Application of particle swarm optimisation to evaluation of polymer cure kinetics models

A particle swarm optimisation approach is used to determine the accuracy and experimental relevance of six disparate cure kinetics models. The cure processes of two commercially available thermosetting polymer materials utilised in microelectronics manufacturing applications have been studied using a differential scanning calorimetry system. Numerical models have been fitted to the experimental data using a particle swarm optimisation algorithm which enables the ultimate accuracy of each of the models to be determined. The particle swarm optimisation approach to model fitting proves to be relatively rapid and effective in determining the optimal coefficient set for the cure kinetics models. Results indicate that the singlestep autocatalytic model is able to represent the curing process more accurately than more complex model, with ultimate accuracy likely to be limited by inaccuracies in the processing of the experimental data.

Cure Kinetics and Sorption Characteristics of Neoprene-Based Rubber Ferrite Composites

Rubber ferrite composites were prepared by incorporating nickel ferrite in a neoprene rubber matrix. Kinetics of the cure reaction were determined from the rheometric torque values and found to follow first-order kinetics. Analysis of the swelling behavior of the rubber ferrite composites in toluene elucidates the mechanism of solvent penetration and sorption characteristics, and reveals the extent of the physical interaction of the ferrite particles with the neoprene rubber matrix. Mechanical properties of rubber ferrite composites were determined, which support the reinforcing nature of nickel ferrite to the neoprene rubber matrix. These results show that magnetic composites with the required processing safety can be prepared economically by incorporating higher amounts of nickel ferrite in the neoprene rubber matrix

Application of Nonisothermal Cure Kinetics to the Interaction of Poly(ethylene terephthalate) with Alkyd Resin Varnish

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Application of non-isothermal cure kinetics on the interaction of poly(ethylene terephthalate) - Alkyd resin paints

Samples of paint (P), reused PET (PET-R) and paint/PET-R mixtures (PPET-R) were evaluated using DSC to verify their physical-chemical properties and thermal behavior. Films from paints and PPET-R are visually similar. It was possible to establish that the maximum amount of PET-R that can be added to paint without significantly altering its filming properties is 2%. The cure process (80-203°C) was identified through DSC curves. The kinetic parameters, activation energy (E a) and Arrhenius parameters (A) for the samples containing 0.5 to 1% of PET-R, were calculated using the Flynn-Wall-Ozawa isoconversional method. It was observed that for greater amounts of PET-R added, there is a decrease in the E a values for the cure process. A Kinetic compensation effect (KCE), represented by the equation InA=-2.70+0.31E a was observed for all the samples. The most suitable kinetic model to describe this cure process is the autocatalytic Šesták-Berggreen, model applied to heterogeneous systems. © 2007 Springer Science+Business Media, LLC.

Phase separation, porous structure, and cure kinetics in aliphatic epoxy resin containing hyperbranched polyester

Thermosetting blends of an aliphatic epoxy resin and a hydroxyl-functionalized hyperbranched polymer (HBP), aliphatic hyperbranched polyester Boltorn H40, were prepared using 4,4'-diaminodiphenylmethane (DDM) as the curing agent. The phase behavior and morphology of the DDM-cured epoxy/HBP blends with HBP content up to 40 wt% were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). The cured epoxy/HBP blends are immiscible and exhibit two separate glass transitions, as revealed by DMA. The SEM observation showed that there exist two phases in the cured blends, which is an epoxy-rich phase and an HBP-rich phase, which is responsible for the two separate glass transitions. The phase morphology was observed to be dependent on the blend composition. For the blends with HBP content up to 10 wt%, discrete HBP domains are dispersed in the continuous cured epoxy matrix, whereas the cured blend with 40 wt% HBP exhibits a combined morphology of connected globules and bicominuous phase structure. Porous epoxy thermosets with continuous open structures on the order of 100-300 nm were formed after the HBP-rich phase was extracted with solvent from the cured blend with 40 wt% HBP. The DSC study showed that the curing rate is not obviously affected in the epoxy/HBP blends with HBP content up to 40 wt %. The activation energy values obtained are not remarkably changed in the blends; the addition of HBP to epoxy resin thus does not change the mechanism of cure reaction of epoxy resin with DDM. (c) 2006 Wiley Periodicals, Inc.

Dielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cure

Dielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics.

