Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]

The deployment of OECBs (opto-electrical circuit boards) is expected to make a significant impact in the telecomm switches arena within the next five years. This will create optical backplanes with high speed point-to-point optical interconnects. The crucial aspect in the manufacturing process of the optical backplane is the successful coupling between VCSEL (vertical cavity surface emitting laser) device and embedded waveguide in the OECB. The results from a thermo-mechanical analysis are being used in a purely optical model, which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the modelling are being investigated using DOE analysis to identify packaging parameters that minimise misalignment. This is achieved via a specialist optimisation software package. Results from the thermomechanical and optical models are discussed as are experimental results from the DOE.

The global atmospheric electrical circuit and climate

Evidence is emerging for physical links among clouds, global temperatures, the global atmospheric electrical circuit and cosmic ray ionisation. The global circuit extends throughout the atmosphere from the planetary surface to the lower layers of the ionosphere. Cosmic rays are the principal source of atmospheric ions away from the continental boundary layer: the ions formed permit a vertical conduction current to flow in the fair weather part of the global circuit. Through the (inverse) solar modulation of cosmic rays, the resulting columnar ionisation changes may allow the global circuit to convey a solar influence to meteorological phenomena of the lower atmosphere. Electrical effects on non-thunderstorm clouds have been proposed to occur via the ion-assisted formation of ultra-fine aerosol, which can grow to sizes able to act as cloud condensation nuclei, or through the increased ice nucleation capability of charged aerosols. Even small atmospheric electrical modulations on the aerosol size distribution can affect cloud properties and modify the radiative balance of the atmosphere, through changes communicated globally by the atmospheric electrical circuit. Despite a long history of work in related areas of geophysics, the direct and inverse relationships between the global circuit and global climate remain largely quantitatively unexplored. From reviewing atmospheric electrical measurements made over two centuries and possible paleoclimate proxies, global atmospheric electrical circuit variability should be expected on many timescales

A simplified method for determining the high frequency induction motor equivalent electrical circuit parameters to be used in EMI effect

The aim of this paper is to present a simple method for determining the high frequency parameters of a three-phase induction motor to be used in studies involving variable speed drives with PWM three-phase inverters, in which it is necessary to check the effects caused to the motor by the electromagnetic interference, (EMI) in the differential mode, as well as in the common mode. The motor parameters determination is generally performed in adequate laboratories using accurate instruments, such as very expensive RLC bridges. The method proposed here consists in the identification of the motor equivalent electrical circuit parameters in rated frequency and in high frequency through characteristic tests in the laboratory, together with the use of characteristic equations and curves, shown in the references to be mentioned for determining the motor high frequency parasite capacitances and also through system simulations using dedicated software, like Pspice, determining the characteristic waveforms involved in the differential and common mode phenomena, comparing and validating the procedure through published papers [01].

Organizational maintenance repair parts and special tools list for test set, electrical circuit, guided missile launcher, ANTSM97, 4935-00-878-4654, test set, electronic circuit plug-in unit, ANTSM117, 6625-01-004-8513, simulator warhead components, XM6E1, 4935-00-908-8153, test set, electrical cable interconnecting box (artillery set), 8599670-5 ... Pershing 1A Field Artillery Missile System.

Includes index.

Direct support maintenance manual, including repair parts list for test set, electrical circuit, bomb dispenser, A/E 24T-79 (NSN 4925-00-915-5735).

"March 1975."

Parallel circuit partitioning on a reduced array architecture

The physical design of a VLSI circuit involves circuit partitioning as a subtask. Typically, it is necessary to partition a large electrical circuit into several smaller circuits such that the total cross-wiring is minimized. This problem is a variant of the more general graph partitioning problem, and it is known that there does not exist a polynomial time algorithm to obtain an optimal partition. The heuristic procedure proposed by Kernighan and Lin1,2 requires O(n2 log2n) time to obtain a near-optimal two-way partition of a circuit with n modules. In the VLSI context, due to the large problem size involved, this computational requirement is unacceptably high. This paper is concerned with the hardware acceleration of the Kernighan-Lin procedure on an SIMD architecture. The proposed parallel partitioning algorithm requires O(n) processors, and has a time complexity of O(n log2n). In the proposed scheme, the reduced array architecture is employed with due considerations towards cost effectiveness and VLSI realizability of the architecture.The authors are not aware of any earlier attempts to parallelize a circuit partitioning algorithm in general or the Kernighan-Lin algorithm in particular. The use of the reduced array architecture is novel and opens up the possibilities of using this computing structure for several other applications in electronic design automation.

A Circuit Grammar For Operational Amplifier Design

Electrical circuit designers seldom create really new topologies or use old ones in a novel way. Most designs are known combinations of common configurations tailored for the particular problem at hand. In this thesis I show that much of the behavior of a designer engaged in such ordinary design can be modelled by a clearly defined computational mechanism executing a set of stylized rules. Each of my rules embodies a particular piece of the designer's knowledge. A circuit is represented as a hierarchy of abstract objects, each of which is composed of other objects. The leaves of this tree represent the physical devices from which physical circuits are fabricated. By analogy with context-free languages, a class of circuits is generated by a phrase-structure grammar of which each rule describes how one type of abstract object can be expanded into a combination of more concrete parts. Circuits are designed by first postulating an abstract object which meets the particular design requirements. This object is then expanded into a concrete circuit by successive refinement using rules of my grammar. There are in general many rules which can be used to expand a given abstract component. Analysis must be done at each level of the expansion to constrain the search to a reasonable set. Thus the rule of my circuit grammar provide constraints which allow the approximate qualitative analysis of partially instantiated circuits. Later, more careful analysis in terms of more concrete components may lead to the rejection of a line of expansion which at first looked promising. I provide special failure rules to direct the repair in this case.

