Titanium dioxide photocatalytic degradation of aliphatic ethers and their primary oxidation products

Two studies were performed to obtain fundamental mechanistic information on the TiO2 catalyzed degradation of organic substrates irradiated at 350 nm in dilute aqueous solutions under oxygenated conditions: (a) The photodecomposition of methyl tert-butyl ether (MTBE) and its intermediate products from β-oxidation, 2-methoxy-2-methylpropanol and 2-methoxy-2-methylpropanol. (b) The photodecomposition of two haloethers, bis-(2-chloroethyl) ether, and bis-(2-chloroisopropyl) ether. Controls were carried out throughout the two studies in the absence of light, and without the semiconductor in order to evaluate the role of photolysis. ^ The syntheses of proposed intermediate products, 2-methoxy-2-methylpropanol, 2-methoxy-2-methylpropanal, 2-methoxy-2-methylpropanoic acid, 2-chloroethyl formate, and 1-chloro-2-propyl acetate, were performed. The formation of these products in the titanium dioxide photocatalytic oxidation of the substrates of interest was also confirmed. TiO2 photocatalysis is a very effective method for the mineralization of aliphatic ethers and their primary oxidation products. ^

Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)

Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.