Effect of functionalized kaolinite on the curing kinetics of cycloaliphatic epoxy/anhydride system

Silane grafted kaolinite (KGS) was prepared through grinding kaolinite and then grafting with 3-aminopropyltriethoxysilane. The influence of KGS on the curing kinetics of cycloaliphatic epoxy resin was studied by non-isothermal differential scanning calorimetry at different heating rates. The reaction activation energy (Ea) was determined based on the Flynn–Wall–Ozawa method. The results of dynamic differential scanning calorimetry (DSC) kinetic analysis show that the surface hydroxyl groups of clay decreases the Ea from 70.6 kJ mol− 1 to 62.8 kJ mol− 1 and accelerates the curing reaction of the epoxy resin. The silane grafting reactions consume the surface hydroxyl groups of kaolinite and lead to a decrease in the catalytic efficiency of KGS in the curing of epoxy resin.

The effect of graphene oxide and its oxidized debris on the cure chemistry and interphase structure of epoxy nanocomposites

The influence of graphene oxide (GO) and its surface oxidized debris (OD) on the cure chemistry of an amine cured epoxy resin has been investigated by Fourier Transform Infrared Emission Spectroscopy (FT-IES) and Differential Scanning Calorimetry (DSC). Spectral analysis of IR radiation emitted at the cure temperature from thin films of diglycidyl ether of bisphenol A epoxy resin (DGEBA) and 4,4'-diaminodiphenylmethane (DDM) curing agent with and without GO allowed the cure kinetics of the interphase between the bulk resin and GO to be monitored in real time, by measuring both the consumption of primary (1°) amine and epoxy groups, formation of ether groups as well as computing the profiles for formation of secondary (2°) and tertiary (3°) amines. OD was isolated from as-produced GO (aGO) by a simple autoclave method to give OD-free autoclaved GO (acGO). It has been found that the presence of OD on the GO prevents active sites on GO surfaces fully catalysing and participating in the reaction of DGEBA with DDM, which results in slower reaction and a lower crosslink density of the three-dimensional networks in the aGO-resin interphase compared to the acGO-resin interphase. We also determined that OD itself promoted DGEBA homopolymerization. A DSC study further confirmed that the aGO nanocomposite exhibited lower Tg while acGO nanocomposite showed higher Tg compared to neat resin because of the difference in crosslink densities of the matrix around the different GOs.

Kinetics of copolyurethane network formation

Cure kinetics for the formation of copolyurethane networks of various compositions based on hydroxy-terminated polybutadiene(HTPB), poly(12-hydroxy stearic acid-co-TMP) ester polyol(PEP), and different isocyanates has been studied through viscosity build up during the cure reaction. The viscosity (N)-time (t) plots conform to the equation N = ae(bt), where a and b are empirical constants, dependent on the composition and the nature of the polyols and the isocyanates. The rate constants (b) for viscosity build up, evaluated from the slopes of dN/dt versus N plots at different temperatures, were found to vary significantly from 0.0073 to 0.25 min(-1); and the activation energies for gelation were found to be in the range 20 to 40 kJ mol(-1). The results have been interpreted in terms of the dependence of the rate constants on structural characteristics of the prepolymers. (C) 1997 John Wiley & Sons, Inc.

Composition and cure temperature: The influence on properties of final flexible PU cold cure foam parts

Foams are cellular structures, produced by gas bubbles formed during the polyurethane polymerization mixture. Flexible PU foams meet the following two criteria: have a limited resistance to an applied load, being both permeable to air and reversibly deformable. There are two main types of flexible foams, hot and cold cure foams differing in composition and processing temperatures. The hot cure foams are widely applied and represent the main composition of actual foams, while cold cure foams present several processing and property advantages, e.g, faster demoulding time, better humid aging properties and more versatility, as hardness variation with index changes are greater than with hot cure foams. The processing of cold cure foams also is attractive due to the low energy consumption (mould temperature from 30 degrees to 65 degrees C) comparatively to hot cure foams (mould temperature from 30 degrees to 250 degrees C). Another advantage is the high variety of soft materials for low temperature processing moulds. Cold cure foams are diphenylmethane diisocyanate (MDI) based while hot cure foams are toluene diisocyanate (TDI) based. This study is concerned with Viscoelastic flexible foams MDI based for medical applications. Differential Scanning Calorimetry (DSC) was used to characterize the cure kinetics and Dynamical Mechanical Analisys to collect mechanical data. The data obtained from these two experimental procedures were analyzed and associated to establish processing/properties/operation conditions relationships. These maps for the selection of optimized processing/properties/operation conditions are important to achieve better final part properties at lower costs and lead times.

