984 resultados para CUBIC SILICON-CARBIDE


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Large size bulk silicon carbide (SiC) crystals are commonly grown by the physical vapor transport (PVT) method. The PVT growth of SiC crystals involves sublimation and condensation, chemical reactions, stoichiometry, mass transport, induced thermal stress, as well as defect and micropipes generation and propagation. The quality and polytype of as-grown SiC crystals are related to the temperature distribution inside the growth chamber during the growth process, it is critical to predict the temperature distribution from the measured temperatures outside the crucible by pyrometers. A radio-frequency induction-heating furnace was used for the growth of large-size SiC crystals by the PVT method in the present study. Modeling and simulation have been used to develop the SiC growth process and to improve the SiC crystal quality. Parameters such as the temperature measured at the top of crucible, temperature measured at the bottom of the crucible, and inert gas pressure are used to control the SiC growth process. By measuring the temperatures at the top and bottom of the crucible, the temperatures inside the crucible were predicted with the help of modeling tool. SiC crystals of 6H polytype were obtained and characterized by the Raman scattering spectroscopy and SEM, and crystals of few millimeter size grown inside the crucible were found without micropipes. Expansion of the crystals were also performed with the help of modeling and simulation.

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Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

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Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

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O propósito do presente estudo foi analisar o efeito da aplicação de múltiplas camadas consecutivas de dois sistemas adesivos convencionais de dois passos na difusão resinosa e padrão de distribuição dos componentes monoméricos resinosos. Dezesseis terceiros molares humanos hígidos foram tratados com os sistemas adesivos convencionais de dois passos de acordo com as instruções dos fabricantes ou com aplicações em múltiplas camadas consecutivas. Os espécimes foram seccionados paralelamente aos túbulos dentinários e as superfícies submetidas ao polimento com lixas 600, 1200, 1800, 2000 e 4000. Os espectros Raman foram coletados ao longo de uma linha perpendicular a interface adesivo-resina em intervalos de 1 ou 2 m. As medidas de difusão da resina adesiva e distribuição dos componentes monomériccos foram avaliadas pelos picos Raman de 1113 cm-1, 1609 cm-1 e 1454 cm-1. O gradiente de desmineralização usado na determinação da região de hibridização foi avaliado pelo pico de 960 cm-1 da apatita. De acordo com os resultados obtidos, a aplicação de múltiplas camadas apresentou uma tendência de homogeneização dos componentes poliméricos, dependente da composição química da resina adesiva.