Wetting and Reactive Air Brazing of BSCF for Oxygen Separation Devices

The goals of this project are to develop a Reactive Air Brazing (RAB) alloy and process for joining Barium strontium cobalt ferrite (BSCF), and to develop a fundamental understanding of the wettability and microstructral development due to reaction kinetics in BSCF/Ag-MexOy systems.

Welding and brazing : a literature search /

"Metallurgy and Ceramics."

Welding, brazing, and thermal cutting.

Mode of access: Internet.

Welding, brazing, and thermal cutting.

Mode of access: Internet.

Welding and brazing : a bibliography of unclassified report literature.

Selected unclassified reports, supplementing those abstracted in TID-3059, which were available in TISE files on July 1, 1956, on welding and brazing of materials of interest to nuclear technology, such as Al, Be, Hf, Mo, Th, Ti, Zr, stainless steels, high-temperature alloys, pressure vessels, and heat exchangers, are annotated. Author, subject, and report number indexes are included. 127 references.

Welding and brazing : a bibliography of unclassified report literature /

Includes indexes.

Development of partially volatile brazing filler alloys for high-temperature application and resistance to oxidation.

Cover title.

Soft soldering; hard soldering and brazing; a practical treatise on tools, materials and operations; for the use of metal workers, plumbers, tinners, mechanics and manufacturers,

Mode of access: Internet.

Metal to nonmetallic brazing

"Research ... made possible ... under Signal Corps contract no. W36-039-sc-32037, Project no. 102B; Department of the Army project no. 3-99-10-022."

Saw filing and management of saws; a practical treatise on filing, gumming, swaging, hammering, and brazing band saws, etc.

Includes index.

Vacuum brazing of alumina ceramic to titanium for biomedical implants using pure gold as the filler metal

One of the many promising applications of metal/ceramic joining is in biomedical implantable devices. This work is focused on vacuum brazing of C.P titanium to 96% alumina ceramic using pure gold as the filler metal. A novel method of brazing is developed where resistance heating of C.P titanium is done inside a thermal evaporator using a Ta heating electrode. The design of electrode is optimized using Ansys resistive heating simulations. The materials chosen in this study are biocompatible and have prior history in implantable devices approved by FDA. This research is part of Boston Retinal implant project to make a biocompatible implantable device (www.bostonretina.org). ^ Pure gold braze has been used in the construction of single terminal feedthrough in low density hermetic packages utilizing a single platinum pin brazed to an alumina or sapphire ceramic donut (brazed to a titanium case or ferrule for many years in implantable pacemakers. Pure gold (99.99%) brazing of 96% alumina ceramic with CP titanium has been performed and evaluated in this dissertation. Brazing has been done by using electrical resistance heating. The 96% alumina ceramic disk was manufactured by high temperature cofired ceramic (HTCC) processing while the Ti ferrule and gold performs were purchased from outside. Hermetic joints having leak rate of the order of 1.6 × 10-8 atm-cc/ sec on a helium leak detector were measured. ^ Alumina ceramics made by HTCC processing were centreless grounded utilizing 800 grit diamond wheel to provide a smooth surface for sputtering of a thin film of Nb. Since pure alumina demonstrates no adhesion or wetting to gold, an adhesion layer must be used on the alumina surface. Niobium (Nb), Tantalum (Ta) and Tungsten (W) were chosen for evaluation since all are refractory (less dissolution into molten gold), all form stable oxides (necessary for adhesion to alumina) and all are readily thin film deposited as metals. Wetting studies are also performed to determine the wetting angle of pure gold to Ti, Ta, Nb and W substrates. Nano tribological scratch testing of thin film of Nb (which demonstrated the best wetting properties towards gold) on polished 96% alumina ceramic is performed to determine the adhesion strength of thin film to the substrate. The wetting studies also determined the thickness of the intermetallic compounds layers formed between Ti and gold, reaction microstructure and the dissolution of the metal into the molten gold.^

BONDING OF ALUMINA AND METAL USING BULK METALLIC GLASS FORMING ALLOY

Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

Bonding Of Alumina And Metal Using Bulk Metallic Glass Forming Alloy

Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

Avaliação da microestrutura, microdureza e resistência à corrosão de juntas soldadas de uma liga de Ni-Cr obtidas através de diferentes processos de soldagem

Este trabalho avaliou o comportamento eletroquímico do metal de base (MB) de uma liga a base de níquel-cromo em relação a juntas soldadas desta liga obtidas pelos processos de brasagem (BRA) e Tungsten Inert Gas (TIG), imersos em saliva artificial com pH 2,5 e 5,5. Foram também realizados ensaios de microdureza e caracterização microestrutural, por meio de microscopia óptica e eletrônica de varredura e análise química semi-quantitativa por EDS, nos grupos MB, TIG, BRA e no cordão de solda a laser (LAS). O MB apresentou uma matriz rica em níquel e cromo, distribuída em um arranjo dendrítico típico, apresentando inclusões metálicas de silício e titânio, além de porosidades. As soldas TIG e LAS revelaram uma microestrutura mais refinada que o MB, mostrando, entretanto, uma mesma composição química e distribuição de seus elementos. A solda BRA apresentou diferenças marcantes em sua microestrutura, composição química e distribuição de seus elementos em relação ao MB. Os dados de microdureza Vickers (HV), potencial de corrosão (Ecorr) e densidade de corrente de corrosão (jcorr) foram analisados com ANOVA e teste de Tukey (p<0,05). Para determinação da influência do pH quanto a resistência à corrosão dos grupos MB, TIG e BRA, empregou-se o teste t de Student (p<0,05). O MB apresentou menor média de microdureza (256,13 9,39 HV), seguido pelos grupos TIG (271,53 8,07 HV), LAS (303,73 13,93 HV) e BRA (551,99 37,73 HV). Em pH 2,5 as médias do Ecorr (mV) para o MB, TIG e BRA foram, respectivamente, -67,9 8,43, -52,78 16,74, e -284,33 19,04; e em pH 5,5, médias de -54,03 21,15, -62,08 20,16 e -278,8 28,96. Os valores médios de jcorr (A.cm-2) para o MB, TIG e BRA em pH 2,5 foram, respectivamente, 2,49 0,95, 5,584 1,64 e 27,45 4,9; e em pH 5,5, médias de 1,929 0,83, 4,267 1,51 e 54,2 11,96. Os grupos MB e TIG apresentaram boa resistência à corrosão, com maior módulo de impedância em relação ao grupo BRA. As diferenças no pH da saliva artificial não alteraram o comportamento corrosivo dos grupos MB e TIG. Entretanto, observou-se uma redução marcante na jcorr e no módulo de impedância nas soldas obtidas pelo processo de brasagem. O grupo BRA apresentou corrosão galvânica ao ser analisado formando par com o MB, mostrando uma jcorr de 5,3 A.cm-2. Entretanto, o mesmo não foi observado quando o MB foi associado à solda TIG, onde a jcorr foi cerca de 150 vezes menor. O grupo BRA, além de apresentar um comportamento eletroquímico muito diferente do MB, revelou diferenças marcantes quanto a composição química, aspecto microestrutural e microdureza. As juntas TIG e LAS mostraram semelhanças químicas e microestruturais em relação ao MB, sendo que na solda TIG esta semelhança foi ainda mais evidente. Além disto, a solda TIG apresentou um comportamento eletroquímico muito semelhante ao MB e, portanto, parecendo ser mais recomendável para soldar ligas odontológicas de níquel-cromo em relação aos demais processos de soldagem aqui avaliados.