Combining Functional and Structural Reasoning for Safety Analysis of Electrical Designs

C.J.Price, D.R.Pugh, N.A.Snooke, J.E.Hunt, M.S.Wilson, Combining Functional and Structural Reasoning for Safety Analysis of Electrical Designs, Knowledge Engineering Review, vol 12:3, pp.271-287, 1997.

Ambiguities and Deviations in Qualitative Circuit Analysis

Lee M.H., Bell J. and Coghill G.M., Ambiguities and Deviations in Qualitative Circuit Analysis, in Proc. QR?2001, 15th Int. Workshop on Qualitative Reasoning, San Antonio, Texas, May 2001, pp51-58.

Qualitative Circuit Models in Failure Analysis Reasoning

Lee M.H., Qualitative Circuit Models in Failure Analysis Reasoning, AI Journal. vol 111, pp239-276.1999.

Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board

Light has the greatest information carrying potential of all the perceivable interconnect mediums; consequently, optical fiber interconnects rapidly replaced copper in telecommunications networks, providing bandwidth capacity far in excess of its predecessors. As a result the modern telecommunications infrastructure has evolved into a global mesh of optical networks with VCSEL’s (Vertical Cavity Surface Emitting Lasers) dominating the short-link markets, predominately due to their low-cost. This cost benefit of VCSELs has allowed optical interconnects to again replace bandwidth limited copper as bottlenecks appear on VSR (Very Short Reach) interconnects between co-located equipment inside the CO (Central-Office). Spurred by the successful deployment in the VSR domain and in response to both intra-board backplane applications and inter-board requirements to extend the bandwidth between IC’s (Integrated Circuits), current research is migrating optical links toward board level USR (Ultra Short Reach) interconnects. Whilst reconfigurable Free Space Optical Interconnect (FSOI) are an option, they are complicated by precise line-of-sight alignment conditions hence benefits exist in developing guided wave technologies, which have been classified into three generations. First and second generation technologies are based upon optical fibers and are both capable of providing a suitable platform for intra-board applications. However, to allow component assembly, an integral requirement for inter-board applications, 3rd generation Opto-Electrical Circuit Boards (OECB’s) containing embedded waveguides are desirable. Currently, the greatest challenge preventing the deployment of OECB’s is achieving the out-of-plane coupling to SMT devices. With the most suitable low-cost platform being to integrate the optics into the OECB manufacturing process, several research avenues are being explored although none to date have demonstrated sufficient coupling performance. Once in place, the OECB assemblies will generate new reliability issues such as assembly configurations, manufacturing tolerances, and hermetic requirements that will also require development before total off-chip photonic interconnection can truly be achieved

Evidence for global circuit current flow through water droplet layers

Abstract Foggy air and clear air have appreciably different electrical conductivities. The conductivity gradient at horizontal droplet boundaries causes droplet charging, as a result of vertical current flow in the global atmospheric electrical circuit. The charging is poorly known, as both the current flow through atmospheric water droplet layers and the air conductivity are poorly characterised experimentally. Surface measurements during three days of continuous fog using new instrument techniques show that a shallow (of order 100 m deep) fog layer still permits the vertical conduction current to pass. Further, the conductivity in the fog is estimated to be approximately 20% lower than in clear air. Assuming a fog transition thickness of one metre, this implies a vertical conductivity gradient of order 10 fS m−2 at the boundary. The actual vertical conductivity gradient at a cloud boundary would probably be greater, due to the presence of larger droplets in clouds compared to fog, and cleaner, more conductive clear air aloft.

Electrical devices obtained from polymeric precursors process

Nowadays, many investments have been made in the area of superconductor materials, with the aim to improve their potential technological applications. Applications on the energy transport using cables, to get high resolution images in the medicine use high magnetic fields, high speed signals use superconductor devices all of them are in crescent evidence and they are showing that the future is coming and next for this new kind of materials. Obviously that everything of this is possible due to the increasing of research with new materials, where the synthesis, characterization and applications are of the mainly objective of these researches. The production of cable for the energy transport has been in advanced stage as the bulks production is too. However, the film production that to aim at the electronic devices area is not as developed or it still need expensive investments. Thinking about that, we are developing a research where we may increase the relation of cost/benefits. Thereby, we are applying the polymeric precursors method to obtain films that will be used in the built of electronic devices. Thin films (mono and multilayers, on crystalline or metallic substrates, controlled thickness) of the BSCCO system have been obtained from dip coating deposition process with excellent results in terms of preferential orientation, controlled thickness, a large area, which may indicate future applications. Based on these results, we present an electrical circuit and their principal characteristics as superconductor transition (85K), transport current density and structure. DC four probes method, scanning electron microscopy, digital optical microscopy and X-ray diffractometry were some techniques used for the characterization of this superconductor electric device. © 2006 Materials Research Society.