视觉伺服分类及其动态过程

对视觉伺服进行了综述性的介绍,系统地介绍了机器人视觉伺服控制的发展历史以及现状·从控制模型给出了视觉伺服控制系统的分类·针对两种最基本的分类方式基于位置的视觉伺服和基于图像的视觉伺服进行了重点介绍·对于视觉系统和图像特征的选取问题进行了讨论,此外还对视觉伺服系统的动态过程进行了分析,指出视觉系统的延时是目前伺服控制的研究所面临的最大问题·对未来视觉伺服研究的方向进行了总结·

基于输入和机械手扰动补偿的水下机器人控制实验研究

以搭建的自治水下机器人-机械手系统为对象,通过水池实验分析了载体分系统的响应特性。针对传统的反馈控制在载体控制中的不足,将输入补偿项和机械手扰动补偿项作为载体控制的前馈项,设计了水下机器人复合校正控制器。水池实验验证了方法的可行性和有效性。

一种基于知识的自然景物解释

利用我们研制成的基于知识的区域分析系统,我们对自然景物图象做了分析、解释。本文介绍:(1)图象初始分割;(2)图象特征提取;(3)规则集构造。这里,图象初始分割采用的是模糊域方法,它基于Fuzzy C-means 算法,并在此基础上修改了收敛准则,增加了迭代分割功能。图象特征分为主持征及从特征,它们建立在层次化的区域数据结构上。适合于区域分析的规则集已包括三类规则,它们不仅具有较强的知识表示能力,而且易于控制及利用。本文介绍针对包括天空、道路、树木、建筑物等物体的简单景物图象所做的解释实验,并给出了实验结果.

不同基板预热温度对激光金属沉积成形过程温度场的影响

为降低成形过程的热应力,抑制成形过程裂缝的产生,减小成形过程试样和基板的翘曲变形,激光金属沉积成形往往需要进行基板预热,因此研究不同基板预热温度对激光金属沉积成形过程温度场的影响具有非常重要的意义.根据有限元分析中的"单元生死"技术,利用APDL编程建立了基板预热对激光金属沉积成形过程温度场影响的三维多道多层数值模拟模型,详细分析了基板未预热和分别预热到200,300,400,500,600℃时对沉积成形过程温度场和温度梯度的影响.通过中国科学院沈阳自动化研究所自行研制的激光金属沉积成形系统和基板预热系统,在与模拟过程相同的参数下,利用镍基合金粉末在基板未预热和分别预热到300,400,500,560℃时进行了成形试验,试验结果跟数值模拟结果吻合较好.

基板预热对激光金属沉积成形过程热应力的影响

为降低沉积过程的热应力,抑制成形过程中裂缝的产生,研究基板预热对激光金属沉积成形(Laser metal deposition shaping,LMDS)过程热应力的影响具有非常重要的意义。根据有限元分析中的"单元生死"思想,利用APDL(ANSYS parametric design language)编程建立多道多层激光金属沉积成形过程的数值模拟模型,深入探讨基板未预热和预热到400℃时对成形过程热应力的影响。计算结果表明,基板预热到400℃可以显著降低成形过程中试样的热应力变化波动性,试样的Von Mises热应力最大值可降低10%左右,其中x方向热应力最大值可降低8.5%左右,z方向热应力最大值可降低8.1%左右。在与模拟过程相同的条件下,利用自行研制的激光金属沉积成形设备进行了成形试验,成形试验的结果与模拟结果基本吻合。

不同基板预热温度对激光金属沉积成形过程热应力影响的研究

研究不同基板预热温度对激光金属沉积成形过程热应力的影响,对于降低成形过程的热应力,抑制成形过程裂缝的产生,减小成形过程试样和基板的翘曲变形具有非常重要的意义。根据有限元分析中的"单元生死"技术,编程建立了基板预热对激光金属沉积成形过程热应力影响的三维多道多层数值模拟模型,详细分析了基板未预热和分别预热到200℃、300℃、400℃、500℃、600℃时对沉积成形过程VonMise’s热应力、X方向、Y方向以及Z方向热应力的影响。在与模拟过程相同的参数下,利用镍基合金粉末分别在基板未预热和分别预热到300℃、400℃、500℃、600℃时进行了成形试验,试验的结果跟数值模拟结果吻合较好。

Rotational splitting of helioseismic modes influenced by a magnetic atmosphere

Pint?r, B.; New, R.; Erd?lyi, R., (2001) 'Rotational splitting of helioseismic modes influenced by a magnetic atmosphere', Astronomy and Astrophysics 378 pp.1-4 RAE2008

Modal Matching for Correspondence and Recognition

Modal matching is a new method for establishing correspondences and computing canonical descriptions. The method is based on the idea of describing objects in terms of generalized symmetries, as defined by each object's eigenmodes. The resulting modal description is used for object recognition and categorization, where shape similarities are expressed as the amounts of modal deformation energy needed to align the two objects. In general, modes provide a global-to-local ordering of shape deformation and thus allow for selecting which types of deformations are used in object alignment and comparison. In contrast to previous techniques, which required correspondence to be computed with an initial or prototype shape, modal matching utilizes a new type of finite element formulation that allows for an object's eigenmodes to be computed directly from available image information. This improved formulation provides greater generality and accuracy, and is applicable to data of any dimensionality. Correspondence results with 2-D contour and point feature data are shown, and recognition experiments with 2-D images of hand tools and airplanes are described.

