Polishable amperometric hydrogen peroxide sensor based on sol-gel-derived conductive composite containing vanadium-17-molybdodiphosphate

A new kind of conductive vanadium-17-molybdodiphosphate/graphite/methylsilicate composite was firstly prepared by the sol-gel technique and used as electrode material for the fabrication of amperometric hydrogen peroxide sensor. The remarkable advantage of the sensor is its excellent reproducibility of surface renewal by simple mechanical polishing.

Morphology of conductive blend fibers of polyaniline and polyamide-11

Polyaniline (PANI), a member of the intrinsically conducting polymer (ICPs) family, was blended with polyamide-11 (polyco-aminoundecanoyle) in concentrated sulfuric acid. The above solution was used to spin conductive PANI/polyamide-11 fibers by wet-spinning technology. Scanning electron microscope (SEM) and transmission electron microscope (TEM) were employed to study the two-phase morphology of the conductive PANI/polyamide-11 fibers. The micrographs of the cross-section, the axial section and the surface of the monofilament demonstrated that the two blend components were incompatible. The morphology of PANI in the fibers was of fibrillar form, which was valuable for producing conducting channels. The electrical conductivity of the fibers was from 10(-6) to 10(-1) S/cm with the different PANI fraction and the percolation threshold was about 5 wt.%. By comparing the two blend systems of PANI/Polyamide-11 fibers and carbon black filled poly(ethylene terephthalate) (PET) fibers, it was shown that the morphology of the conductive component had an influence on electrical conductivity, The former had higher conductivity and lower percolation threshold than the latter. (C) 2001 Elsevier Science B.V. All rights reserved.

Conductive polyaniline/silica hybrids from sol-gel process

A hybrid material with a conductive organic network in an inorganic matrix has been prepared by in-situ hydrolysis/polycondensation of TEOS in an aqueous solution of a solubilized polyaniline. Due to intense hydrogen bonding (indicated by Si-29 NMR and FTIR) the conductive polymer is very well dispersed in the silica matrix. The Figure shows SEM images of a 46/54 wt.-% hybrid at two temperatures (left 20 degreesC, right 100 degreesC).

Conductive polyaniline poly-omega-aminoundecanoyle blending fiber

Conductive fibers were obtained by blending polyaniline with poly-omega-aminoundecanoyle in-concentrated H2SO4 Micro-fiber caused by non-compatibility between the two polymers was valuable for improving conductive property of the fibers. Abnormal effect on the crystallinity of polyaniline and poly-omega-aminoundecanoyle upon drawing stress was observed.

Characteristics of the conductive polyimide film surfaces induced by ultraviolet laser beam

A conducting layer with the conductivity of 1.2 Omega(-1)cm(-1) stripped in a solvent from KrF-laser-irradiated polyimide thin film is taken as a sample to determine the microstructure of the conducting layer. Fourier-transform infrared and X-ray photoelectron spectroscopies show the formation of the carbon-rich clusters after irradiation. The element analysis gives the atomic ratio of C:H:N:O for the carbon-rich cluster as 60:20:3:1. Wide-angle X-ray diffraction indicates that the conducting layer is mainly amorphous carbon with a small amount of the short-range ordered carbon-rich clusters. This study suggests a structural model with three-layer carbon sheets linked together in a random fashion for the short-range ordered carbon-rich clusters. The interplanar spacing is 3.87 Angstrom and the layer diameter 25 Angstrom. The transport model of variable-range hopping in three dimensions is used to explain the conducting behavior of the conducting layer. In our case, the short-range ordered carbon-rich clusters are assumed to be conducting islands dispersed in the amorphous carbon-rich cluster matrix.

Thermal, mechanical and ionic conductive behaviour of gamma-radiation induced PEO/PVDF(SIN)-LiClO4 polymer electrolyte system

An effort has been made to modify the mechanical behaviour of our previously reported gel-type gamma-radiation crosslinked polyethylene oxide (PEO)-LiClO4 polymer electrolyte. A highly polar and gamma-radiation crosslinkable crystalline polymer, polyvinylidene fluoride (PVDF), was selected to blend with PEO and then subjected to gamma-irradiation in order to make an simultaneous interpenetrating network (SIN), which was used as a polymer host to impart stiffness to the plasticized system. Experimental results have shown that the presence of PVDF in the system, through gamma-radiation induced SIN formation, could not only give a rather high mechanical modulus of 10(7) Pa at ambient temperature, but also maintain the room temperature ionic conductivity at a high level (greater than 10(-4) S/cm). DSC, DMA and conductivity measurement techniques were used to examine the effects of blending, gamma-irradiation and plasticization on the variations of glass transition and melting endotherm, on the appearance of high elastic plateau and on the temperature dependence of ionic conductivity: In addition, it was found that, in contrast with the unplasticized system, the ionic conductivity mechanism of this gel-type electrolyte seems to conform to the Arrhenius model, suggesting that, as a result of the high degree of plasticization, the polymer chains act mainly as the skeleton of the networks or polymer cages to immobilize the liquid electrolyte solution, whereas the ionic species migrate as if they were in a liquid medium. (C) 1997 Elsevier Science Ltd.

