Mechanical behavior of 2G REBCO HTS at 77 and 300 K

El gran esfuerzo realizado durante la última década con el fin de integrar los diferentes materiales superconductores en el campo de los sistemas eléctricos y en otras aplicaciones tecnológicas ha dado lugar a un campo de investigación amplio y prometedor. El comportamiento eléctrico de los Superconductores de Alta Temperatura (SAT) crítica (masivo y cintas) depende de diferentes parámetros desde su fabricación hasta la aplicación final con imanes o cables. Sin embargo, las aplicaciones prácticas de estos materiales están fuertemente vinculadas con su comportamiento mecánico tanto a temperatura ambiente (manipulación durante fabricación o instalación) como a temperaturas criogénicas (condiciones de servicio). En esta tesis se ha estudiado el comportamiento mecánico de materiales masivos y cintas de alta temperatura crítica a 300 y 77 K (utilizando nitrógeno líquido). Se han obtenido la resistencia en flexión, la tenacidad de fractura y la resistencia a tracción a la temperatura de servicio y a 300 K. Adicionalmente, se ha medido la dureza mediante el ensayo Vickers y nanoindentación. El módulo Young se midió mediante tres métodos diferentes: 1) nanoindentación, 2) ensayos de flexión en tres puntos y 3) resonancia vibracional mediante grindosonic. Para cada condición de ensayo, se han analizado detalladamente las superficies de fractura y los micromecanismos de fallo. Las propiedades mecánicas de los materiales se han comparado con el fin de entender la influencia de las técnicas de procesado y de las características microestructurales de los monocristales en su comportamiento mecánico. Se ha estudiado el comportamiento electromecánico de cintas comerciales superconductoras de YBCO mediante ensayos de tracción y fatiga a 77 y 300 K. El campo completo de deformaciones en la superficie del material se ha obtenido utilizando Correlación Digital de Imágenes (DIC, por sus siglas en inglés) a 300 K. Además, se realizaron ensayos de fragmentación in situ dentro de un microscopio electrónico con el fin de estudiar la fractura de la capa superconductora y determinar la resistencia a cortante de la intercara entre el substrato y la capa cerámica. Se ha conseguido ver el proceso de la fragmentación aplicando tensión axial y finalmente, se han implementado simulaciones mediante elementos finitos para reproducir la delaminación y el fenómeno de la fragmentación. Por último, se han preparado uniones soldadas entre las capas de cobre de dos cintas superconductoras. Se ha medido la resistencia eléctrica de las uniones con el fin de evaluar el metal de soldadura y el proceso. Asimismo, se ha llevado a cabo la caracterización mecánica de las uniones mediante ensayos "single lap shear" a 300 y 77 K. El efecto del campo magnético se ha estudiado aplicando campo externo hasta 1 T perpendicular o paralelo a la cinta-unión a la temperatura de servicio (77 K). Finalmente, la distribución de tensiones en cada una de las capas de la cinta se estudió mediante simulaciones de elementos finitos, teniendo en cuenta las capas de la cinta mecánicamente más representativas (Cu-Hastelloy-Cu) que influyen en su comportamiento mecánico. The strong effort that has been made in the last years to integrate the different superconducting materials in the field of electrical power systems and other technological applications led to a wide and promising research field. The electrical behavior of High Temperature Superconducting (HTS) materials (bulk and coated conductors) depends on different parameters since their processing until their final application as magnets or cables. However, practical applications of such materials are strongly related with their mechanical performance at room temperature (handling) as well as at cryogenic temperatures (service conditions). In this thesis, the mechanical behavior of HTS bulk and coated conductors was investigated at 300 and 77 K (by immersion in liquid nitrogen). The flexural strength, the fracture toughness and the tensile strength were obtained at service temperature as well as at 300 K. Furthermore, their hardness was determined by Vickers measurements and nanoindentation and the Young's modulus was measured by three different techniques: 1) nanoindentation, 2) three-point bending tests and 3) vibrational resonance with a grindosonic device. The fracture and deformation micromechanics have been also carefully analyzed for each testing condition. The comparison between the studied materials has been performed in order to understand the influence of the main sintering methods and the microstructural characteristics of the single grains on the macroscopic mechanical behavior. The electromechanical behavior of commercial YBCO coated conductors was studied. The mechanical behavior of the tapes was studied under tensile and fatigue tests at 77 and 300 K. The complete strain field on the surface of the sample was obtained by applying Digital Image Correlation (DIC) at 300 K. Addionally, in situ fragmentation tests inside a Scanning Electron Microscope (SEM) were carried out in order to study the fragmentation of the superconducting layer and determine the interfacial shear strength between substrate and ceramic layer. The fragmentation process upon loading of the YBCO layer has been observed and finally, Finite Element Simulations were employed to reproduce delamination and fragmentation phenomena. Finally, joints between the stabilizing Cu sides of two coated conductors have been prepared. The electrical resistivity of the joints was measured for the purpose of qualifying the soldering material and evaluating the soldering process. Additionally, mechanical characterization under single lap shear tests at 300 and 77 K has been carried out. The effect of the applied magnetic field has been studied by applying external magnetic field up to 1 T perpendicular and parallel to the tape-joint at service temperature (77 K). Finally, finite element simulations were employed to study the distribution of the stresses in earch layer, taking into account the three mechanically relevant layers of the coated conductor (Cu-Hastelloy-Cu) that affect its mechanical behavior