Integrated magnetic components for high-power high-current dc-dc converters

This thesis is focused on the design and development of an integrated magnetic (IM) structure for use in high-power high-current power converters employed in renewable energy applications. These applications require low-cost, high efficiency and high-power density magnetic components and the use of IM structures can help achieve this goal. A novel CCTT-core split-winding integrated magnetic (CCTT IM) is presented in this thesis. This IM is optimized for use in high-power dc-dc converters. The CCTT IM design is an evolution of the traditional EE-core integrated magnetic (EE IM). The CCTT IM structure uses a split-winding configuration allowing for the reduction of external leakage inductance, which is a problem for many traditional IM designs, such as the EE IM. Magnetic poles are incorporated to help shape and contain the leakage flux within the core window. These magnetic poles have the added benefit of minimizing the winding power loss due to the airgap fringing flux as they shape the fringing flux away from the split-windings. A CCTT IM reluctance model is developed which uses fringing equations to accurately predict the most probable regions of fringing flux around the pole and winding sections of the device. This helps in the development of a more accurate model as it predicts the dc and ac inductance of the component. A CCTT IM design algorithm is developed which relies heavily on the reluctance model of the CCTT IM. The design algorithm is implemented using the mathematical software tool Mathematica. This algorithm is modular in structure and allows for the quick and easy design and prototyping of the CCTT IM. The algorithm allows for the investigation of the CCTT IM boxed volume with the variation of input current ripple, for different power ranges, magnetic materials and frequencies. A high-power 72 kW CCTT IM prototype is designed and developed for use in an automotive fuelcell-based drivetrain. The CCTT IM design algorithm is initially used to design the component while 3D and 2D finite element analysis (FEA) software is used to optimize the design. Low-cost and low-power loss ferrite 3C92 is used for its construction, and when combined with a low number of turns results in a very efficient design. A paper analysis is undertaken which compares the performance of the high-power CCTT IM design with that of two discrete inductors used in a two-phase (2L) interleaved converter. The 2L option consists of two discrete inductors constructed from high dc-bias material. Both topologies are designed for the same worst-case phase current ripple conditions and this ensures a like-for-like comparison. The comparison indicates that the total magnetic component boxed volume of both converters is similar while the CCTT IM has significantly lower power loss. Experimental results for the 72 kW, (155 V dc, 465 A dc input, 420 V dc output) prototype validate the CCTT IM concept where the component is shown to be 99.7 % efficient. The high-power experimental testing was conducted at General Motors advanced technology center in Torrence, Los Angeles. Calorific testing was used to determine the power loss in the CCTT IM component. Experimental 3.8 kW results and a 3.8 kW prototype compare and contrast the ferrite CCTT IM and high dc-bias 2L concepts over the typical operating range of a fuelcell under like-for-like conditions. The CCTT IM is shown to perform better than the 2L option over the entire power range. An 8 kW ferrite CCTT IM prototype is developed for use in photovoltaic (PV) applications. The CCTT IM is used in a boost pre-regulator as part of the PV power stage. The CCTT IM is compared with an industry standard 2L converter consisting of two discrete ferrite toroidal inductors. The magnetic components are compared for the same worst-case phase current ripple and the experimental testing is conducted over the operation of a PV panel. The prototype CCTT IM allows for a 50 % reduction in total boxed volume and mass in comparison to the baseline 2L option, while showing increased efficiency.

The influence of thermal plasma profiles on low-frequency Alfvén eigenmode dynamics in a tokamak

The confinement of fast particles, present in a tokamak plasma as nuclear fusion products and through external heating, will be essential for any future fusion reactor. Fast particles can be expelled from the plasma through their interaction with Alfvén eigenmode (AE) instabilities. AEs can exist in gaps in the Alfvén continuum created by plasma equilibrium non-uniformities. In the ASDEX Upgrade tokamak, low-frequency modes in the frequency range from f ≈ 10 − 90kHz, including beta-induced Alfvén eigenmodes (BAEs) and lower frequency modes with mixed Alfvén and acoustic polarisations, have been observed. These exist in gaps in the Alfvén continuum opened up by geodesic curvature and finite plasma compressibility. In this thesis, a kinetic dispersion relation is solved numerically to investigate the influence of thermal plasma profiles on the evolution of these low-frequency modes during the sawtooth cycle. Using information gained from various experimental sources to constrain the equilibrium reconstructions, realistic safety factor profiles are obtained for the analysis using the CLISTE code. The results for the continuum accumulation point evolution are then compared with experimental results from ASDEX Upgrade during periods of ICRH only as well as for periods with both ICRH and ECRH applied simultaneously. It is found that the diamagnetic frequency plays an important role in influencing the dynamics of BAEs and low-frequency acoustic Alfvén eigenmodes, primarily through the presence of gradients in the thermal plasma profiles. Different types of modes that are observed during discharges heated almost exclusively by ECRH were also investigated. These include electron internal transport barrier (eITB) driven modes, which are observed to coincide with the occurrence of an eITB in the plasma during the low-density phase of the discharge. Also observed are BAE-like modes and edge-TAEs, both of which occur during the H-mode phase of the discharge.

