protrudes to the inside, causing visual disruption. Moreover, it is generally made of high thermal conductivity metal alloys, contributing to substantial thermal transmission at joints. This research aims to develop a novel frame-integrated unitised curtain wall system that will reduce thermal transmission at joints, reduce structural depth significantly and allow an inside flush finish. The idea is to adhesively bond a Fibre Reinforced Polymer (FRP) frame to the edge of the Insulated Glass Unit (IGU), thereby achieving composite structural behaviour and low thermal transmittance. The frame is to fit within the glazing cavity depth. Preliminary analytical structural and numerical thermal calculations are carried out to assess the performance of an initial schematic design. 4-point bending tests on GFRP and single-lap shear tests on bonded connections between GFRP and glass are performed to inform the frame and adhesive material selection process and to characterise these materials. Based on the preliminary calculations and experimental tests, some changes are put into effect to improve the performance of the system and mitigate potential issues. Structural and thermal numerical analysis carried out on the final detail design confirm a reduction of the structural depth to almost one fifth and a reduction of thermal transmission of 6% compared to a benchmark conventional system. A flush glazed appearance both to the inside and the outside are provided while keeping the full functionality of a unitised system.

Cloning of the Arabidopsis RTM1 gene, which controls restriction of long-distance movement of tobacco etch virus

The locus RTM1 is necessary for restriction of long-distance movement of tobacco etch virus in Arabidopsis thaliana without causing a hypersensitive response or inducing systemic acquired resistance. The RTM1 gene was isolated by map-based cloning. The deduced gene product is similar to the α-chain of the Artocarpus integrifolia lectin, jacalin, and to several proteins that contain multiple repeats of a jacalin-like sequence. These proteins comprise a family with members containing modular organizations of one or more jacalin repeat units and are implicated in defense against viruses, fungi, and insects.

Treatment of wastewaters from adhesives and sealants manufacture by ultrafiltration /

Mode of access: Internet.

Directory : information sources on scientific research related to the preservation of books, paper, and adhesives.

Mode of access: Internet.

Structural adhesives: an introduction for potential users

"Submitted in partial fulfillment of the requirements in Professor Georges F. Doriot's course in manufacturing at the Harvard Graduate School of Business Administration during ... 1957-1958."

Rheological properties of adhesives considered for interface damping

Mode of access: Internet.

The Suspension Bridge on the Border of Hida and Etch? Provinces (Hietsu no sakai tsuribashi), #8B, Remarkable Views of Bridges in Various Provinces (Shokoku meikyo kiran)

Katsushika Hokusai; 10 1/8 in.x 1 ft. 3 1/8 in.; woodcut, oban, ink and color on paper

Principles of high-polymer theory and practice; fibers, plastics, rubbers, coatings, adhesives,

Includes bibliographies.

Adhesives and interfacial phenomena in wound healing

This chapter deals initially with the underlying principles of adhesion and adhesives and the understanding of interfacial behaviour. This provides a basis upon which to understand biological interactions (. Chapter 12). The two broad types of adhesive materials encountered in wound healing are pressure-sensitive adhesives (PSA) and tissue sealants. The function of pressure-sensitive adhesives is to form an adhesive bond between tissue and biomaterial under the influence of pressure. Tissue sealants are liquids that convert to solid form at the tissue surface and in so doing form either an effective seal against fluid leakage or a bond between adjacent tissue surfaces. The different requirements and characteristics of these systems are discussed. © 2011 Woodhead Publishing Limited All rights reserved.

Study on synthetic and bio-based phenol-formaldehyde adhesives for the wood-based industry

DUE TO COPYRIGHT RESTRICTIONS ONLY AVAILABLE FOR CONSULTATION AT ASTON UNIVERSITY LIBRARY AND INFORMATION SERVICES WITH PRIOR ARRANGEMENT

High Precision Plasma Etch for Pattern Transfer: Towards Fluorocarbon Based Atomic Layer Etching

A basic requirement of a plasma etching process is fidelity of the patterned organic materials. In photolithography, a He plasma pretreatment (PPT) based on high ultraviolet and vacuum ultraviolet (UV/VUV) exposure was shown to be successful for roughness reduction of 193nm photoresist (PR). Typical multilayer masks consist of many other organic masking materials in addition to 193nm PR. These materials vary significantly in UV/VUV sensitivity and show, therefore, a different response to the He PPT. A delamination of the nanometer-thin, ion-induced dense amorphous carbon (DAC) layer was observed. Extensive He PPT exposure produces volatile species through UV/VUV induced scissioning. These species are trapped underneath the DAC layer in a subsequent plasma etch (PE), causing a loss of adhesion. Next to stabilizing organic materials, the major goals of this work included to establish and evaluate a cyclic fluorocarbon (FC) based approach for atomic layer etching (ALE) of SiO2 and Si; to characterize the mechanisms involved; and to evaluate the impact of processing parameters. Periodic, short precursor injections allow precise deposition of thin FC films. These films limit the amount of available chemical etchant during subsequent low energy, plasma-based Ar+ ion bombardment, resulting in strongly time-dependent etch rates. In situ ellipsometry showcased the self-limited etching. X-ray photoelectron spectroscopy (XPS) confirms FC film deposition and mixing with the substrate. The cyclic ALE approach is also able to precisely etch Si substrates. A reduced time-dependent etching is seen for Si, likely based on a lower physical sputtering energy threshold. A fluorinated, oxidized surface layer is present during ALE of Si and greatly influences the etch behavior. A reaction of the precursor with the fluorinated substrate upon precursor injection was observed and characterized. The cyclic ALE approach is transferred to a manufacturing scale reactor at IBM Research. Ensuring the transferability to industrial device patterning is crucial for the application of ALE. In addition to device patterning, the cyclic ALE process is employed for oxide removal from Si and SiGe surfaces with the goal of minimal substrate damage and surface residues. The ALE process developed for SiO2 and Si etching did not remove native oxide at the level required. Optimizing the process enabled strong O removal from the surface. Subsequent 90% H2/Ar plasma allow for removal of C and F residues.