Hawkins electrical guide. Questions, answers & illustrations; a progressive course of study for engineers, electricians, students and those desiring to acquire a working knowledge of electricity and its applications; a practical treatise,

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Morphological features of interfacial intermetallics and interfacial reaction rate in Al-11Si-2.5Cu-(0.15/0.60)Fe cast alloy/die steel couples

Soldering reactions are commonly observed during high pressure die casting of aluminium alloys, and involve the formation and growth of interfacial intermetallics between the die and the cast alloy. It is generally believed that close to 1% Fe is necessary in the aluminium alloy to reduce soldering. However, the role of iron in the interfacial reaction has not been studied in detail. In this investigation, reaction couples were formed between H13 tool steel substrates and an Al-11Si-2.5Cu melt containing either 0.15 or 0.60% Fe. Examination revealed distinctly different intermetallic layer morphology. The overall growth and chemistry of the reaction layer and the reaction rate measured by the consumption of the substrate were compared for the two alloy melts. It was demonstrated that a higher iron content reduces the rate of interfacial reaction, consistent with an observed thicker compact ( solid) intermetallic layer. Hence, the difference in reaction rate can be explained by a significant reduction in the diffusion flux due to a thicker compact layer. Finally, the mechanism of the growth of a thicker compact layer in the higher iron melt is proposed, based on the phase relations and diffusion both within and near the interfacial reaction zone. (C) 2004 Kluwer Academic Publishers.

Microstructure control in Sn-0.7mass%Cu alloys

Soldering alloys based oft the Sn-Cu alloy system are amongst the most favourable lead-free alternatives due to a range of attractive properties. Trace additions of Ni have been found to significantly improve the soldering characteristics of these alloys (reduced bridging etc.). This paper examines the mechanisms underlying the improvement in soldering properties of Sn-0.7 mass%Cu eutectic alloys modified with concentrations of Ni ranging front 0 to 1000 ppm. The alloys were investigated by thermal analysis during solidification, as well as optical/SEM microanalyses of fully solidified samples anti samples quenched during solidification. It is concluded that Ni additions dramatically alter the nucleation patterns and solidification behaviour of the Sn-Cu6Sn5 eutectic anti that these changes are related to the superior soldering characteristics of the Ni-modified Sn-0.7 mass%Cu alloys.

Multiobjective design optimization of IGBT power modules considering power cycling and thermal cycling

Insulated-gate bipolar transistor (IGBT) power modules find widespread use in numerous power conversion applications where their reliability is of significant concern. Standard IGBT modules are fabricated for general-purpose applications while little has been designed for bespoke applications. However, conventional design of IGBTs can be improved by the multiobjective optimization technique. This paper proposes a novel design method to consider die-attachment solder failures induced by short power cycling and baseplate solder fatigue induced by the thermal cycling which are among major failure mechanisms of IGBTs. Thermal resistance is calculated analytically and the plastic work design is obtained with a high-fidelity finite-element model, which has been validated experimentally. The objective of minimizing the plastic work and constrain functions is formulated by the surrogate model. The nondominated sorting genetic algorithm-II is used to search for the Pareto-optimal solutions and the best design. The result of this combination generates an effective approach to optimize the physical structure of power electronic modules, taking account of historical environmental and operational conditions in the field.

Multiphysics modelling of solder joint formation

Abstract not available

DEVELOPMENT OF AN OFF-LINE RAINFLOW COUNTING ALGORITHM WITH TEMPORAL PARAMETERS AND DATA REDUCTION

Rainflow counting methods convert a complex load time history into a set of load reversals for use in fatigue damage modeling. Rainflow counting methods were originally developed to assess fatigue damage associated with mechanical cycling where creep of the material under load was not considered to be a significant contributor to failure. However, creep is a significant factor in some cyclic loading cases such as solder interconnects under temperature cycling. In this case, fatigue life models require the dwell time to account for stress relaxation and creep. This study develops a new version of the multi-parameter rainflow counting algorithm that provides a range-based dwell time estimation for use with time-dependent fatigue damage models. To show the applicability, the method is used to calculate the life of solder joints under a complex thermal cycling regime and is verified by experimental testing. An additional algorithm is developed in this study to provide data reduction in the results of the rainflow counting. This algorithm uses a damage model and a statistical test to determine which of the resultant cycles are statistically insignificant to a given confidence level. This makes the resulting data file to be smaller, and for a simplified load history to be reconstructed.