Computational modelling of multi-physics processes on high performance parallel computer systems

The demands of the process of engineering design, particularly for structural integrity, have exploited computational modelling techniques and software tools for decades. Frequently, the shape of structural components or assemblies is determined to optimise the flow distribution or heat transfer characteristics, and to ensure that the structural performance in service is adequate. From the perspective of computational modelling these activities are typically separated into: • fluid flow and the associated heat transfer analysis (possibly with chemical reactions), based upon Computational Fluid Dynamics (CFD) technology • structural analysis again possibly with heat transfer, based upon finite element analysis (FEA) techniques.

Multi-physics-multi-scale simulation and optimisation: the next generation

FEA and CFD analysis is becoming ever more complex with an emerging demand for simulation software technologies that can address ranges of problems that involve combinations of interactions amongst varying physical phenomena over a variety of time and length scales. Computation modelling of such problems requires software technologies that enable the representation of these complex suites of 'physical' interactions. This functionality requires the structuring of simulation modules for specific physical phemonmena so that the coupling can be effectiely represented. These 'multi-physics' and 'multi-scale' computations are very compute intensive and so the simulation software must operate effectively in parallel if it is to be used in this context. Of course the objective of 'multi-physics' and 'multi-scale' simulation is the optimal design of engineered systems so optimistation is an important feature of such classes of simulation. In this presentation, a multi-disciplinary approach to simulation based optimisation is described with some key examples of application to challenging engineering problems.

Response Surface Modeling and Optimisation for Reliable Electronic Products

The aim of integrating computational mechanics (FEA and CFD) and optimization tools is to speed up dramatically the design process in different application areas concerning reliability in electronic packaging. Design engineers in the electronics manufacturing sector may use these tools to predict key design parameters and configurations (i.e. material properties, product dimensions, design at PCB level. etc) that will guarantee the required product performance. In this paper a modeling strategy coupling computational mechanics techniques with numerical optimization is presented and demonstrated with two problems. The integrated modeling framework is obtained by coupling the multi-physics analysis tool PHYSICA - with the numerical optimization package - Visua/DOC into a fuJly automated design tool for applications in electronic packaging. Thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and life-time under thermal cycling. Also a thermal management design based on multi-physics analysis with coupled thermal-flow-stress modeling is discussed. The Response Surface Modeling Approach in conjunction with Design of Experiments statistical tools is demonstrated and used subsequently by the numerical optimization techniques as a part of this modeling framework. Predictions for reliable electronic assemblies are achieved in an efficient and systematic manner.

Study of Anisotropic Conductive Adhesive Joint Behaviour under 3-Point Bending

Flip chip interconnections using anisotropic conductive film (ACF) are now a very attractive technique for electronic packaging assembly. Although ACF is environmentally friendly, many factors may influence the reliability of the final ACF joint. External mechanical loading is one of these factors. Finite element analysis (FEA) was carried out to understand the effect of mechanical loading on the ACF joint. A 3-dimensional model of adhesively bonded flip chip assembly was built and simulations were performed for the 3-point bending test. The results show that the stress at its highest value at the corners, where the chip and ACF were connected together. The ACF thickness was increased at these corner regions. It was found that higher mechanical loading results in higher stress that causes a greater gap between the chip and the substrate at the corner position. Experimental work was also carried out to study the electrical reliability of the ACF joint with the applied bending load. As per the prediction from FEA, it was found that at first the corner joint failed. Successive open joints from the corner towards the middle were also noticed with the increase of the applied load.

Decision support systems for eco-friendly electronic products

This paper discusses an optimisation based decision support system and methodology for electronic packaging and product design and development which is capable of addressing in efficient manner specified environmental, reliability and cost requirements. A study which focuses on the design of a flip-chip package is presented. Different alternatives for the design of the flip-chip package are considered based on existing options for the applied underfill and volume of solder material used to form the interconnects. Variations in these design input parameters have simultaneous effect on package aspects such as cost, environmental impact and reliability. A decision system for the design of the flip-chip that uses numerical optimisation approach is used to identify the package optimal specification which satisfies the imposed requirements. The reliability aspect of interest is the fatigue of solder joints under thermal cycling. Transient nonlinear finite element analysis (FEA) is used to simulate the thermal fatigue damage in solder joints subject to thermal cycling. Simulation results are manipulated within design of experiments and response surface modelling framework to provide numerical model for reliability which can be used to quantify the package reliability. Assessment of the environmental impact of the package materials is performed by using so called Toxic Index (TI). In this paper we demonstrate the evaluation of the environmental impact only for underfill and lead-free solder materials. This evaluation is based on the amount of material per flip-chip package. Cost is the dominant factor in contemporary flip-chip packaging industry. In the optimisation based decision support system for the design of the flip-chip package, cost of materials which varies as a result of variations in the design parameters is considered.