Characterization of cure of carbon/epoxy prepreg used in aerospace field

Carbon/epoxy 8552 prepreg is a thermoplastic toughened high-performance epoxy being used in the manufacture of advanced army material. Understanding the cure behavior of a thermosetting system is essential in the development and optimization of composite fabrication processes. The cure kinetics and rheological behavior were evaluated using a differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and a rheometer. Values of the kinetic parameters were obtained from dynamic DSC scans using an nth order reaction model. Rheological measurements as a function of temperature and time were made for the prepreg system. The manufacturer's recommended cure cycle was evaluated and considered adequate to consolidated the studied system.

Microwave curing for high density package

Summary form only given. Currently the vast majority of adhesive materials in electronic products are bonded using convection heating or infra-red as well as UV-curing. These thermal processing steps can take several hours to perform, slowing throughput and contributing a significant portion of the cost of manufacturing. With the demand for lighter, faster, and smaller electronic devices, there is a need for innovative material processing techniques and control methodologies. The increasing demand for smaller and cheaper devices pose engineering challenges in designing a curing systems that minimize the time required between the curing of devices in a production line, allowing access to the components during curing for alignment and testing. Microwave radiation exhibits several favorable characteristics and over the past few years has attracted increased academic and industrial attention as an alternative solution to curing of flip-chip underfills, bumps, glob top and potting cure, structural bonding, die attach, wafer processing, opto-electronics assembly as well as RF-ID tag bonding. Microwave energy fundamentally accelerates the cure kinetics of polymer adhesives. It provides a route to focus heat into the polymer materials penetrating the substrates that typically remain transparent. Therefore microwave energy can be used to minimise the temperature increase in the surrounding materials. The short path between the energy source and the cured material ensures a rapid heating rate and an overall low thermal budget. In this keynote talk, we will review the principles of microwave curing of materials for high density packing. Emphasis will be placed on recent advances within ongoing research in the UK on the realization of "open-oven" cavities, tailored to address existing challenges. Open-ovens do not require positioning of the device into the cavity through a movable door, hence being more suitable for fully automated processing. Further potential advantages of op- - en-oven curing include the possibility for simultaneous fine placement and curing of the device into a larger assembly. These capabilities promise productivity gains by combining assembly, placement and bonding into a single processing step. Moreover, the proposed design allows for selective heating within a large substrate, which can be useful particularly when the latter includes parts sensitive to increased temperatures.

Effect of Pre-Heating Resin Composite and Light-Curing Units on Monomer Conversion

The purpose of this study was to evaluate the effect of pre-heating resin composite photo-cured with light-curing units (LCU) by FT-IR. Twenty specimens were made in a metallic mold (4 mm diameter x 2 mm thick) from composite resin-Tetric Ceram (R) (Ivoclar/Vivadent) at room temperature (25 degrees C) and pre heated to 37, 54, and 60 degrees C. The specimens were cured with halogen curing light (QTH) and light emitted by diodes (LED) during 40 s. Then, the specimens were pulverized, pressed with KBr and analyzed with FT-IR. The data were submitted to statistical analysis of variance and Kruskal-Wallis test. Study data showed no statistically significant difference to the degree of conversion for the different light curing units (QTH and LED) (p > 0.05). With the increase of temperature there was significant increase in the degree of conversion (p < 0.05). In this study were not found evidence that the light curing unit and temperature influenced the degree of conversion.

Structural carbon/epoxy prepregs properties comparison by thermal and rheological analyses

Two different carbon/epoxy prepreg materials were characterized and compared using thermal (DSC, TGA, and DMA) and rheological analyses. A prepreg system (carbon fiber preimpregnated with epoxy resin F584) that is currently used in the commercial airplane industry was compared with a prepreg system that is a prospective candidate for the same applications (carbon fiber prepreg/epoxy resin 8552). The differences in the curing kinetics mechanisms of both prepreg systems were identified through the DSC, TGA, DMA, and rheological analyses. Based on these thermal analysis techniques, it was verified that the curing of both epoxy resin systems follow a cure kinetic of n order. Even though their reaction heats were found to be slightly different, the kinetics of these systems were nevertheless very similar. The activation energies for both prepreg systems were determined by DSC analysis, using Arrhenius's method, and were found to be quite similar. DMA measurements of the cured prepregs demonstrated that they exhibited similar degrees of cure and different glass transition temperatures. Furthermore, the use of the rheological analysis revealed small differences in the gel temperatures of the two prepreg systems that were examined.