SCANNING-TUNNELING-MICROSCOPY (STM) AND LATERAL FORCE MICROSCOPY (LFM) INVESTIGATION OF THE STRUCTURE AND CHARACTER OF CONDUCTIVE POLYPYRROLE FILM

Polypyrrole doped with p-toluenesulfonate was electropolymerized onto highly oriented pyrolytic graphite (HOPG), glassy carbon (GC) and Pt electrode surfaces under the same experimental conditions. The resulting films were studied by scanning tunneling m

INSITU CONDUCTIVITY ELECTROCHEMISTRY OF CONDUCTIVE POLYMERS - POLY(3-METHYLTHIOPHENE) AND POLYTHIOPHENE

In situ monitoring of conductivity and potential response of conductive polymers during electrochemical process had been described. A renewable carbon fibre array ring-glassy carbon disk electrode was used for this purpose. Poly(3-methylthiophene) and polythiophene were investigated with this method, and some 5 orders in magnitude of conductivity changes were observed during the electrochemical redox process.

Conductive junctions with parallel graphene sheets.

The establishment of conductive graphene-molecule-graphene junction is investigated through first-principles electronic structure calculations and quantum transport calculations. The junction consists of a conjugated molecule connecting two parallel graphene sheets. The effects of molecular electronic states, structure relaxation, and molecule-graphene contact on the conductance of the junction are explored. A conductance as large as 0.38 conductance quantum is found achievable with an appropriately oriented dithiophene bridge. This work elucidates the designing principles of promising nanoelectronic devices based on conductive graphene-molecule-graphene junctions.

Mapping 2-D defects in a conductive half-space by eigenfunction expansions in K-space of Fourier-Laplace transforms

info:eu-repo/semantics/published

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications

The work presented in this paper focuses on the effect of reflow process on the contact resistance and reliability of anisotropic conductive film (ACF) interconnection. The contact resistance of ACF interconnection increases after reflow process due to the decrease in contact area of the conducting particles between the mating I/O pads. However, the relationship between the contact resistance and bonding parameters of the ACF interconnection with reflow treatment follows the similar trend to that of the as-bonded (i.e. without reflow) ACF interconnection. The contact resistance increases as the peak temperature of reflow profile increases. Nearly 40% of the joints were found to be open after reflow with 260 °C peak temperature. During the reflow process, the entrapped (between the chip and substrate) adhesive matrix tries to expand much more than the tiny conductive particles because of the higher coefficient of thermal expansion, the induced thermal stress will try to lift the bump from the pad and decrease the contact area of the conductive path and eventually, leading to a complete loss of electrical contact. In addition, the environmental effect on contact resistance such as high temperature/humidity aging test was also investigated. Compared with the ACF interconnections with Ni/Au bump, higher thermal stress in the Z-direction is accumulated in the ACF interconnections with Au bump during the reflow process owing to the higher bump height, thus greater loss of contact area between the particles and I/O pads leads to an increase of contact resistance and poorer reliability after reflow.

Experimental and modeling analysis of the reliability of the anisotropic conductive films

Experiments as well as computer modeling methods have been used to investigate the effect of the solder reflow process on the electrical characteristics and reliability of anisotropic conductive film (ACF) interconnections. In the experiments, the contact resistance of the ACF interconnections was found to increase after a subsequent reflow and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. In fact, nearly 40 percent of the joints were opened (i.e. lifted away from the pad) after the reflow with a peak temperature of 260 OC while no openings was observed when the peak temperature was 210 "C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. To understand this phenomenon better, a 3-D model of an ACF joint structure was built and Finite Element Analysis was used to predict the stress distrihution in the conductive particles, adhesive matrix and metal pads during the reflow process. The effects of the peak temperature, the CTE of the adhesive matrix and the bump height on the reliability of the ACF interconnections were discussed.

Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives

In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. Nearly 40% of the joints were opened (i.e. lifted away from the pad) after the reflow process with 260 °C peak temperature while no opening was observed when the peak temperature was 210 °C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. It was also found that the ACF joints after the reflow process with 210 °C peak temperature showed a high ability to resist water absorption under steady state 85 °C/85%RH conditions, probably because the curing degree of the ACF was improved during the reflow process. To give a good understanding, a 3D model of an ACF joint structure was built and finite element analysis was used to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process.

Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

This paper discusses results from a highly interdisciplinary research project which investigated different packaging options for ultra-fine pitch, low temperature and low cost flip-chip assembly. Isotropic Conductive Adhesives (ICAs) are stencil printed to form the interconnects for the package. ICAs are utilized to ensure a low temperature assembly process of flip-chip copper column bumped packages. Results are presented on the structural integrity of novel electroformed stencils. ICA deposits at sub-100 micron pitch and the subsequent thermo-mechanical behaviour of the flip-chip ICA joints are analysed using numerical modelling techniques. Optimal design rules for enhanced performance and thermomechanical reliability of ICA assembled flip-chip packages are formulated.

Microwave cure of conductive adhesives for flip-chip & microsystems applications

The curing of conductive adhesives and underfills can save considerable time and offer cost benefits for the microsystems and electronics packaging industry. In contrast to conventional ovens, curing by microwave energy generates heat internally within each individual component of an assembly. The rate at which heat is generated is different for each of the components and depends on the material properties as well as the oven power and frequency. This leads to a very complex and transient thermal state, which is extremely difficult to measure experimentally. Conductive adhesives need to be raised to a minimum temperature to initiate the cross-linking of the resin polymers, whilst some advanced packaging materials currently under investigation impose a maximum temperature constraint to avoid damage. Thermal imagery equipment integrated with the microwave oven can offer some information on the thermal state but such data is based on the surface temperatures. This paper describes computational models that can simulate the internal temperatures within each component of an assembly including the critical region between the chip and substrate. The results obtained demonstrate that due to the small mass of adhesive used in the joints, the temperatures reached are highly dependent on the material properties of the adjacent chip and substrate.